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    • 74. 发明授权
    • Light-emitting semiconductor component comprising a protective diode
    • 包含保护二极管的发光半导体元件
    • US07693201B2
    • 2010-04-06
    • US10580969
    • 2004-10-26
    • Tony AlbrechtPeter BrickMarc PhilippensGlenn-Yves Plaine
    • Tony AlbrechtPeter BrickMarc PhilippensGlenn-Yves Plaine
    • H01S5/183H01S5/125
    • H01S5/06825H01L27/15H01S5/0261H01S5/042H01S5/18311H01S5/18313H01S5/40
    • A light-emitting semiconductor component which contains a sequence of semiconductor layers (2) with an area of p-doped semiconductor layers (4) and n-doped semiconductor layers (3) between which a first pn junction (5a, 5b) is formed. The pn junction (5a, 5b) is subdivided into a light-emitting section (7) and a protective-diode section (8) in a lateral direction by means of an insulating section (6). An n-doped layer (9), which forms a second pn junction (10) which acts as a protective diode along with the p-doped area (4), is applied to the p-doped area (4) in the area of the protective-diode section (8), the first pn junction (5b) in the protective-diode section (8) having a larger area than the first pn junction (5a) in the light-emitting section (7). The protective-diode section (8) protects the light-emitting semiconductor component from voltage pulses due to electrostatic discharges (ESD).
    • 一种发光半导体元件,其包含具有p掺杂半导体层(4)的面积的半导体层(2)和n掺杂半导体层(3)的序列,在其间形成有第一pn结(5a,5b) 。 通过绝缘部分(6)将pn结(5a,5b)沿横向细分成发光部分(7)和保护二极管部分(8)。 形成与p掺杂区域(4)一起用作保护二极管的第二pn结(10)的n掺杂层(9)在p掺杂区域(4)的区域中被施加到p掺杂区域 保护二极管部分(8)中,保护二极管部分(8)中的第一pn结(5b)的面积大于发光部分(7)中的第一pn结(5a)的面积。 保护二极管部分(8)保护发光半导体部件免受静电放电(ESD)的电压脉冲的影响。
    • 76. 发明授权
    • Semiconductor laser with reduced heat loss
    • 半导体激光器具有减少的热损失
    • US07573927B2
    • 2009-08-11
    • US12080378
    • 2008-04-01
    • Peter Brick
    • Peter Brick
    • H01S5/00
    • B82Y20/00H01S5/024H01S5/02461H01S5/041H01S5/105H01S5/1078H01S5/141H01S5/18319H01S5/18352H01S5/34H01S5/343
    • Disclosed is a semiconductor laser. The semiconductor laser includes a semiconductor chip that includes an active layer and emits radiation in a main radiating direction. The active layer is structured in a direction perpendicular to the main radiating direction to reduce heating of the semiconductor chip by spontaneously emitted radiation. The active layer includes a region provided for optical pumping by a pump radiation source. The optically pumped region of the active layer is surrounded by a region having, in a direction perpendicular to the main radiating direction, a periodic structure that forms a photonic crystal in which radiation having the emission wavelength is not capable of propagation.
    • 公开了一种半导体激光器。 半导体激光器包括包含有源层并沿主辐射方向发射辐射的半导体芯片。 有源层在垂直于主辐射方向的方向上构造,以通过自发发射的辐射来减少半导体芯片的加热。 有源层包括用于通过泵浦辐射源进行光泵浦的区域。 有源层的光泵浦区域被沿着与主辐射方向垂直的方向的区域包围,该区域形成具有发射波长的辐射不能传播的光子晶体的周期性结构。
    • 77. 发明授权
    • Method for producing a radiation-emitting-and-receiving semiconductor chip
    • 辐射发射和接收半导体芯片的制造方法
    • US07524687B2
    • 2009-04-28
    • US12072365
    • 2008-02-26
    • Glenn-Yves PlaineTony AlbrechtPeter BrickMarc Philippens
    • Glenn-Yves PlaineTony AlbrechtPeter BrickMarc Philippens
    • H01L33/00
    • H01L27/15H01L31/173
    • A method for producing an integrated semiconductor component comprising a first semiconductor layer construction for emitting radiation and a second semiconductor layer construction for receiving radiation, wherein a substrate is first provided and a first semiconductor layer sequence containing a radiation-generating region is deposited epitaxially on the substrate. A second semiconductor layer sequence containing a radiation-absorbing region is subsequently deposited epitaxially on the first semiconductor layer sequence. The second semiconductor layer sequence is then patterned in order to uncover a first location and a second location. A first semiconductor layer construction is electrically insulated from a second semiconductor layer construction. Finally, a first contact layer is applied to a free surface of the substrate and a second contact layer is applied at least to the first and second locations for contact-connection.
    • 一种用于制造集成半导体部件的方法,包括用于发射辐射的第一半导体层结构和用于接收辐射的第二半导体层结构,其中首先提供衬底,并且包含辐射产生区的第一半导体层序列外延地沉积在 基质。 随后在第一半导体层序列上外延沉积包含辐射吸收区的第二半导体层序列。 然后将第二半导体层序列图案化以便露出第一位置和第二位置。 第一半导体层结构与第二半导体层结构电绝缘。 最后,将第一接触层施加到衬底的自由表面,并且至少将第二接触层施加到第一和第二位置用于接触连接。
    • 79. 发明申请
    • Light-Emitting Semiconductor Component Comprising a Protective Diode
    • 包含保护二极管的发光半导体元件
    • US20070258500A1
    • 2007-11-08
    • US10580969
    • 2004-10-26
    • Tony AlbrechtPeter BrickMarc PhillippensGlenn-Yves Plaine
    • Tony AlbrechtPeter BrickMarc PhillippensGlenn-Yves Plaine
    • H01S5/183H01S5/125
    • H01S5/06825H01L27/15H01S5/0261H01S5/042H01S5/18311H01S5/18313H01S5/40
    • A light-emitting semiconductor component which contains a sequence of semiconductor layers (2) with an area of p-doped semiconductor layers (4) and n-doped semiconductor layers (3) between which a first pn junction (5a, 5b) is formed. The pn junction (5a, 5b) is subdivided into a light-emitting section (7) and a protective-diode section (8) in a lateral direction by means of an insulating section (6). An n-doped layer (9), which forms a second pn junction (10) which acts as a protective diode along with the p-doped area (4), is applied to the p-doped area (4) in the area of the protective-diode section (8), the first pn junction (5b) in the protective-diode section (8) having a larger area than the first pn junction (5a) in the light-emitting section (7). The protective-diode section (8) protects the light-emitting semiconductor component from voltage pulses due to electrostatic discharges (ESD).
    • 一种发光半导体部件,其包含具有p掺杂半导体层(4)的面积和n掺杂半导体层(3)的半导体层(2)的序列,在其间形成有第一pn结(5a,5b) 形成了。 pn结(5a,5b)通过绝缘部分(6)在横向被细分成发光部分(7)和保护二极管部分(8)。 形成与p掺杂区域(4)一起用作保护二极管的第二pn结(10)的n掺杂层(9)在p掺杂区域(4)的区域中被施加到p掺杂区域 保护二极管部分(8)中,保护二极管部分(8)中的第一pn结(5b)具有比发光部分(7)中的第一pn结(5a)更大的面积。 保护二极管部分(8)保护发光半导体部件免受静电放电(ESD)的电压脉冲的影响。