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71. 发明授权

US07049672B2 Method and apparatus for preparing a plurality of dice in wafers 失效
标题翻译：用于在晶片中制备多个骰子的方法和装置
公开(公告)号：US07049672B2
公开(公告)日：2006-05-23
申请号：US10860698
申请日：2004-06-02
申请人： William R. Headley , Mario J. Paniccia
发明人： William R. Headley , Mario J. Paniccia
IPC分类号： H01L31/0232 , H01L33/00
CPC分类号： G02B6/4207 , H01L21/78
摘要： An apparatus and method for preparing a plurality of dice on a semiconductor wafer. In one embodiment, a method according to embodiments of the present invention includes arranging a plurality of dice in a semiconductor wafer such that there is a separation region between each neighboring die of the semiconductor wafer. One or more trenches are etched in the separation region of the semiconductor wafer to form one or more lateral surfaces of one or more of the plurality of dice. The semiconductor wafer is then fractured into separate pieces at the one or more trenches to separate the plurality of dice from each other.
摘要翻译：一种用于在半导体晶片上制备多个骰子的装置和方法。在一个实施例中，根据本发明的实施例的方法包括在半导体晶片中布置多个骰子，使得在半导体晶片的每个相邻裸片之间存在分离区域。在半导体晶片的分离区域中蚀刻一个或多个沟槽，以形成多个骰子中的一个或多个的一个或多个侧表面。然后将半导体晶片在一个或多个沟槽处断裂成分离的片，以将多个骰子彼此分离。

72. 发明授权

US06911672B2 Method and apparatus for preparing a plurality of dice in wafers 失效
公开(公告)号：US06911672B2
公开(公告)日：2005-06-28
申请号：US10860576
申请日：2004-06-02
申请人： William R. Headley , Mario J. Paniccia
发明人： William R. Headley , Mario J. Paniccia
IPC分类号： G02B6/42 , H01L21/00 , H01L21/301 , H01L21/44 , H01L21/46 , H01L21/78 , H01L23/544 , H01L27/15
CPC分类号： G02B6/4207 , H01L21/78
摘要： An apparatus and method for preparing a plurality of dice on a semiconductor wafer. In one embodiment, a method according to embodiments of the present invention includes arranging a plurality of dice in a semiconductor wafer such that there is a separation region between each neighboring die of the semiconductor wafer. One or more trenches are etched in the separation region of the semiconductor wafer to form one or more lateral surfaces of one or more of the plurality of dice. The semiconductor wafer is then fractured into separate pieces at the one or more trenches to separate the plurality of dice from each other.

73. 发明授权

US06603893B1 Method and apparatus for switching an optical beam in a semiconductor substrate 有权
标题翻译：用于切换半导体衬底中的光束的方法和装置
公开(公告)号：US06603893B1
公开(公告)日：2003-08-05
申请号：US09819160
申请日：2001-03-27
申请人： Ansheng Liu , Mario J. Paniccia , Dean A. Samara-Rubio , Chi Chu
发明人： Ansheng Liu , Mario J. Paniccia , Dean A. Samara-Rubio , Chi Chu
IPC分类号： G02B626
CPC分类号： G02F1/3136 , G02B6/2813 , G02F2001/217
摘要： An optical switching method and apparatus. In one aspect of the present invention, the disclosed apparatus includes first and second multi-mode interference (MMI) splitting devices in a semiconductor substrate. First and second outputs of the first MMI splitting device are optically coupled to first and second inputs, respectively, of the second MMI splitting device. First and second phase control devices are included in the semiconductor substrate. The first input of the second MMI splitting device is optically coupled to the first output of the first MMI splitting device through the first phase control device. The second input of the second MMI splitting device is optically coupled to the second output of the first MMI splitting device through the second phase control device. The first input of the first MMI splitting device is selectively optically coupled to the first and second outputs of the second MMI splitting device in response to the first and second phase control devices. The second input of the first MMI splitting device is selectively optically coupled to the first and second outputs of the second MMI splitting device in response to the first and second phase control devices.
摘要翻译：一种光学切换方法和装置。在本发明的一个方面，所公开的设备包括半导体衬底中的第一和第二多模干涉（MMI）分离器件。第一MMI分割装置的第一和第二输出分别光耦合到第二MMI分割装置的第一和第二输入。第一和第二相位控制装置包括在半导体衬底中。第二MMI分割装置的第一输入通过第一相位控制装置光耦合到第一MMI分配装置的第一输出端。第二MMI分配装置的第二输入通过第二相位控制装置光耦合到第一MMI分配装置的第二输出端。响应于第一和第二相位控制装置，第一MMI分配装置的第一输入选择性地光耦合到第二MMI分配装置的第一和第二输出端。响应于第一和第二相位控制装置，第一MMI分配装置的第二输入被选择性地光耦合到第二MMI分配装置的第一和第二输出端。

