专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06817196B2 Spray cooling system with cooling regime detection 有权
标题翻译：喷雾冷却系统具有冷却状态检测
公开(公告)号：US06817196B2
公开(公告)日：2004-11-16
申请号：US10384456
申请日：2003-03-07
申请人： Christopher G. Malone , Cullen E. Bash , Chandrakant D. Patel
发明人： Christopher G. Malone , Cullen E. Bash , Chandrakant D. Patel
IPC分类号： F28D300
CPC分类号： G06F1/20 , F25D19/00 , F28D15/06 , G06F2200/201 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A cooling system for cooling one or more components that produce heat. The cooling system includes sprayers configured to spray cooling fluid toward the components. A detection system includes a radiation source and a radiation sensor that pass radiant energy in the vicinity of the component such that the radiant energy is affected by passing through the vaporizing spray coolant. A controller controls the flow rates of the sprayers in response to levels of radiant energy detected by the radiation sensor, allowing the controller to more accurately control the wall temperature and cooling regime achieved by the spray cooling. The source and sensor are aimable or otherwise configured for gathering information for different thermal zones of the component, providing the controller with information that is helpful in separately controlling the wall temperature and/or cooling regime in each zone.
摘要翻译：用于冷却产生热量的一个或多个部件的冷却系统。冷却系统包括喷雾器，其构造成朝向部件喷射冷却流体。检测系统包括辐射源和辐射传感器，辐射源和辐射传感器在组件附近传递辐射能，使得辐射能量通过蒸发的喷射冷却剂而受到影响。控制器响应于由辐射传感器检测到的辐射能量的水平来控制喷雾器的流量，从而允许控制器更精确地控制通过喷雾冷却实现的壁温和冷却状态。源和传感器是可瞄准的或以其他方式配置用于收集组件的不同热区的信息，为控制器提供有助于单独控制每个区域中的壁温和/或冷却状态的信息。

2. 发明授权

US06595014B2 Spray cooling system with cooling regime detection 有权
公开(公告)号：US06595014B2
公开(公告)日：2003-07-22
申请号：US09943797
申请日：2001-08-31
申请人： Christopher G. Malone , Cullen E. Bash , Chandrakant D. Patel
发明人： Christopher G. Malone , Cullen E. Bash , Chandrakant D. Patel
IPC分类号： F28D300
CPC分类号： G06F1/20 , F25D19/00 , F28D15/06 , G06F2200/201 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A cooling system for cooling one or more components that produce heat. The cooling system includes sprayers configured to spray cooling fluid toward the components. A detection system includes a radiation source and a radiation sensor that pass radiant energy in the vicinity of the component such that the radiant energy is affected by passing through the vaporizing spray coolant. A controller controls the flow rates of the sprayers in response to levels of radiant energy detected by the radiation sensor, allowing the controller to more accurately control the wall temperature and cooling regime achieved by the spray cooling. The source and sensor are aimable or otherwise configured for gathering information for different thermal zones of the component, providing the controller with information that is helpful in separately controlling the wall temperature and/or cooling regime in each zone.

3. 发明授权

US06708515B2 Passive spray coolant pump 有权
标题翻译：被动喷雾冷却液泵
公开(公告)号：US06708515B2
公开(公告)日：2004-03-23
申请号：US09945046
申请日：2001-08-31
申请人： Christopher G. Malone , Cullen E. Bash , Chandrakant D. Patel
发明人： Christopher G. Malone , Cullen E. Bash , Chandrakant D. Patel
IPC分类号： F25D1703
CPC分类号： H01L23/4336 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor chip cooling system having a body that forms a cavity configured to create a spray chamber when conformingly adjoined to a chip, or to a substrate or printed circuit board carrying one or more chips. Inkjet-type sprayers are configured to spray cooling fluid down on the chip. A controller transmits a control signal to the sprayer to cause the sprayer to spray at a rate leading to the cooling fluid being vaporized by the semiconductor device. The cooling system uses cooling fluid surface tension forces to draw liquid cooling fluid up a porous member from the spray chamber back to the sprayers, to be sprayed again. The cooling system uses gravity and/or pressure within the spray chamber to direct vaporized cooling fluid upward from the spray chamber to a condenser. The condenser is configured to cool and condense the vapor. A reservoir is positioned below the condenser and above the sprayers so as to receive condensed vapor from the condenser and feed it to the sprayers.
摘要翻译：一种半导体芯片冷却系统，其具有形成空腔的主体，所述空腔被配置为当与芯片相邻地邻接时产生喷雾室，或者携带一个或多个芯片的基板或印刷电路板。喷墨式喷雾器被配置成将冷却流体向下喷射在芯片上。控制器将控制信号发送到喷雾器，以使喷雾器以导致冷却流体被半导体器件汽化的速率喷射。冷却系统使用冷却流体表面张力将液体冷却流体从喷雾室向上抽吸到喷雾器上，以再次喷洒。冷却系统使用喷雾室内的重力和/或压力将蒸发的冷却流体从喷雾室向上引导到冷凝器。冷凝器被配置为冷却并冷凝蒸气。储存器位于冷凝器下方和喷雾器上方，以便从冷凝器接收冷凝的蒸汽并将其送入喷雾器。

