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    • 2. 发明申请
    • Method for producing a radiation-emitting-and-receiving semiconductor chip
    • 辐射发射和接收半导体芯片的制造方法
    • US20080153189A1
    • 2008-06-26
    • US12072365
    • 2008-02-26
    • Glenn-Yves PlaineTony AlbrechtPeter BrickMarc Philippens
    • Glenn-Yves PlaineTony AlbrechtPeter BrickMarc Philippens
    • H01L33/00
    • H01L27/15H01L31/173
    • A method for producing an integrated semiconductor component comprising a first semiconductor layer construction for emitting radiation and a second semiconductor layer construction for receiving radiation, wherein a substrate is first provided and a first semiconductor layer sequence containing a radiation-generating region is deposited epitaxially on the substrate. A second semiconductor layer sequence containing a radiation-absorbing region is subsequently deposited epitaxially on the first semiconductor layer sequence. The second semiconductor layer sequence is then patterned in order to uncover a first location and a second location. A first semiconductor layer construction is electrically insulated from a second semiconductor layer construction. Finally, a first contact layer is applied to a free surface of the substrate and a second contact layer is applied at least to the first and second locations for contact-connection.
    • 一种用于制造集成半导体部件的方法,包括用于发射辐射的第一半导体层结构和用于接收辐射的第二半导体层结构,其中首先提供衬底,并且包含辐射产生区的第一半导体层序列外延地沉积在 基质。 随后在第一半导体层序列上外延沉积包含辐射吸收区的第二半导体层序列。 然后将第二半导体层序列图案化以便露出第一位置和第二位置。 第一半导体层结构与第二半导体层结构电绝缘。 最后,将第一接触层施加到衬底的自由表面,并且至少将第二接触层施加到第一和第二位置用于接触连接。
    • 4. 发明申请
    • Radiation-emitting-and-receiving semiconductor chip and method for producing such a semiconductor chip
    • 辐射发射和接收半导体芯片及其制造方法
    • US20050110026A1
    • 2005-05-26
    • US10951525
    • 2004-09-28
    • Glenn-Yves PlaineTony AlbrechtPeter BrickMarc Philippens
    • Glenn-Yves PlaineTony AlbrechtPeter BrickMarc Philippens
    • H01L31/12H01L27/15H01L31/173
    • H01L27/15H01L31/173
    • A radiation-emitting-and-receiving semiconductor component has at least a first semiconductor layer construction (1) for emitting radiation and a second semiconductor layer construction (2) for receiving radiation, which are arranged in a manner spaced apart from one another on a common substrate (3) and have at least one first contact layer (4). The first semiconductor layer construction (1) has an electromagnetic-radiation-generating region (5) arranged between p-conducting semiconductor layers (6) and n-conducting semiconductor layers (7) of the first semiconductor layer construction (1). A second contact layer (8) is at least partially arranged on that surface of the first semiconductor layer construction (1) which is remote from the substrate (3) and that of the second semiconductor layer construction (2). The second semiconductor layer construction (2) has an electromagnetic-radiation-absorbing region (9), the composition of the radiation-generating region (5) being different from that of the radiation-absorbing region (9).
    • 辐射发射和接收半导体部件至少具有用于发射辐射的第一半导体层结构(1)和用于接收辐射的第二半导体层结构(2),所述第二半导体层结构(2)以彼此间隔开的方式布置 公共衬底(3)并且具有至少一个第一接触层(4)。 第一半导体层结构(1)具有布置在第一半导体层结构(1)的p导电半导体层(6)和n导电半导体层(7)之间的电磁辐射产生区域(5)。 第二接触层(8)至少部分地布置在远离基板(3)的第一半导体层结构(1)的表面和第二半导体层结构(2)的表面上。 第二半导体层结构(2)具有电磁辐射吸收区域(9),辐射产生区域(5)的组成与辐射吸收区域(9)的组成不同。
    • 5. 发明授权
    • Radiation-emitting-and-receiving semiconductor chip and method for producing such a semiconductor chip
    • 辐射发射和接收半导体芯片及其制造方法
    • US07335922B2
    • 2008-02-26
    • US10951525
    • 2004-09-28
    • Glenn-Yves PlaineTony AlbrechtPeter BrickMarc Philippens
    • Glenn-Yves PlaineTony AlbrechtPeter BrickMarc Philippens
    • H01L27/15
    • H01L27/15H01L31/173
    • A radiation-emitting-and-receiving semiconductor component has at least a first semiconductor layer construction (1) for emitting radiation and a second semiconductor layer construction (2) for receiving radiation, which are arranged in a manner spaced apart from one another on a common substrate (3) and have at least one first contact layer (4). The first semiconductor layer construction (1) has an electromagnetic-radiation-generating region (5) arranged between p-conducting semiconductor layers (6) and n-conducting semiconductor layers (7) of the first semiconductor layer construction (1). A second contact layer (8) is at least partially arranged on that surface of the first semiconductor layer construction (1) which is remote from the substrate (3) and that of the second semiconductor layer construction (2). The second semiconductor layer construction (2) has an electromagnetic-radiation-absorbing region (9), the composition of the radiation-generating region (5) being different from that of the radiation-absorbing region (9).
