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    • 71. 发明授权
    • Metal-semiconductor intermixed regions
    • 金属半导体混合区域
    • US08278200B2
    • 2012-10-02
    • US13012043
    • 2011-01-24
    • Christian LavoieTak H. NingAhmet S. OzcanBin YangZhen Zhang
    • Christian LavoieTak H. NingAhmet S. OzcanBin YangZhen Zhang
    • H01L21/20
    • H01L21/28518
    • In one exemplary embodiment, a program storage device readable by a machine, tangibly embodying a program of instructions executable by the machine for performing operations, said operations including: depositing a first layer having a first metal on a surface of a semiconductor structure, where depositing the first layer creates a first intermix region at an interface of the first layer and the semiconductor structure; removing a portion of the deposited first layer to expose the first intermix region; depositing a second layer having a second metal on the first intermix region, where depositing the second layer creates a second intermix region at an interface of the second layer and the first intermix region; removing a portion of the deposited second layer to expose the second intermix region; and performing at least one anneal on the semiconductor structure.
    • 在一个示例性实施例中,一种可由机器读取的程序存储设备,其有形地体现了可由机器执行的用于执行操作的指令程序,所述操作包括:在半导体结构的表面上沉积具有第一金属的第一层, 第一层在第一层和半导体结构的界面处形成第一混合区; 去除沉积的第一层的一部分以暴露第一混合区; 在所述第一混合区域上沉积具有第二金属的第二层,其中沉积所述第二层在所述第二层和所述第一混合区的界面处产生第二混合区; 去除沉积的第二层的一部分以暴露第二混合区; 以及在所述半导体结构上执行至少一个退火。
    • 73. 发明授权
    • Self-aligned bipolar transistor with inverted polycide base contact
    • 自对准双极晶体管与反向多晶硅基极接触
    • US4495512A
    • 1985-01-22
    • US385740
    • 1982-06-07
    • Randall D. IsaacTak H. Ning
    • Randall D. IsaacTak H. Ning
    • H01L29/73H01L21/285H01L21/331H01L29/10H01L23/48H01L29/46H01L29/72
    • H01L29/66272H01L21/28518H01L29/1004Y10S148/035
    • An inverted polycide extrinsic base contact serves as a diffusion source, yet still has low resistivity and is readily etchable down to silicon by techniques useful in manufacturing integrated circuits. The extrinsic base contact layer is made up of a metal silicide (e.g. WSi.sub.2) with an overlying doped polysilicon layer with coextensive apertures through doped polysilicon and metal silicide layers defining the emitter and intrinsic base region.The extrinsic base region is formed by diffusing boron impurities from the p.sup.+ polysilicon layer through the silicide layer. The silicide layer is of a metal silicide such as tungsten silicide (WSi.sub.2). The polysilicon layer acts as a diffusion source, since appropriate dopants (e.g., boron) diffuse rapidly through the metal silicide. Both the top surface of the p.sup.+ polysilicon layer and the sidewall edges of the polysilicon and silicide layers are covered by an insulating layer (e.g. SiO.sub.2) which also separates the emitter contact from the base contact layers.
    • 反向多硅化物非本征基极接触用作扩散源,但仍具有低电阻率,并且通过可用于制造集成电路的技术容易地向硅蚀刻。 外部基极接触层由金属硅化物(例如WSi2)与具有共同延伸孔的上覆掺杂多晶硅层组成,掺杂多晶硅和金属硅化物层限定发射极和本征基极区。 通过从p +多晶硅层通过硅化物层扩散硼杂质形成非本征基区。 硅化物层是诸如硅化钨(WSi2)之类的金属硅化物。 多晶硅层充当扩散源,因为合适的掺杂剂(例如硼)迅速扩散通过金属硅化物。 p +多晶硅层的顶表面和多晶硅和硅化物层的侧壁边缘都被绝缘层(例如SiO 2)覆盖,绝缘层也将发射极接触与基极接触层分开。
    • 74. 发明授权
    • Self-aligned semiconductor circuits and process therefor
    • 自对准半导体电路及其工艺
    • US4338622A
    • 1982-07-06
    • US53473
    • 1979-06-29
    • George C. FethTak H. NingDenny D. TangSiegfried K. WiedmannHwa N. Yu
    • George C. FethTak H. NingDenny D. TangSiegfried K. WiedmannHwa N. Yu
    • H01L29/73H01L21/285H01L21/331H01L21/60H01L21/8226H01L27/02H01L27/082H01L29/04
    • H01L21/76897H01L21/28525H01L27/0233
    • A semiconductor circuit in which a plurality of transistors is provided, the collector regions/contacts and the base regions/contacts of the transistors being mutually self-aligned. In one embodiment, the collectors have conductive layer contacts (such as metal) and are self-aligned to polysilicon base contacts while in another embodiment the base contacts are comprised of a conductive (metal) layer while polysilicon is used for the collector contacts. The collectors of these transistors can be butted to a field oxide to reduce the extrinsic base area and to minimize excess charge storage in the base region. The base contacts, whether polysilicon or metal, etc. provide alternate base current paths so that the removal of the extrinsic base area does not adversely affect the total amount of base current which can flow. The use of a polysilicon layer for the base contacts, where "fingers" are provided by the polysilicon layer, enhances wirability and the mode of fabrication of the structure, since the polysilicon fingers can have an insulating layer (grown oxide) thereover to provide electrical isolation from over-lying conductors. These self-alignment techniques provide enhanced electrical properties since the distance between the base and collector contacts is minimized and since the base-emitter depletion layer capacitance, the stored charge and the base series resistance are reduced. From a processing standpoint, an additional masking step is not required to form the collector regions.
