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    • 78. 发明授权
    • Method of fabricating a semiconductor laser
    • 制造半导体激光器的方法
    • US5268328A
    • 1993-12-07
    • US991223
    • 1992-12-16
    • Yoshihiro MoriMasaya MannohSatoshi KamiyamaKiyoshi Ohnaka
    • Yoshihiro MoriMasaya MannohSatoshi KamiyamaKiyoshi Ohnaka
    • H01S5/22H01S5/223H01S5/323H01L21/20
    • H01S5/2231H01S5/221H01S5/32325
    • A method of fabricating a semiconductor laser includes successively forming on a semiconductor substrate by crystal growth an active waveguide comprised of a compound semiconductor comprising a Group V element phosphorus, a thin-film layer comprised of a first-conductivity type compound semiconductor comprising a Group V element arsenic and a current blocking layer comprised of a second-conductivity type compound semiconductor comprising a Group V element arsenic. A mask is formed for selectively etching the current blocking layer in the form of a stripe. A buffer-etching step is formed on both the current blocking layer and the mask to expose a surface of the current blocking layer and the thin-film layer, the surface including a Group V element arsenic. An outer cladding layer comprising a first-conductivity type compound semiconductor having a Group V element arsenic is formed on the current blocking layer and the thin-film layer in an atmosphere having a Group V element arsenic. The method has characteristic features including carrying out the crystal growth only twice, minimizing the movement of impurities in crystals, regrowing the interface with a very little defect and forming a structure wherein the outer cladding layer has a smaller width at its portion near to the active waveguide.
    • 制造半导体激光器的方法包括:通过晶体生长在半导体衬底上依次形成由包括V族元素磷的化合物半导体构成的有源波导,由包含第V族元素的第一导电型化合物半导体构成的薄膜层 元素砷和由包含第V族元素砷的第二导电型化合物半导体构成的电流阻挡层。 形成掩模以选择性地蚀刻呈条状形式的电流阻挡层。 在电流阻挡层和掩模上形成缓冲蚀刻步骤,以暴露电流阻挡层和薄膜层的表面,该表面包括第V族元素砷。 在具有V族元素砷的气氛中,在电流阻挡层和薄膜层上形成包含具有V族元素砷的第一导电型化合物半导体的外包层。 该方法具有特征,包括仅进行晶体生长两次,使晶体中的杂质的移动最小化,再次产生具有很小缺陷的界面,并且形成其中外包层在其活性附近部分具有较小宽度的结构 波导。