    • 辐射发射和接收半导体部件至少具有用于发射辐射的第一半导体层结构(1)和用于接收辐射的第二半导体层结构(2),所述第二半导体层结构(2)以彼此间隔开的方式布置 公共衬底(3)并且具有至少一个第一接触层(4)。 第一半导体层结构(1)具有布置在第一半导体层结构(1)的p导电半导体层(6)和n导电半导体层(7)之间的电磁辐射产生区域(5)。 第二接触层(8)至少部分地布置在远离基板(3)的第一半导体层结构(1)的表面和第二半导体层结构(2)的表面上。 第二半导体层结构(2)具有电磁辐射吸收区域(9),辐射产生区域(5)的组成与辐射吸收区域(9)的组成不同。
    • 6. 发明授权
    • Light-emitting semiconductor component comprising a protective diode
    • 包含保护二极管的发光半导体元件
    • US07693201B2
    • 2010-04-06
    • US10580969
    • 2004-10-26
    • Tony AlbrechtPeter BrickMarc PhilippensGlenn-Yves Plaine
    • Tony AlbrechtPeter BrickMarc PhilippensGlenn-Yves Plaine
    • H01S5/183H01S5/125
    • H01S5/06825H01L27/15H01S5/0261H01S5/042H01S5/18311H01S5/18313H01S5/40
    • A light-emitting semiconductor component which contains a sequence of semiconductor layers (2) with an area of p-doped semiconductor layers (4) and n-doped semiconductor layers (3) between which a first pn junction (5a, 5b) is formed. The pn junction (5a, 5b) is subdivided into a light-emitting section (7) and a protective-diode section (8) in a lateral direction by means of an insulating section (6). An n-doped layer (9), which forms a second pn junction (10) which acts as a protective diode along with the p-doped area (4), is applied to the p-doped area (4) in the area of the protective-diode section (8), the first pn junction (5b) in the protective-diode section (8) having a larger area than the first pn junction (5a) in the light-emitting section (7). The protective-diode section (8) protects the light-emitting semiconductor component from voltage pulses due to electrostatic discharges (ESD).
    • 一种发光半导体元件,其包含具有p掺杂半导体层(4)的面积的半导体层(2)和n掺杂半导体层(3)的序列,在其间形成有第一pn结(5a,5b) 。 通过绝缘部分(6)将pn结(5a,5b)沿横向细分成发光部分(7)和保护二极管部分(8)。 形成与p掺杂区域(4)一起用作保护二极管的第二pn结(10)的n掺杂层(9)在p掺杂区域(4)的区域中被施加到p掺杂区域 保护二极管部分(8)中,保护二极管部分(8)中的第一pn结(5b)的面积大于发光部分(7)中的第一pn结(5a)的面积。 保护二极管部分(8)保护发光半导体部件免受静电放电(ESD)的电压脉冲的影响。
    • 7. 发明授权
    • Method for producing a radiation-emitting-and-receiving semiconductor chip
    • 辐射发射和接收半导体芯片的制造方法
    • US07524687B2
    • 2009-04-28
    • US12072365
    • 2008-02-26
    • Glenn-Yves PlaineTony AlbrechtPeter BrickMarc Philippens
    • Glenn-Yves PlaineTony AlbrechtPeter BrickMarc Philippens
    • H01L33/00
    • H01L27/15H01L31/173
    • A method for producing an integrated semiconductor component comprising a first semiconductor layer construction for emitting radiation and a second semiconductor layer construction for receiving radiation, wherein a substrate is first provided and a first semiconductor layer sequence containing a radiation-generating region is deposited epitaxially on the substrate. A second semiconductor layer sequence containing a radiation-absorbing region is subsequently deposited epitaxially on the first semiconductor layer sequence. The second semiconductor layer sequence is then patterned in order to uncover a first location and a second location. A first semiconductor layer construction is electrically insulated from a second semiconductor layer construction. Finally, a first contact layer is applied to a free surface of the substrate and a second contact layer is applied at least to the first and second locations for contact-connection.
    • 一种用于制造集成半导体部件的方法,包括用于发射辐射的第一半导体层结构和用于接收辐射的第二半导体层结构,其中首先提供衬底,并且包含辐射产生区的第一半导体层序列外延地沉积在 基质。 随后在第一半导体层序列上外延沉积包含辐射吸收区的第二半导体层序列。 然后将第二半导体层序列图案化以便露出第一位置和第二位置。 第一半导体层结构与第二半导体层结构电绝缘。 最后,将第一接触层施加到衬底的自由表面,并且至少将第二接触层施加到第一和第二位置用于接触连接。