    • 提供多个晶体管的半导体电路,晶体管的集电极区域/触点和基极区域/触点相互自对准。 在一个实施例中,集电器具有导电层接触(例如金属)并且与多晶硅基底触点自对准,而在另一实施例中,基极触点由导电(金属)层组成,而多晶硅用于集电极触点。 这些晶体管的集电极可以对接到场氧化物以减少外部基极面积并且使基极区域中的过剩电荷存储最小化。 基极触点(无论是多晶硅还是金属)等提供交替的基极电流路径,使得外部基极面积的去除不会不利地影响可流过的基极电流的总量。 由于多晶硅指状物可以具有绝缘层(生长的氧化物)以提供电气,所以使用多晶硅层用于基底触点,其中“指状”由多晶硅层提供,从而提高了结构的布线性和制造方式, 与绝缘导体隔离。 这些自对准技术提供增强的电性能,因为基极和集电极触点之间的距离最小化,并且由于基极 - 发射极耗尽层电容,存储电荷和基极串联电阻减小。 从处理的观点来看,不需要附加的掩模步骤来形成收集区域。
    • 77. 发明申请
    • Metal-Semiconductor Intermixed Regions
    • 金属半导体混合区域
    • US20120295439A1
    • 2012-11-22
    • US13564181
    • 2012-08-01
    • Christian LavoieTak H. NingAhmet S. OzcanBin YangZhen Zhang
    • Christian LavoieTak H. NingAhmet S. OzcanBin YangZhen Zhang
    • H01L21/3205
    • H01L21/28518
    • In one exemplary embodiment, a program storage device readable by a machine, tangibly embodying a program of instructions executable by the machine for performing operations, said operations including: depositing a first layer having a first metal on a surface of a semiconductor structure, where depositing the first layer creates a first intermix region at an interface of the first layer and the semiconductor structure; removing a portion of the deposited first layer to expose the first intermix region; depositing a second layer having a second metal on the first intermix region, where depositing the second layer creates a second intermix region at an interface of the second layer and the first intermix region; removing a portion of the deposited second layer to expose the second intermix region; and performing at least one anneal on the semiconductor structure.
    • 在一个示例性实施例中,一种可由机器读取的程序存储设备,其有形地体现了可由机器执行的用于执行操作的指令程序,所述操作包括:在半导体结构的表面上沉积具有第一金属的第一层, 第一层在第一层和半导体结构的界面处形成第一混合区; 去除沉积的第一层的一部分以暴露第一混合区; 在所述第一混合区域上沉积具有第二金属的第二层,其中沉积所述第二层在所述第二层和所述第一混合区的界面处产生第二混合区; 去除沉积的第二层的一部分以暴露第二混合区; 以及在所述半导体结构上执行至少一个退火。
    • 79. 发明申请
    • SOI SiGe-Base Lateral Bipolar Junction Transistor
    • SOI SiGe-Base侧向双极结晶体管
    • US20120139009A1
    • 2012-06-07
    • US12958647
    • 2010-12-02
    • Tak H. NingKevin K. ChanMarwan H. Khater
    • Tak H. NingKevin K. ChanMarwan H. Khater
    • H01L29/737H01L21/8222
    • H01L29/7317H01L27/0821H01L27/1203H01L29/0808H01L29/165H01L29/66265
    • A lateral heterojunction bipolar transistor (HBT) is formed on a semiconductor-on-insulator substrate. The HBT includes a base including a doped silicon-germanium alloy base region, an emitter including doped silicon and laterally contacting the base, and a collector including doped silicon and laterally contacting the base. Because the collector current is channeled through the doped silicon-germanium base region, the HBT can accommodate a greater current density than a comparable bipolar transistor employing a silicon channel. The base may also include an upper silicon base region and/or a lower silicon base region. In this case, the collector current is concentrated in the doped silicon-germanium base region, thereby minimizing noise introduced to carrier scattering at the periphery of the base. Further, parasitic capacitance is minimized because the emitter-base junction area is the same as the collector-base junction area.
    • 在绝缘体上半导体衬底上形成横向异质结双极晶体管(HBT)。 HBT包括基底,其包括掺杂的硅 - 锗合金基底区域,包括掺杂硅并且横向接触基底的发射体,以及包括掺杂硅并且横向接触基底的收集器。 因为集电极电流被引导通过掺杂的硅 - 锗基区,所以与使用硅沟道的可比较的双极晶体管相比,HBT可以容纳更大的电流密度。 基底还可以包括上硅基区和/或下硅基区。 在这种情况下,集电极电流集中在掺杂的硅 - 锗基区域中,从而最小化引入到基极周边的载流子散射的噪声。 此外,寄生电容被最小化,因为发射极 - 基极结面积与集电极 - 基极结面积相同。