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    • 72. 发明授权
    • Thermal connector for cooling electronics
    • 用于冷却电子元件的热连接器
    • US06882533B2
    • 2005-04-19
    • US10023227
    • 2001-12-14
    • Cullen E. BashChandrakant D. PatelGlenn C. Simon
    • Cullen E. BashChandrakant D. PatelGlenn C. Simon
    • H05K7/20
    • H05K7/20636
    • A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.
    • 一种模块化半导体芯片冷却系统,其具有容易打开的外壳,其限定了配置成容纳承载待冷却部件的印刷电路板的室。 外壳可以包括储存器,冷凝器和泵。 室内的喷雾器可调节地安装在一个或多个支架上,以允许每个喷雾器为其各自部件的单独高度设定。 外壳可以通过快速释放连接容易地从计算机系统中移除。 计算机系统可以包括冷凝器和泵来操作其所有的模块化冷却系统,从各个模块中去除冷凝功能。
    • 73. 发明授权
    • Spray cooling system with cooling regime detection
    • 喷雾冷却系统具有冷却状态检测
    • US06817196B2
    • 2004-11-16
    • US10384456
    • 2003-03-07
    • Christopher G. MaloneCullen E. BashChandrakant D. Patel
    • Christopher G. MaloneCullen E. BashChandrakant D. Patel
    • F28D300
    • G06F1/20F25D19/00F28D15/06G06F2200/201H01L23/4735H01L2924/0002H01L2924/00
    • A cooling system for cooling one or more components that produce heat. The cooling system includes sprayers configured to spray cooling fluid toward the components. A detection system includes a radiation source and a radiation sensor that pass radiant energy in the vicinity of the component such that the radiant energy is affected by passing through the vaporizing spray coolant. A controller controls the flow rates of the sprayers in response to levels of radiant energy detected by the radiation sensor, allowing the controller to more accurately control the wall temperature and cooling regime achieved by the spray cooling. The source and sensor are aimable or otherwise configured for gathering information for different thermal zones of the component, providing the controller with information that is helpful in separately controlling the wall temperature and/or cooling regime in each zone.
    • 用于冷却产生热量的一个或多个部件的冷却系统。 冷却系统包括喷雾器,其构造成朝向部件喷射冷却流体。 检测系统包括辐射源和辐射传感器,辐射源和辐射传感器在组件附近传递辐射能,使得辐射能量通过蒸发的喷射冷却剂而受到影响。 控制器响应于由辐射传感器检测到的辐射能量的水平来控制喷雾器的流量,从而允许控制器更精确地控制通过喷雾冷却实现的壁温和冷却状态。 源和传感器是可瞄准的或以其他方式配置用于收集组件的不同热区的信息,为控制器提供有助于单独控制每个区域中的壁温和/或冷却状态的信息。
    • 75. 发明授权
    • Pressure control of cooling fluid within a plenum
    • 气室内的冷却液压力控制
    • US06747872B1
    • 2004-06-08
    • US10375003
    • 2003-02-28
    • Chandrakant D. PatelCullen E. BashScot Austin
    • Chandrakant D. PatelCullen E. BashScot Austin
    • H05K720
    • H05K7/20745F24F2221/40G06F1/20G06F1/206G06F2200/201H05K7/20836Y02D10/16
    • Cooling fluid pressure within a plenum of a cooling system is controlled by activating the cooling system, sensing a plurality of cooling fluid pressures at a plurality of respective locations within the plenum, determining whether pressure differences between the plurality of sensed cooling fluid pressures are within a predetermined pressure differential, and modulating a variable volume device in response to the pressure differences being outside the predetermined pressure differential. The cooling system is configured to cool racks in a data center and includes a cooling device in fluid communication with the plenum. The plenum is in fluid communication with a vent configured to supply cooling fluid to the racks. The variable volume device is configured to control a flow resistance of cooling fluid within the plenum and is positioned between the plenum and the vent.
    • 通过激活冷却系统来控制冷却系统的集气室内的冷却流体压力,感测在气室内的多个相应位置处的多个冷却流体压力,确定多个感测到的冷却流体压力之间的压力差是否在 预定的压力差,以及响应于所述压力差在所述预定压力差之外调制可变体积装置。 冷却系统被配置为冷却数据中心中的机架,并且包括与集气室流体连通的冷却装置。 气室与配置成向机架供应冷却流体的通风口流体连通。 可变体积装置被配置成控制集气室内的冷却流体的流动阻力并且位于气室和通风口之间。
    • 78. 发明授权
    • Smart cooling of data centers
    • US06574104B2
    • 2003-06-03
    • US09970707
    • 2001-10-05
    • Chandrakant D. PatelCullen E. BashAbdlmonem H. Beitelmal
    • Chandrakant D. PatelCullen E. BashAbdlmonem H. Beitelmal
    • H05K720
    • H05K7/20745F24F2221/40
    • A cooling system is configured to adjust cooling fluid flow to various racks located throughout a data center based upon the detected or anticipated temperatures at various locations throughout the data center. In one respect, by substantially increasing the cooling fluid flow to those racks dissipating greater amounts of heat and by substantially decreasing the cooling fluid flow to those racks dissipating lesser amounts of heat, the amount of energy required to operate the cooling system may be relatively reduced. Thus, instead of operating the devices, e.g., compressors, fans, etc., of the cooling system at substantially 100 percent of the anticipated heat dissipation from the racks, those devices may be operated according to the actual cooling needs. In addition, the racks may be positioned throughout the data center according to their anticipated heat loads to thereby enable computer room air conditioning (CRAC) units located at various positions throughout the data center to operate in a more efficient manner. In one respect, the positioning of the racks may be determined through implementation of numerical modeling and metrology of the cooling fluid flow throughout the data center. In addition, the numerical modeling may be implemented to control the volume flow rate and velocity of the cooling fluid flow through each of the vents.