74. 发明授权

US06587605B2 Method and apparatus for providing optical interconnection 有权
公开(公告)号：US06587605B2
公开(公告)日：2003-07-01
申请号：US09780174
申请日：2001-02-09
申请人： Mario J. Paniccia , Michael T. Morse , Valluri R. M. Rao
发明人： Mario J. Paniccia , Michael T. Morse , Valluri R. M. Rao
IPC分类号： G02B612
CPC分类号： G02F1/025 , G02B6/43
摘要： A method and an apparatus providing an optical interconnection in an integrated circuit die. In one embodiment, an optical interconnection is used to optically interconnect a waveguide-based optical modulator through the insulating layer and back side of the semiconductor substrate of the integrated circuit die. In one embodiment, an insulating oxide layer is disposed between a semiconductor waveguide optical modulator and the back side of the semiconductor substrate. Optical conduits are disposed in the insulating oxide layer at the locations where light enters and exits the semiconductor waveguide optical modulator. In one embodiment, the optical conduits have indexes of refraction substantially equal to the indexes of refraction of the semiconductor substrate and the semiconductor waveguide optical modulator. Thus, attenuation of the light used to optically couple the semiconductor waveguide optical modulator through the back side of the semiconductor substrate is reduced.

75. 发明授权

US06393169B1 Method and apparatus for providing optical interconnection 有权
标题翻译：提供光互连的方法和装置
公开(公告)号：US06393169B1
公开(公告)日：2002-05-21
申请号：US09226783
申请日：1999-01-06
申请人： Mario J. Paniccia , Michael T. Morse , Valluri R.M. Rao
发明人： Mario J. Paniccia , Michael T. Morse , Valluri R.M. Rao
IPC分类号： G02B612
CPC分类号： G02B6/43 , G02B2006/12107 , G02B2006/12142 , G02F1/218 , G02F2001/0152 , G02F2201/307
摘要： A method and an apparatus providing an optical interconnection in an integrated circuit die. In one embodiment, an optical interconnection is used to optically interconnect a waveguide-based optical modulator through the insulating layer and back side of the semiconductor substrate of the integrated circuit die. In one embodiment, an insulating oxide layer is disposed between a semiconductor waveguide optical modulator and the back side of the semiconductor substrate. Optical conduits are disposed in the insulating oxide layer at the locations where light enters and exits the semiconductor waveguide optical modulator. In one embodiment, the optical conduits have indexes of refraction substantially equal to the indexes of refraction of the semiconductor substrate and the semiconductor waveguide optical modulator. Thus, attenuation of the light used to optically couple the semiconductor waveguide optical modulator through the back side of the semiconductor substrate is reduced.
摘要翻译：一种在集成电路管芯中提供光互连的方法和装置。在一个实施例中，光互连用于通过集成电路管芯的半导体衬底的绝缘层和背面光学地互连基于波导的光学调制器。在一个实施例中，绝缘氧化物层设置在半导体波导光调制器和半导体衬底的背面之间。在光入射到半导体波导光调制器的位置处，光导管设置在绝缘氧化物层中。在一个实施例中，光导管的折射指数基本上等于半导体衬底和半导体波导光调制器的折射率。因此，减少了通过半导体衬底的背面光耦合半导体波导光学调制器的光的衰减。

76. 发明授权

US06351326B1 Method and apparatus for optically modulating light utilizing a resonant cavity structure 有权
标题翻译：利用谐振腔结构光学调制光的方法和装置
公开(公告)号：US06351326B1
公开(公告)日：2002-02-26
申请号：US09465222
申请日：1999-12-14
申请人： Michael T. Morse , Mario J. Paniccia , Dmitri Nikonov
发明人： Michael T. Morse , Mario J. Paniccia , Dmitri Nikonov
IPC分类号： G02F103
CPC分类号： G02F1/2257 , G02F2201/302 , G02F2201/346 , G02F2202/104 , G02F2203/15
摘要： An optical modulator that modulates an optical beam through directed through an integrated circuit die. In one embodiment, the optical beam is directed into and out of a flip chip packaged integrated circuit die. In one embodiment, the optical modulator includes a resonant cavity structure. In one embodiment, the resonant cavity structure is disposed in the dielectric layer of the integrated circuit die. In one embodiment, the optical beam is directed into the integrated circuit die and through the resonant cavity structure and is modulated in response to an integrated circuit signal of the integrated circuit die. In one embodiment, the optical beam is modulated by modulating the resonant wavelength of the resonant cavity structure in response to the integrated circuit signal. A modulated optical beam is directed from the resonant cavity structure back out of the integrated circuit die.
摘要翻译：光调制器，其通过引导通过集成电路管芯来调制光束。在一个实施例中，光束被引导到倒装芯片封装的集成电路管芯中和外。在一个实施例中，光调制器包括谐振腔结构。在一个实施例中，谐振腔结构设置在集成电路管芯的电介质层中。在一个实施例中，光束被引导到集成电路管芯中并通过谐振腔结构，并且响应于集成电路管芯的集成电路信号被调制。在一个实施例中，通过响应于集成电路信号调制谐振腔结构的谐振波长来调制光束。调制光束从谐振腔结构引出集成电路管芯。

