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71. 发明申请

US20130300947A1 Mini-Projector Applied for Video Output Device 审中-公开
标题翻译：迷你投影机应用于视频输出设备
公开(公告)号：US20130300947A1
公开(公告)日：2013-11-14
申请号：US13467249
申请日：2012-05-09
申请人： Hui Hsien Wu , Wei Hong Chen , Heng Liu , Cheng Tien Chen
发明人： Hui Hsien Wu , Wei Hong Chen , Heng Liu , Cheng Tien Chen
IPC分类号： H04N5/74 , H04N3/26 , H04N5/64
CPC分类号： H04N3/26 , H04N5/64 , H04N5/74 , H04N9/3173 , H04N21/4122 , H04N21/41407
摘要： The present invention provides a mini-projector applied for a video output device. The video output device includes a microprocessor. A projection optical engine is coupled to the microprocessor for projecting a video data. A charging module is capable of charging to a first battery of the mini-projector and/or a second battery of the video output device. A male connector is couple to a female connector of the video output device. A switching unit is coupled to the charging module for switching the projecting function of the projection optical engine or the charging function of the second battery of the video output device.
摘要翻译：本发明提供一种应用于视频输出装置的微型投影机。视频输出装置包括微处理器。投影光学引擎耦合到微处理器以投影视频数据。充电模块能够对该微型投影仪的第一电池和/或视频输出装置的第二电池充电。公连接器耦合到视频输出设备的母连接器。开关单元耦合到充电模块，用于切换投影光学引擎的投影功能或视频输出设备的第二电池的充电功能。

72. 发明申请

US20130264588A1 COMPACT LED PACKAGE 审中-公开
标题翻译：紧凑型LED封装
公开(公告)号：US20130264588A1
公开(公告)日：2013-10-10
申请号：US13442422
申请日：2012-04-09
申请人： Heng Liu , Shih-Feng Shao
发明人： Heng Liu , Shih-Feng Shao
IPC分类号： H01L33/08 , H01L33/50
CPC分类号： H01L25/075 , H01L33/08 , H01L33/507 , H01L2924/0002 , H01L2924/00
摘要： A light emitting package includes a base and one or more LED units coupled to the base. The LED unit includes a plurality of vertically stacked epitaxial structures. Each epitaxial structure includes at least a first doped layer, at least a light emitting layer, and at least a second doped layer. At least one luminescent element is spaced a distance from the one or more LED units.
摘要翻译：发光包装包括底座和耦合到底座的一个或多个LED单元。 LED单元包括多个垂直堆叠的外延结构。每个外延结构至少包括第一掺杂层，至少发光层和至少第二掺杂层。至少一个发光元件与一个或多个LED单元间隔开一定距离。

73. 发明申请

US20130221321A1 LIGHT-EMITTING DIODE DEVICE 审中-公开
标题翻译：发光二极管装置
公开(公告)号：US20130221321A1
公开(公告)日：2013-08-29
申请号：US13464656
申请日：2012-05-04
申请人： Jinn Kong Sheu , Chih-Yuan Chang , Heng Liu , Wei-Chih Lai
发明人： Jinn Kong Sheu , Chih-Yuan Chang , Heng Liu , Wei-Chih Lai
IPC分类号： H01L33/04
CPC分类号： H01L33/06 , H01L25/0753 , H01L33/08 , H01L33/32 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode (LED) device includes a first LED, a second LED, and a superlattice structure by which the first and the second LEDs are stacked. The superlattice structure has an absorption spectra, the first active layer of the first LED has a first emission spectra, and the second active layer of the second LED has a second emission spectra. The absorption spectra is located on a shorter-wavelength side of at least one of the first and the second emission spectra.
摘要翻译：发光二极管（LED）装置包括第一LED，第二LED以及堆叠第一和第二LED的超晶格结构。超晶格结构具有吸收光谱，第一LED的第一有源层具有第一发射光谱，第二LED的第二有源层具有第二发射光谱。吸收光谱位于第一和第二发射光谱中的至少一个的较短波长侧。

