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    • 74. 发明授权
    • Structure and method for III-nitride monolithic power IC
    • III族氮化物单片电源IC的结构和方法
    • US07892938B2
    • 2011-02-22
    • US11507709
    • 2006-08-22
    • Robert BeachPaul Bridger
    • Robert BeachPaul Bridger
    • H01L21/76
    • H01L29/66462H01L21/76H01L21/7605H01L21/76264H01L21/76289H01L29/2003Y10S438/93
    • III-nitride materials are used to form isolation structures in high voltage ICs to isolate low voltage and high voltage functions on a monolithic power IC. Critical performance parameters are improved using III-nitride materials, due to the improved breakdown performance and thermal performance available in III-nitride semiconductor materials. An isolation structure may include a dielectric layer that is epitaxially grown using a III-nitride material to provide a simplified manufacturing process. The process permits the use of planar manufacturing technology to avoid additional manufacturing costs. High voltage power ICs have improved performance in a smaller package in comparison to corresponding silicon structures.
    • III族氮化物材料用于在高电压IC中形成隔离结构,以隔离单片电源IC上的低电压和高电压功能。 由于III族氮化物半导体材料的击穿性能和热性能的改善,使用III族氮化物材料改善了关键性能参数。 隔离结构可以包括使用III族氮化物材料外延生长以提供简化的制造工艺的电介质层。 该过程允许使用平面制造技术来避免额外的制造成本。 与相应的硅结构相比,高压功率IC在较小的封装中具有改进的性能。
    • 80. 发明授权
    • III-nitride device with reduced piezoelectric polarization
    • 具有降低的压电极化的III族氮化物器件
    • US07652311B2
    • 2010-01-26
    • US11906823
    • 2007-10-04
    • Robert Beach
    • Robert Beach
    • H01L29/739H01L31/0328H01L31/0336H01L31/072H01L31/109H01L29/06H01L29/22H01L33/00
    • H01L29/7787H01L29/2003
    • A III-nitride based field effect transistor obtains improved performance characteristics through manipulation of the relationship between the in-plane lattice constant of the interface of material layers. A high mobility two dimensional electron gas generated at the interface of the III-nitride materials permits high current conduction with low ON resistance, and is controllable through the manipulation of spontaneous polarization fields obtained according to the characteristics of the III-nitride material. The field effect transistor produced can be made to be a nominally on device where the in-plane lattice constants of the material forming the interface match. A nominally off device may be produced where one of the material layers has an in-plane lattice constant that is larger than that of the other layer material. The layer materials are preferably InAlGaN/GaN layers that are particularly tailored to the characteristics of the present invention.
    • 基于III族氮化物的场效应晶体管通过处理材料层的界面的面内晶格常数之间的关系来获得改进的性能特性。 在III族氮化物材料的界面处产生的高迁移率二维电子气体允许具有低导通电阻的高电流传导,并且可以通过操纵根据III族氮化物材料的特性获得的自发极化场来控制。 所产生的场效应晶体管可以在名义上成为形成界面的材料的面内晶格常数匹配的器件上。 可以制造名义上关闭的装置,其中材料层之一的面内晶格常数大于其它层材料的面内晶格常数。 层材料优选是特别适合于本发明特征的InAlGaN / GaN层。