4. 发明授权

US08483996B2 Controlled cooling of a data center 有权
公开(公告)号：US08483996B2
公开(公告)日：2013-07-09
申请号：US13173963
申请日：2011-06-30
申请人： Chandrakant D. Patel , Ratnesh K. Sharma , Cullen E. Bash , Abdlmonem H. Beitelmal
发明人： Chandrakant D. Patel , Ratnesh K. Sharma , Cullen E. Bash , Abdlmonem H. Beitelmal
IPC分类号： G06F17/50
CPC分类号： H05K7/20745 , F24F11/30 , F24F11/56 , F24F11/62 , F24F2110/00 , F24F2110/10 , F24F2110/20 , F24F2221/125 , F24F2221/40 , F24F2221/42 , G05D1/024 , G05D1/0255 , G05D2201/0207
摘要： A device for sensing at least one environmental condition in a data center. The device includes a chassis, a propelling mechanism, a power supply, a steering mechanism, and a controller supported on the chassis. The chassis also supports at least one environmental condition sensor and is operable to travel through the data center and sense at least one environmental condition at various locations throughout the data center.

5. 发明申请

US20110263193A1 CONTROLLED COOLING OF A DATA CENTER 有权
标题翻译：数据中心的控制冷却
公开(公告)号：US20110263193A1
公开(公告)日：2011-10-27
申请号：US13173963
申请日：2011-06-30
申请人： Chandrakant D. Patel , Ratnesh K. Sharma , Cullen E. Bash , Abdlmonem H. Beitelmal
发明人： Chandrakant D. Patel , Ratnesh K. Sharma , Cullen E. Bash , Abdlmonem H. Beitelmal
IPC分类号： F24F7/00 , G01C21/00
CPC分类号： H05K7/20745 , F24F11/30 , F24F11/56 , F24F11/62 , F24F2110/00 , F24F2110/10 , F24F2110/20 , F24F2221/125 , F24F2221/40 , F24F2221/42 , G05D1/024 , G05D1/0255 , G05D2201/0207
摘要： A device for sensing at least one environmental condition in a data center. The device includes a chassis, a propelling mechanism, a power supply, a steering mechanism, and a controller supported on the chassis. The chassis also supports at least one environmental condition sensor and is operable to travel through the data center and sense at least one environmental condition at various locations throughout the data center.
摘要翻译：用于感测数据中心中的至少一个环境条件的装置。该装置包括底盘，推进机构，电源，转向机构和支撑在底盘上的控制器。底盘还支持至少一个环境条件传感器，并且可操作地穿过数据中心并感测整个数据中心的各个位置处的至少一个环境状况。

6. 发明授权

US07995339B2 Control of vent tiles correlated with a rack 有权
标题翻译：通风瓦的控制与机架相关
公开(公告)号：US07995339B2
公开(公告)日：2011-08-09
申请号：US10976786
申请日：2004-11-01
申请人： Cullen E. Bash , Chandrakant D. Patel , Ratnesh K. Sharma , Abdlmonem Beitelmal
发明人： Cullen E. Bash , Chandrakant D. Patel , Ratnesh K. Sharma , Abdlmonem Beitelmal
IPC分类号： H05K7/20 , G01M1/38 , F25D23/12 , F24F7/00
CPC分类号： H05K7/20745 , F24F11/30 , F24F11/70 , F24F11/77 , F24F2110/10 , F24F2110/30 , F24F2140/20
摘要： In a method of controlling vent tiles, the vent tiles are initially correlated with at least one rack. A vent tile family (VTF) of the at least one rack is determined, where the VTF includes vent tiles that have at least a predefined level of influence over the at least one rack as determined by the correlation between the vent tiles and the at least one rack. In addition, a vent control family (VCF) from the vent tiles in the VTF is identified, where the VCF includes vent tiles having an associated at least one rack whose inlet condition is outside of a predefined threshold. Moreover, the vent tiles in the VCF are controlled on a weighted basis determined by the correlation between the vent tiles and the at least one rack.
摘要翻译：在控制排气瓦的方法中，排气瓦片最初与至少一个机架相关。确定所述至少一个机架的排气瓦系列（VTF），其中所述VTF包括通气瓦片，所述排气瓦片至少在所述至少一个机架上具有预定水平的影响，由所述排气瓦片与所述至少一个机架之间的相关性确定一个机架此外，识别出来自VTF中的排气瓦的通风控制系列（VCF），其中VCF包括具有相关联的至少一个机架的通风瓦，其入口条件在预定阈值之外。此外，VCF中的排气瓦片是通过由通气瓦片和至少一个支架之间的相关性确定的加权基础来控制的。