74. 发明授权

US08430152B2 Heat dissipation device 失效
标题翻译：散热装置
公开(公告)号：US08430152B2
公开(公告)日：2013-04-30
申请号：US12760562
申请日：2010-04-15
申请人： Heng Liu , Jing Zhang
发明人： Heng Liu , Jing Zhang
IPC分类号： H01L23/467 , H05K7/20
CPC分类号： H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat dissipation device includes a round heat sink and a fixing frame. The heat sink defines receiving depressions at an outer peripheral surface thereof. The fixing frame includes a peripheral side plate disposed around the heat sink and fixing legs corresponding to the receiving depressions of the heat sink extending downwardly from the side plate. The fixing frame includes blocks extending inwardly from an inner surface of the side plate and protruding members extending inwardly from the fixing legs. The heat sink is rotatably received in the fixing frame with a top of the heat sink abutting the blocks. When the heat sink is in an unlocked state, the protruding members align with the receiving depressions, respectively. When the heat sink is rotated to a locked state, the protruding members abut a bottom of the heat sink.
摘要翻译：示例性的散热装置包括圆形散热器和固定框架。散热器在其外周表面限定接收凹部。固定框架包括围绕散热器设置的周边侧板，并且固定腿对应于从侧板向下延伸的散热器的接收凹部。固定框架包括从侧板的内表面向内延伸的块和从固定腿向内延伸的突出构件。散热器可旋转地容纳在固定框架中，散热片的顶部邻接块体。当散热器处于解锁状态时，突出部件分别与接收凹部对准。当散热器旋转到锁定状态时，突出部件邻接散热器的底部。

75. 外观设计

USD679311S1 Micro projector 有权
公开(公告)号：USD679311S1
公开(公告)日：2013-04-02
申请号：US29410043
申请日：2012-01-03
申请人： Hui-Hsien Wu , Wei-Hong Chen , Heng Liu
设计人： Hui-Hsien Wu , Wei-Hong Chen , Heng Liu

76. 发明申请

US20130020597A1 POSTS IN GLUE LAYER FOR GROUP-III NITRIDE LEDS 有权
标题翻译：用于III类氮化物灯的玻璃层中的位置
公开(公告)号：US20130020597A1
公开(公告)日：2013-01-24
申请号：US13185845
申请日：2011-07-19
申请人： Ray-Hua Horng , Yi-An Lu , Heng Liu
发明人： Ray-Hua Horng , Yi-An Lu , Heng Liu
IPC分类号： H01L33/60
CPC分类号： H01L33/0079 , H01L33/22 , H01L33/38 , H01L33/46 , H01L33/641
摘要： A semiconductor light emitting device and a method for making the semiconductor light emitting device are described. The semiconductor light emitting device includes an epitaxial structure having a first type doped layer, a light emitting layer, and a second type doped layer. The epitaxial structure may further include an undoped layer. A substrate is bonded to at least one surface of the epitaxial structure with an adhesive layer. One or more posts are located in the adhesive layer. The posts may have different widths depending on the location of the posts and/or the posts may only be located under certain portions of the epitaxial structure.
摘要翻译：对半导体发光元件及半导体发光元件的制造方法进行说明。半导体发光器件包括具有第一类型掺杂层，发光层和第二类型掺杂层的外延结构。外延结构还可以包括未掺杂的层。用粘合剂层将衬底结合到外延结构的至少一个表面。一个或多个柱位于粘合剂层中。柱可以具有不同的宽度，这取决于柱的位置和/或柱可以仅位于外延结构的特定部分之下。

77. 发明申请

US20120228651A1 LIGHT-EMITTING-DIODE ARRAY 审中-公开
标题翻译：发光二极管阵列
公开(公告)号：US20120228651A1
公开(公告)日：2012-09-13
申请号：US13481299
申请日：2012-05-25
申请人： Ray-Hua Horng , Yi-An Lu , Heng Liu
发明人： Ray-Hua Horng , Yi-An Lu , Heng Liu
IPC分类号： H01L33/50 , H01L33/08
CPC分类号： H01L25/0753 , H01L24/24 , H01L24/82 , H01L27/156 , H01L33/50 , H01L33/56 , H01L33/62 , H01L2224/16225 , H01L2224/73267 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
摘要： A light-emitting-diode (LED) array includes a first LED unit having a first electrode and a second LED unit having a second electrode. The first LED unit and the second LED unit are positioned on a common substrate and are separated by a gap. Two or more polymer materials form a multi-layered structure in the gap. A first polymer material substantially fills a lower portion of the gap and at least one additional polymer material substantially fills a remainder of the gap above the first polymer material. A kinematic viscosity of the first polymer material is less than a kinematic viscosity of the at least one additional polymer material. An interconnect, positioned on top of the at least one additional polymer material, electrically connects the first electrode and the second electrode.
摘要翻译：发光二极管（LED）阵列包括具有第一电极的第一LED单元和具有第二电极的第二LED单元。第一LED单元和第二LED单元位于公共基板上并由间隙分开。两种或多种聚合物材料在间隙中形成多层结构。第一聚合物材料基本上填充间隙的下部，并且至少一个另外的聚合物材料基本上填充了第一聚合物材料上方的间隙的剩余部分。第一聚合物材料的运动粘度小于至少一种另外的聚合物材料的运动粘度。定位在所述至少一种另外的聚合物材料的顶部上的互连电连接所述第一电极和所述第二电极。

