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    • 73. 发明授权
    • Electrical measurement of sidewall angle
    • 侧壁角度的电气测量
    • US5308740A
    • 1994-05-03
    • US947242
    • 1992-09-18
    • Michael K. TempletonSubhash Gupta
    • Michael K. TempletonSubhash Gupta
    • G03F7/26G03C5/00B44C1/22
    • G03F7/26
    • A method for measuring the sidewall angle of patterned photoresist (16), as well as wall angles of other materials, is provided. The method comprises forming two copies of the patterned photoresist feature for which the sidewall measurement is to be obtained on a conducting substrate (14). The first copy is processed via conventional techniques for linewidth measurement, which consists of a pattern transfer etch of the first copy into the underlying conductive substrate, followed by electrical measurement of the conductor linewidth to yield linewidth 1 (LW1). The second copy is processed such that there is a shape altering etch prior to the pattern transfer etch. A linewidth 2 (LW2) is obtained. The angle is then extracted from the two linewidth measurements.
    • 提供了用于测量图案化光致抗蚀剂(16)的侧壁角以及其它材料的壁角的方法。 该方法包括在导电衬底(14)上形成要获得侧壁测量的图案化光致抗蚀剂特征的两个拷贝。 通过用于线宽测量的常规技术来处理第一个拷贝,该技术包括将第一拷贝的图案转移蚀刻到下面的导电衬底中,随后电导体线宽的线性测量以产生线宽1(LW1)。 处理第二拷贝使得在图案转移蚀刻之前存在改变蚀刻的形状。 得到线宽2(LW2)。 然后从两个线宽测量中提取角度。
    • 76. 发明授权
    • Method for improved control of lines adjacent to a select gate using a mask assist feature
    • 一种使用掩模辅助功能改进与选择门相邻的线的控制的方法
    • US06495435B2
    • 2002-12-17
    • US09788246
    • 2001-02-15
    • Michael K. TempletonHao FangMaria C. Chan
    • Michael K. TempletonHao FangMaria C. Chan
    • H01L2120
    • H01L27/11521H01L21/76838H01L27/105H01L27/1052H01L27/115
    • A method and system for providing a plurality of lines in a semiconductor memory device is disclosed. The method and system include providing a semiconductor substrate, providing a plurality of lines and providing an adjacent feature. The plurality of lines includes an adjacent line adjacent to the adjacent feature. The each of the plurality of lines has a line width that is substantially the same for each of the plurality of lines. The plurality of lines is preferably formed utilizing a mask to print a physical mask for the plurality of lines and the adjacent feature. The mask includes a mask assist feature between at least a first polygon for the adjacent line and at least a second polygon for the adjacent feature. The mask assist feature has a size that is sufficiently large to affect the width of the adjacent line and that is sufficiently small to prevent a corresponding feature from being printed on the physical mask. The method and system also preferably include removing a second portion of the layer of material exposed by the pattern of the physical mask to form the plurality of lines.
    • 公开了一种用于在半导体存储器件中提供多条线的方法和系统。 该方法和系统包括提供半导体衬底,提供多条线并提供相邻特征。 多条线包括与相邻特征相邻的相邻线。 多条线中的每条线具有对于多根线中的每条线基本相同的线宽度。 优选地,利用掩模形成多条线以打印多条线和相邻特征的物理掩模。 掩模包括用于相邻行的至少第一多边形和用于相邻特征的至少第二多边形之间的掩模辅助特征。 掩模辅助特征具有足够大的尺寸以影响相邻线的宽度,并且足够小以防止相应的特征被印刷在物理掩模上。 该方法和系统还优选地包括去除由物理掩模的图案暴露的材料层的第二部分以形成多条线。
    • 77. 发明授权
    • Method and system for providing contacts with greater tolerance for misalignment in a flash memory
    • 用于提供触点的方法和系统,其具有对于闪存中未对准的更大容限
    • US06445051B1
    • 2002-09-03
    • US09563797
    • 2000-05-02
    • Mark S. ChangHao FangKing Wai Kelwin KoJohn Jianshi WangMichael K. TempletonLu YouAngela T. Hui
    • Mark S. ChangHao FangKing Wai Kelwin KoJohn Jianshi WangMichael K. TempletonLu YouAngela T. Hui
    • H01L2976
    • H01L21/76897H01L21/28273
    • A method and system for providing a plurality of contacts in a flash memory device is disclosed. The flash memory device includes a plurality of gate stacks and a plurality of field insulating regions adjacent to a portion of the plurality of gate stacks. The method and system include providing an etch stop layer covering the plurality of field insulating regions. The etch stop layer has an etch selectivity different from a field insulating region etch selectivity of the plurality of field insulating regions. The method and system also include providing an insulating layer covering the plurality of gate stacks, the plurality of field insulating regions and the etch stop layer. The method and system further include etching the insulating layer to provide a plurality of contact holes. The insulating layer etching step uses the etch stop layer to ensure that the insulating etching step does not etch through the plurality of field insulating regions. The method and system also include filling the plurality of contact holes with a conductor.
