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    • 71. 发明授权
    • Random number generating device
    • 随机数生成装置
    • US08039890B2
    • 2011-10-18
    • US11743265
    • 2007-05-02
    • Mari MatsumotoRyuji OhbaShinobu Fujita
    • Mari MatsumotoRyuji OhbaShinobu Fujita
    • H01L29/792
    • G06F7/588H03B29/00
    • A random number generating device includes a semiconductor device including a source region, a drain region, a channel region provided between the source region and the drain region, and an insulating portion provided on the channel region, the insulating portion including a trap insulating film having traps based on dangling bonds and expressed by Six(SiO2)y(Si3N4)1-yMz (M is an element other than Si, O, and N, x≧0, 1≧y≧0, z≧0, the case where x=0 and y=1 and z=0 is excluded), conductivity of the channel region varying randomly depending on the amount of charge caught in the traps, and a random number generating unit connected to the semiconductor device and generating random numbers based on a random variation in the conductivity of the channel region.
    • 随机数发生装置包括:半导体器件,包括源区域,漏极区域,设置在源极区域和漏极区域之间的沟道区域;以及绝缘部分,设置在沟道区域上,绝缘部分包括捕获绝缘膜, 基于悬挂键并由六(SiO 2)y(Si 3 N 4)1-yMz表示的陷阱(M是除Si,O和N之外的元素,x≥0,1≥y≥0,z≥0, x = 0且y = 1,z = 0),根据陷阱中捕获的电荷量随机地变化的信道区域的电导率和连接到半导体器件的随机数生成单元,并基于 通道区域的电导率随机变化。
    • 72. 发明申请
    • CMOS INTEGRATED CIRCUITS WITH BONDED LAYERS CONTAINING FUNCTIONAL ELECTRONIC DEVICES
    • CMOS集成电路与包含功能电子设备的绑定层
    • US20090302394A1
    • 2009-12-10
    • US12237152
    • 2008-09-24
    • Shinobu Fujita
    • Shinobu Fujita
    • H01L27/06H01L21/8238
    • H01L27/0688H01L27/101
    • A complementary metal oxide semiconductor (CMOS) circuit having integrated functional devices such as nanowires, carbon nanotubes, magnetic memory cells, phase change memory cells, ferroelectric memory cells or the like. The functional devices are integrated with the CMOS circuit. The functional devices are bonded (e.g. by direct bonding, anodic bonding, or diffusion bonding) to a top surface of the CMOS circuit. The functional devices are fabricated and processed on a carrier wafer, and an attachment layer (e.g. SiO2) is deposited over the functional devices. Then, the CMOS circuit and attachment layer are bonded. The carrier wafer is removed (e.g. by etching). The functional devices remain attached to the CMOS circuit via the attachment layer. Apertures are etched through the attachment layer to provide a path for electrical connections between the CMOS circuit and the functional devices.
    • 具有纳米线,碳纳米管,磁存储单元,相变存储单元,铁电存储单元等集成功能元件的互补金属氧化物半导体(CMOS)电路。 功能器件与CMOS电路集成。 功能器件通过例如直接接合,阳极结合或扩散接合来结合到CMOS电路的顶表面。 功能器件在载体晶片上制造和处理,并且在功能器件上沉积附着层(例如SiO 2)。 然后,连接CMOS电路和附着层。 移除载体晶片(例如通过蚀刻)。 功能器件通过附着层保持连接到CMOS电路。 孔径通过附着层蚀刻,以提供用于CMOS电路和功能器件之间的电连接的路径。
    • 73. 发明授权
    • Nonvolatile memory for logic circuits
    • 用于逻辑电路的非易失性存储器
    • US07336525B2
    • 2008-02-26
    • US11061951
    • 2005-02-17
    • Shinobu FujitaThomas H. Lee
    • Shinobu FujitaThomas H. Lee
    • G11C11/00
    • G11C11/005G11C5/02G11C14/0081
    • A memory circuit that retains stored data upon power down includes a volatile data storage circuit; and at least one nonvolatile memory coupled within the volatile data storage circuit, wherein the at least one nonvolatile memory includes a high resistive state and a low resistive state. The volatile data storage circuit can include cross-coupled inverters, cross-coupled NAND gates, or another volatile data storage circuit. The nonvolatile memories can include a spin-injection magnetic tunnel junction memory, a magnetic tunnel junction memory, a metal insulator phase change memory, an organic memory, or some other memory with two resistive states.