78. 发明申请

US20120193653A1 LED ARRAY FORMED BY INTERCONNECTED AND SURROUNDED LED CHIPS 有权
标题翻译： LED阵列由互连和周边LED灯形成
公开(公告)号：US20120193653A1
公开(公告)日：2012-08-02
申请号：US13287590
申请日：2011-11-02
申请人： Ray-Hua Horng , Yi-An Lu , Heng Liu
发明人： Ray-Hua Horng , Yi-An Lu , Heng Liu
IPC分类号： H01L33/08
CPC分类号： H01L25/0753 , H01L24/24 , H01L33/54 , H01L33/62 , H01L33/641 , H01L2224/24137 , H01L2224/73267 , H01L2924/12041 , H01L2924/15788 , H01L2933/0066 , H01L2924/00
摘要： A light emitting diode array includes a first light emitting diode having a first electrode and a second light emitting diode having a second electrode. The first and second light emitting diodes are separated. A first polymer layer is positioned between the light emitting diodes. An interconnect located at least partially on the first polymer layer connects the first electrode to the second electrode. A permanent substrate is coupled to the light emitting diodes. The permanent substrate is coupled to the side of the light emitting diodes opposite the interconnect. A second polymer layer at least partially encapsulates the side of the light emitting diodes with the interconnect.
摘要翻译：发光二极管阵列包括具有第一电极的第一发光二极管和具有第二电极的第二发光二极管。第一和第二发光二极管被分离。第一聚合物层位于发光二极管之间。至少部分地位于第一聚合物层上的互连将第一电极连接到第二电极。永久基板耦合到发光二极管。永久基板耦合到与互连相对的发光二极管的一侧。第二聚合物层至少部分地用互连封装发光二极管的侧面。

79. 发明授权

US08011961B2 Cable assembly with grounding pieces 有权
标题翻译：带接地片的电缆组件
公开(公告)号：US08011961B2
公开(公告)日：2011-09-06
申请号：US12579424
申请日：2009-10-15
申请人： Heng Liu , Xian-Kui Shi , Chung-Yen Yang
发明人： Heng Liu , Xian-Kui Shi , Chung-Yen Yang
IPC分类号： H01R13/649
CPC分类号： H01R13/514 , H01R4/64 , H01R13/506 , H01R13/6582 , H01R13/73
摘要： A cable assembly comprises an insulative housing defining a first and second receiving room therein, and a mounting platform disposed at one side of the insulative housing. A first and second electrical connectors are respectively received into the first and second receiving rooms, the first electrical connector defines a metallic shell. At least one cable is electrically connected with the first and second electrical connectors. And a grounding piece is assembled to the mounting platform of the insulative housing and has a contacting arm received into the first receiving room and electrically contacted with the metallic shell of the first electrical connector.
摘要翻译：电缆组件包括在其中限定第一和第二接收室的绝缘壳体和设置在绝缘壳体的一侧的安装平台。第一和第二电连接器分别容纳在第一和第二接收室中，第一电连接器限定金属外壳。至少一根电缆与第一和第二电连接器电连接。并且将接地片组装到绝缘壳体的安装平台上，并且具有容纳在第一容纳室中并与第一电连接器的金属壳电接触的接触臂。

80. 发明申请

US20110108862A1 LIGHT-EMITTING-DIODE ARRAY AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：发光二极管阵列及其制造方法
公开(公告)号：US20110108862A1
公开(公告)日：2011-05-12
申请号：US12948504
申请日：2010-11-17
申请人： Ray-Hua Horng , Yi-An Lu , Heng Liu
发明人： Ray-Hua Horng , Yi-An Lu , Heng Liu
IPC分类号： H01L33/50
CPC分类号： H01L25/0753 , H01L24/24 , H01L24/82 , H01L27/156 , H01L33/50 , H01L33/56 , H01L33/62 , H01L2924/01012 , H01L2924/01029 , H01L2924/12041 , H01L2924/00
摘要： A light-emitting-diode (LED) array is disclosed which comprises a first LED device having a first electrode, a second LED device having a second electrode, wherein the first and the second LED device are formed on the same substrate and separated by a gap, at least one polymer material substantially filling the gap, and an interconnect, formed on top of the at least one polymer material, electrically connecting the first and the second electrode.
摘要翻译：公开了一种发光二极管（LED）阵列，其包括具有第一电极的第一LED器件，具有第二电极的第二LED器件，其中第一和第二LED器件形成在相同的衬底上并由间隙，基本上填充间隙的至少一种聚合物材料和形成在至少一种聚合物材料的顶部上的互连，电连接第一和第二电极。

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