    • 公开了一种用于在闪速存储器件中提供多个触点的方法和系统。 闪存器件包括多个栅极堆叠和与多个栅极堆叠的一部分相邻的多个场绝缘区域。 该方法和系统包括提供覆盖多个场绝缘区域的蚀刻停止层。 蚀刻停止层具有与多个场绝缘区域的场绝缘区蚀刻选择性不同的蚀刻选择性。 该方法和系统还包括提供覆盖多个栅极叠层,多个场绝缘区域和蚀刻停止层的绝缘层。 该方法和系统还包括蚀刻绝缘层以提供多个接触孔。 绝缘层蚀刻步骤使用蚀刻停止层来确保绝缘蚀刻步骤​​不会蚀刻穿过多个场绝缘区域。 该方法和系统还包括用导体填充多个接触孔。
    • 78. 发明授权
    • Oxygen implant self-aligned, floating gate and isolation structure
    • 氧气注入自对准,浮动门和隔离结构
    • US06316804B1
    • 2001-11-13
    • US09569721
    • 2000-05-11
    • Michael K. TempletonKathleen R. Early
    • Michael K. TempletonKathleen R. Early
    • H01L29788
    • H01L27/11521
    • A semiconductor apparatus and fabrication method for forming oxide isolation regions in a semiconductor substrate for use in forming self-aligned, floating gate MOS structures or other semiconductor devices. The method includes providing a semiconductor substrate member prefabricated having a barrier oxide layer, a polysilicon layer and a plurality of spaced apart silicon nitride layer portions fabricated on the polysilicon layer. The nitride layer portions delineate regions for forming the self-aligned floating gate MOS structures, as well as delineating portions of the silicon dioxide layer and portions of said polysilicon layer that are unprotected by the plurality of silicon nitride layer portions. The method further includes the step of implanting oxygen O2 ions into regions of the substrate, including those unprotected portions of the silicon dioxide layer and portions of the polysilicon layer to form the oxide isolation regions. After removing the silicon nitride layer portions, and exposing the polysilicon layer portions, the implanted structure is annealed and made ready for forming the self-aligned floating gate MOS structures, or other semiconductor structure on the conductive material pads. The floating gates may be formed having a minimal width with respect to an underlying active region.
    • 一种半导体装置和制造方法,用于在用于形成自对准的浮置栅极MOS结构或其它半导体器件的半导体衬底中形成氧化物隔离区。 该方法包括提供预制的半导体衬底构件,其具有制造在多晶硅层上的阻挡氧化物层,多晶硅层和多个间隔开的氮化硅层部分。 氮化物层部分描绘用于形成自对准浮置栅极MOS结构的区域,以及描绘未被多个氮化硅层部分保护的二氧化硅层的部分和所述多晶硅层的部分。 该方法还包括将氧O 2离子注入到衬底的区域中的步骤,包括二氧化硅层的那些未受保护的部分和多晶硅层的部分以形成氧化物隔离区。 在去除氮化硅层部分并暴露多晶硅层部分之后,将注入结构退火并准备好在导电材料焊盘上形成自对准浮栅MOS结构或其它半导体结构。 浮动栅极可以形成为相对于下面的有源区域具有最小宽度。
    • 80. 发明授权
    • Oxygen implant self-aligned, floating gate and isolation structure
    • 氧气注入自对准,浮动门和隔离结构
    • US6066530A
    • 2000-05-23
    • US57992
    • 1998-04-09
    • Michael K. TempletonKathleen R. Early
    • Michael K. TempletonKathleen R. Early
    • H01L21/8247H01L21/336
    • H01L27/11521
    • A semiconductor apparatus and fabrication method for forming oxide isolation regions in a semiconductor substrate for use in forming self-aligned, floating gate MOS structures or other semiconductor devices. The method includes providing a semiconductor substrate member prefabricated having a barrier oxide layer, a polysilicon layer and a plurality of spaced apart silicon nitride layer portions fabricated on the polysilicon layer. The nitride layer portions delineate regions for forming the self-aligned floating gate MOS structures, as well as delineating portions of the silicon dioxide layer and portions of said polysilicon layer that are unprotected by the plurality of silicon nitride layer portions. The method further includes the step of implanting oxygen O.sub.2 ions into regions of the substrate, including those unprotected portions of the silicon dioxide layer and portions of the polysilicon layer to form the oxide isolation regions. After removing the silicon nitride layer portions, and exposing the polysilicon layer portions, the implanted structure is annealed and made ready for forming the self-aligned floating gate MOS structures, or other semiconductor structure on the conductive material pads. The floating gates may be formed having a minimal width with respect to an underlying active region.
    • 一种半导体装置和制造方法,用于在用于形成自对准的浮置栅极MOS结构或其它半导体器件的半导体衬底中形成氧化物隔离区。 该方法包括提供预制的半导体衬底构件,其具有制造在多晶硅层上的阻挡氧化物层,多晶硅层和多个间隔开的氮化硅层部分。 氮化物层部分描绘用于形成自对准浮置栅极MOS结构的区域,以及描绘未被多个氮化硅层部分保护的二氧化硅层的部分和所述多晶硅层的部分。 该方法还包括将氧O 2离子注入到衬底的区域中的步骤,包括二氧化硅层的那些未受保护的部分和多晶硅层的部分以形成氧化物隔离区。 在去除氮化硅层部分并暴露多晶硅层部分之后,将注入结构退火并准备好在导电材料焊盘上形成自对准浮栅MOS结构或其它半导体结构。 浮动栅极可以形成为相对于下面的有源区域具有最小宽度。