    • 在断电时保存存储的数据的存储电路包括易失性数据存储电路; 以及耦合在所述易失性数据存储电路内的至少一个非易失性存储器,其中所述至少一个非易失性存储器包括高电阻状态和低电阻状态。 易失性数据存储电路可以包括交叉耦合反相器,交叉耦合NAND门或另一易失性数据存储电路。 非易失性存储器可以包括自旋注入磁隧道结存储器,磁性隧道结存储器,金属绝缘体相变存储器,有机存储器或具有两个电阻状态的一些其它存储器。
    • 75. 发明授权
    • Semiconductor element having charge accumulating layer under gate electrode and using single electron phenomenon
    • 半导体元件在栅电极下方具有电荷累积层,并采用单电子现象
    • US06208000B1
    • 2001-03-27
    • US09304343
    • 1999-05-04
    • Tetsufumi TanamotoShinobu FujitaKoichiro Inomata
    • Tetsufumi TanamotoShinobu FujitaKoichiro Inomata
    • H01L2976
    • B82Y10/00H01L29/42332H01L29/7888
    • A semiconductor device according to the invention is constructed as below. A charge accumulating layer which contains a magnetic substance is formed directly on a semiconductor substrate, and a gate insulating film is formed on the charge accumulating layer. Further, a gate electrode is formed on the gate insulating film, and source and drain regions formed in surface portions of the semiconductor substrate such that the gate electrode is interposed therebetween. Another semiconductor device according to the invention is constructed as below. A first gate insulating film formed on a semiconductor substrate, and a charge accumulating layer which contains a magnetic substance is formed on the first gate insulating film. Further, a second gate insulating film is formed on the charge accumulating layer, and a gate electrode is formed on the second gate insulating film. Source and drain regions formed in surface portions of the semiconductor substrate such that the gate electrode is interposed therebetween.
    • 根据本发明的半导体器件如下构造。 在半导体基板上直接形成含有磁性物质的电荷蓄积层,在电荷蓄积层上形成栅极绝缘膜。 此外,在栅极绝缘膜上形成栅电极,形成在半导体基板的表面部分中的栅极电极和漏极区域,使得栅电极介于其间。 根据本发明的另一半导体器件如下构造。 形成在半导体衬底上的第一栅极绝缘膜和含有磁性物质的电荷累积层形成在第一栅极绝缘膜上。 此外,在电荷累积层上形成第二栅极绝缘膜,在第二栅极绝缘膜上形成栅电极。 源极和漏极区域形成在半导体衬底的表面部分中,使得栅电极介于其间。
    • 76. 发明授权
    • Light emitting semiconductor device using nanocrystals
    • 使用纳米晶体的发光半导体器件
    • US6157047A
    • 2000-12-05
    • US143106
    • 1998-08-28
    • Shinobu FujitaAtsushi Kurobe
    • Shinobu FujitaAtsushi Kurobe
    • H01L29/06H01L27/12H01L27/15H01L29/66H01L33/04H01L33/16H01L33/34H01L33/44H01L29/00
    • H01L33/34H01L33/18H01L27/15
    • A device structure provides improved efficiency of light emission from a light emitting element made of silicon while rendering such emission electrically controllable. Silicon in the light emitting element comprises fine microcrystals, which are miniaturized sufficiently to cause a quantum size effect. The microcrystals may be 10 nanometers (nm) or less in grain size. A dielectric film of 5 nm thick or less is formed containing therein such microcrystals. The microcrystal structure section is disposed between p- and n-type semiconductor layers. These layers are brought into electrical contact with the microcrystal structure only, while causing the remaining portions to be electrically insulative by a dielectric film or the like. Elementary particles of the opposite polarities, e.g. electrons and holes, are injected by tunnel effect into the microcrystals resulting in emission of light rays with increased efficiency.
    • 器件结构提供了由硅制成的发光元件提供的发光效率,同时使这种发射电可控制。 发光元件中的硅包括细小的微晶,其小型化以产生量子尺寸效应。 微晶体的粒径可以为10纳米(nm)以下。 形成5nm以下的电介质膜,其中含有这样的微晶。 微晶结构部分设置在p型和n型半导体层之间。 这些层仅与微结晶结构电接触,同时通过介电膜等使剩余部分电绝缘。 具有相反极性的基本粒子,例如 电子和空穴通过隧道效应注入到微晶中,导致光线的发射效率提高。