77. 发明授权

US06330376B1 Higher order rejection method and apparatus for optical modulator 有权
标题翻译：光调制器的高阶抑制方法和装置
公开(公告)号：US06330376B1
公开(公告)日：2001-12-11
申请号：US09283106
申请日：1999-03-31
申请人： Mario J. Paniccia
发明人： Mario J. Paniccia
IPC分类号： G02B612
CPC分类号： G02F1/218 , G02B2006/12107 , G02B2006/12142 , G02F2001/0152 , G02F2201/307
摘要： An optical modulator that modulates light through the semiconductor substrate through the back side of a flip chip packaged integrated circuit. The optical modulator of the present invention enables integrated circuit signals to be extracted through the back side of the semiconductor substrate. In one embodiment, an optical modulator is disposed within a flip chip packaged integrated circuit die. The optical modulator includes a deflector and a diffraction grating. An infrared light beam is directed through the back side of a silicon substrate of the integrated circuit die, deflected off the deflector through the diffraction grating and back out the back side of the integrated circuit die. The diffraction grating modulates the phase of a portion of the deflected light beam in response to an integrated circuit signal. A resulting diffraction interference occurs between the phase modulated portions and nonphase modulated portions of the deflected light beam. The interference causes amplitude modulation of a zero order diffraction of the deflected light beam, from which the integrated circuit signal can be extracted. The zero order diffraction is allowed to pass through an optical passage to exit the semiconductor substrate of the flip chip packaged integrated circuit die while the non-zero order diffractions are blocked.
摘要翻译：一种光学调制器，其通过倒装芯片封装集成电路的背面来调制通过半导体衬底的光。本发明的光调制器能够通过半导体基板的背面提取集成电路信号。在一个实施例中，光学调制器设置在倒装芯片封装集成电路管芯内。光学调制器包括偏转器和衍射光栅。红外光束被引导通过集成电路管芯的硅衬底的背面，通过衍射光栅偏转偏转器并从集成电路管芯的背面退出。衍射光栅响应于集成电路信号调制偏转光束的一部分的相位。在偏转光束的相位调制部分和非相位调制部分之间产生衍射干涉。干扰引起偏转光束的零级衍射的幅度调制，可从中提取集成电路信号。允许零级衍射通过光通道以退出倒装芯片封装的集成电路管芯的半导体衬底，而非零级衍射被阻挡。

78. 发明授权

US6075908A Method and apparatus for optically modulating light through the back side of an integrated circuit die 失效
标题翻译：通过集成电路管芯的背侧对光进行光学调制的方法和装置
公开(公告)号：US6075908A
公开(公告)日：2000-06-13
申请号：US993786
申请日：1997-12-19
申请人： Mario J. Paniccia , Valluri R. M. Rao , Ian A. Young
发明人： Mario J. Paniccia , Valluri R. M. Rao , Ian A. Young
IPC分类号： G02B6/12 , G02F1/015 , G02F1/21
CPC分类号： G02F1/218 , G02B2006/12107 , G02B2006/12142 , G02F2001/0152 , G02F2201/307
摘要： An optical modulator that modulates light through the semiconductor substrate through the back side of a flip chip packaged integrated circuit. The optical modulator of the present invention enables integrated circuit signals to be extracted through the back side of the semiconductor substrate. In one embodiment, an optical modulator is disposed within a flip chip packaged integrated circuit die. The optical modulator includes a deflector and a diffraction grating. An infrared light beam is directed through the back side of a silicon substrate of the integrated circuit die, deflected off the deflector through the diffraction grating and back out the back side of the integrated circuit die. The diffraction grating modulates the phase of a portion of the deflected light beam in response to an integrated circuit signal. A resulting diffraction interference occurs between the phase modulated portions and non-phase modulated portions of the deflected light beam. The interference causes amplitude modulation of a zero order diffraction of the deflected light beam, from which the integrated circuit signal can be extracted.
摘要翻译：一种光学调制器，其通过倒装芯片封装集成电路的背面来调制通过半导体衬底的光。本发明的光调制器能够通过半导体基板的背面提取集成电路信号。在一个实施例中，光学调制器设置在倒装芯片封装集成电路管芯内。光学调制器包括偏转器和衍射光栅。红外光束被引导通过集成电路管芯的硅衬底的背面，通过衍射光栅偏转偏转器并从集成电路管芯的背面退出。衍射光栅响应于集成电路信号调制偏转光束的一部分的相位。在偏转光束的相位调制部分和非相位调制部分之间产生衍射干涉。干扰引起偏转光束的零级衍射的幅度调制，可从中提取集成电路信号。

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