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    • 74. 发明申请
    • Charge-trap type non-volatile memory devices and related methods
    • 充电陷阱型非易失性存储器件及相关方法
    • US20070284651A1
    • 2007-12-13
    • US11724870
    • 2007-03-16
    • Jae-Sung SimJung-Dal ChoiChang-Seok Kang
    • Jae-Sung SimJung-Dal ChoiChang-Seok Kang
    • H01L29/792H01L21/336
    • H01L27/11568H01L27/105H01L27/11573
    • Methods of forming a non-volatile memory device may include forming a tunnel insulating layer on a semiconductor substrate and forming a charge-trap layer on the tunnel insulating layer. A trench may then be formed extending through the tunnel insulating layer and the charge-trap layer and into the semiconductor substrate so that portions of the charge-trap layer and the tunnel insulating layers remain on opposite sides of the trench. A device isolation layer may be formed in the trench, and a blocking insulating layer may be formed on the device isolation layer and on remaining portions of the charge-trap layer. A gate electrode may be formed on the blocking insulating layer, and the blocking insulating layer and remaining portions of the charge-trap layer may be patterned to provide a blocking insulating pattern and a charge-trap pattern between the gate electrode and the semiconductor substrate. Related structures are also discussed.
    • 形成非易失性存储器件的方法可以包括在半导体衬底上形成隧道绝缘层,并在隧道绝缘层上形成电荷捕获层。 然后可以形成延伸穿过隧道绝缘层和电荷陷阱层并进入半导体衬底的沟槽,使得电荷陷阱层和隧道绝缘层的部分保留在沟槽的相对侧上。 可以在沟槽中形成器件隔离层,并且可以在器件隔离层上和电荷陷阱层的剩余部分上形成阻挡绝缘层。 可以在阻挡绝缘层上形成栅电极,并且可以对阻挡绝缘层和电荷陷阱层的剩余部分进行图案化以在栅电极和半导体衬底之间提供阻挡绝缘图案和电荷陷阱图案。 还讨论了相关结构。
    • 79. 发明申请
    • Methods of Forming Charge-Trap Type Non-Volatile Memory Devices
    • 形成电荷陷阱型非易失性存储器件的方法
    • US20100221886A1
    • 2010-09-02
    • US12766272
    • 2010-04-23
    • Jae-Sung SimJung-Dal ChoiChang-Seok Kang
    • Jae-Sung SimJung-Dal ChoiChang-Seok Kang
    • H01L21/8246
    • H01L27/11568H01L27/105H01L27/11573
    • Methods of forming a non-volatile memory device may include forming a tunnel insulating layer on a semiconductor substrate and forming a charge-trap layer on the tunnel insulating layer. A trench may then be formed extending through the tunnel insulating layer and the charge-trap layer and into the semiconductor substrate so that portions of the charge-trap layer and the tunnel insulating layers remain on opposite sides of the trench. A device isolation layer may be formed in the trench, and a blocking insulating layer may be formed on the device isolation layer and on remaining portions of the charge-trap layer. A gate electrode may be formed on the blocking insulating layer, and the blocking insulating layer and remaining portions of the charge-trap layer may be patterned to provide a blocking insulating pattern and a charge-trap pattern between the gate electrode and the semiconductor substrate.
    • 形成非易失性存储器件的方法可以包括在半导体衬底上形成隧道绝缘层,并在隧道绝缘层上形成电荷捕获层。 然后可以形成延伸穿过隧道绝缘层和电荷陷阱层并进入半导体衬底的沟槽,使得电荷陷阱层和隧道绝缘层的部分保留在沟槽的相对侧上。 可以在沟槽中形成器件隔离层,并且可以在器件隔离层上和电荷陷阱层的剩余部分上形成阻挡绝缘层。 可以在阻挡绝缘层上形成栅电极,并且可以对阻挡绝缘层和电荷陷阱层的剩余部分进行图案化以在栅电极和半导体衬底之间提供阻挡绝缘图案和电荷陷阱图案。
    • 80. 发明授权
    • Charge-trap type non-volatile memory devices and related methods
    • 充电陷阱型非易失性存储器件及相关方法
    • US07732856B2
    • 2010-06-08
    • US11724870
    • 2007-03-16
    • Jae-Sung SimJung-Dal ChoiChang-Seok Kang
    • Jae-Sung SimJung-Dal ChoiChang-Seok Kang
    • H01L29/792
    • H01L27/11568H01L27/105H01L27/11573
    • Methods of forming a non-volatile memory device may include forming a tunnel insulating layer on a semiconductor substrate and forming a charge-trap layer on the tunnel insulating layer. A trench may then be formed extending through the tunnel insulating layer and the charge-trap layer and into the semiconductor substrate so that portions of the charge-trap layer and the tunnel insulating layers remain on opposite sides of the trench. A device isolation layer may be formed in the trench, and a blocking insulating layer may be formed on the device isolation layer and on remaining portions of the charge-trap layer. A gate electrode may be formed on the blocking insulating layer, and the blocking insulating layer and remaining portions of the charge-trap layer may be patterned to provide a blocking insulating pattern and a charge-trap pattern between the gate electrode and the semiconductor substrate. Related structures are also discussed.
    • 形成非易失性存储器件的方法可以包括在半导体衬底上形成隧道绝缘层,并在隧道绝缘层上形成电荷捕获层。 然后可以形成延伸穿过隧道绝缘层和电荷陷阱层并进入半导体衬底的沟槽,使得电荷陷阱层和隧道绝缘层的部分保留在沟槽的相对侧上。 可以在沟槽中形成器件隔离层,并且可以在器件隔离层上和电荷陷阱层的剩余部分上形成阻挡绝缘层。 可以在阻挡绝缘层上形成栅电极,并且可以对阻挡绝缘层和电荷陷阱层的剩余部分进行图案化以在栅电极和半导体衬底之间提供阻挡绝缘图案和电荷陷阱图案。 还讨论了相关结构。