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    • 73. 发明申请
    • Plasma processing apparatus
    • 等离子体处理装置
    • US20060289116A1
    • 2006-12-28
    • US11488059
    • 2006-07-18
    • Tadahiro OhmiMasaki HirayamaShigetoshi SugawaTetsuya Goto
    • Tadahiro OhmiMasaki HirayamaShigetoshi SugawaTetsuya Goto
    • C23F1/00H01L21/306
    • H01J37/32238H01J37/32192H01J37/32357H01J37/3244
    • A plasma processing apparatus comprises a processing vessel defined by an outer wall and having a stage for holding a substrate to be processed, an evacuation system coupled to the processing vessel, a plasma gas supply part for supplying plasma gas to an interior of the processing vessel, a microwave antenna provided on the processing vessel in correspondence to the substrate to be processed, and a process gas supply part provided between the substrate to be processed on the stage and the plasma gas supply part so as to face the substrate to be processed on the stage, wherein the process gas supply part comprises a plurality of first apertures for passing through plasma formed in the interior of the processing vessel, a process gas passage capable of connecting to a process gas source, a plurality of second apertures in communication with the process gas passage and a diffusion part provided opposite to the second aperture for diffusing process gas released from the second aperture.
    • 等离子体处理装置包括由外壁限定的处理容器,具有用于保持要处理的基板的台,连接到处理容器的抽空系统,用于将等离子体气体供应到处理容器的内部的等离子体气体供应部 设置在处理容器上的与要处理的基板相对应的微波天线,以及处理气体供给部,其设置在台面上的待处理基板与等离子体气体供给部之间,以与待处理基板相对, 其中处理气体供应部分包括用于通过形成在处理容器内部的等离子体的多个第一孔,能够连接到处理气体源的处理气体通道,与第二孔连通的多个第二孔 处理气体通道和与第二孔相对设置的用于扩散从第二孔释放的处理气体的扩散部分。
    • 74. 发明授权
    • Plasma processing device
    • 等离子处理装置
    • US07115184B2
    • 2006-10-03
    • US10276673
    • 2002-03-28
    • Tadahiro OhmiMasaki HirayamaShigetoshi SugawaTetsuya Goto
    • Tadahiro OhmiMasaki HirayamaShigetoshi SugawaTetsuya Goto
    • H01L21/00C23C16/00
    • H01J37/32238H01J37/32192H01J37/32357H01J37/3244
    • A plasma processing apparatus includes a processing vessel, a means for holding a substrate to be processed, an evacuation system coupled to the processing vessel, a means for supplying plasma gas to an interior of the processing vessel, a microwave antenna provided on the processing vessel, and a process gas supply part comprised of two components. The first component includes a plurality of first apertures for passing through plasma formed in interior of the processing vessel, a process gas passage, and a plurality of second apertures in communication with the process gas passage. The second component includes a plurality of third apertures axially aligned with the first apertures in the first component and diffusion surfaces upon recessed areas of the second component, located opposite to the second apertures in the first component.
    • 等离子体处理装置包括处理容器,用于保持要处理的基板的装置,耦合到处理容器的抽空系统,用于向处理容器的内部供应等离子体气体的装置,设置在处理容器上的微波天线 ,以及由两个部件组成的工艺气体供给部。 第一部件包括用于穿过形成在处理容器内部的等离子体的多个第一孔,处理气体通道和与处理气体通道连通的多个第二孔。 第二部件包括与第一部件中的第一孔轴向对齐的多个第三孔和位于第二部件的与第一部件中的第二孔相对的凹陷区域上的扩散表面。