7. 发明授权

US07549298B2 Spray cooling with spray deflection 有权
标题翻译：喷雾冷却喷雾偏转
公开(公告)号：US07549298B2
公开(公告)日：2009-06-23
申请号：US11005284
申请日：2004-12-04
申请人： Cullen E. Bash , Chandrakant D. Patel
发明人： Cullen E. Bash , Chandrakant D. Patel
IPC分类号： F25C1/00
CPC分类号： H01L23/4735 , F28D5/00 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/1461 , H01L2924/00 , H01L2224/0401
摘要： A component cooling system including a sprayer configured to eject a stream of cooling fluid and a stream deflector to control deflection of the stream. The sprayer may be continuous or incremental. Excess spray may be deflected into a gutter configured to obstruct cooling fluid from striking the component. The stream deflector may operate using a contact surface, controllable orifice heaters, and/or electrodes is configured to deflect the stream in one or more degrees of freedom. Multiple sprayers may have overlapping spray patterns for redundancy.
摘要翻译：一种部件冷却系统，包括被配置为喷射冷却流体流的喷雾器和流动偏转器，以控制流的偏转。喷雾器可以是连续的或增量的。过多的喷雾可能被偏转到配置成阻挡冷却流体撞击部件的沟槽中。流导流器可以使用接触表面，可控制的孔加热器和/或电极被配置成以一个或多个自由度偏转流。多个喷雾器可能具有重叠的喷雾模式以实现冗余。

8. 发明授权

US07315448B1 Air-cooled heat generating device airflow control system 有权
标题翻译：风冷发热装置气流控制系统
公开(公告)号：US07315448B1
公开(公告)日：2008-01-01
申请号：US11142557
申请日：2005-06-01
申请人： Cullen E. Bash , Abdlmonem H. Beitelmal , Ratnesh K. Sharma , Chandrakant D. Patel
发明人： Cullen E. Bash , Abdlmonem H. Beitelmal , Ratnesh K. Sharma , Chandrakant D. Patel
IPC分类号： H05K7/20 , F25D23/12 , F28F7/00 , H05K5/00
CPC分类号： H05K7/2079 , H05K7/20836
摘要： A system for controlling airflow around an air-cooled heat generating device includes a cooling fluid line and heat exchangers positioned along the cooling fluid line to cool airflow around components in the heat generating device. The heat exchangers are positioned adjacent to the heat generating device such that the heat exchangers are directly in the path of at least one of airflow supplied into the components and airflow exhausted from the components. The system also includes valves positioned along the cooling fluid line to control cooling fluid flow through respective heat exchangers. The system further includes a secondary heat exchanger configured to absorb heat from the cooling fluid and a controller configured to control the valves to thereby control the cooling fluid flow through the heat exchangers.
摘要翻译：用于控制空气冷却发热装置周围的气流的系统包括冷却流体管线和沿着冷却流体管路定位的热交换器，以冷却发热装置内的部件周围的气流。热交换器邻近发热装置定位，使得热交换器直接位于供应到部件中的气流和从部件排出的气流中的至少一个的路径中。该系统还包括沿着冷却流体管线定位的阀，以控制通过相应热交换器的冷却流体流动。该系统还包括被配置为从冷却流体吸收热量的次级热交换器和构造成控制阀从而控制通过热交换器的冷却流体流量的控制器。

9. 发明授权

US07313924B2 Correlation of vent tiles and racks 有权
标题翻译：通风瓦和机架的相关性
公开(公告)号：US07313924B2
公开(公告)日：2008-01-01
申请号：US10960573
申请日：2004-10-08
申请人： Cullen E. Bash , Chandrakant D. Patel , Ratnesh K. Sharma , Abdlmonem Beitelmal
发明人： Cullen E. Bash , Chandrakant D. Patel , Ratnesh K. Sharma , Abdlmonem Beitelmal
IPC分类号： F25D17/00 , F25D23/12 , H05K7/20
CPC分类号： H05K7/20745
摘要： In a method for correlating vent tiles with racks, the vent tiles are opened to a first setting and the mass flow rates of air received by the racks and supplied through the vent tiles are determined. In addition, one of the vent tiles is closed to obtain a second setting and the mass flow rates of air received by the racks and supplied through the vent tiles are determined at the second setting. The vent tiles and the racks are correlated based upon the determined mass flow rates of air received by the racks and the mass flow rates of air supplied through the vent tiles at the first and second settings.
摘要翻译：在将通风瓦与机架相关联的方法中，排气瓦被打开到第一设定，并且确定由机架接收并通过通风瓦片提供的空气的质量流量。此外，一个通气瓦被关闭以获得第二设置，并且在第二设定下确定由机架接收并通过通风瓦片供应的空气的质量流量。排气瓦和机架基于由机架接收的空气的确定的质量流率和在第一和第二设置下通过排气瓦提供的空气的质量流量而相关。

10. 发明授权

US07251547B2 Correlation of vent tile settings and rack temperatures 有权
标题翻译：排气瓦设置和机架温度的相关性
公开(公告)号：US07251547B2
公开(公告)日：2007-07-31
申请号：US10960574
申请日：2004-10-08
申请人： Cullen E. Bash , Chandrakant D. Patel , Ratnesh K. Sharma , Abdlmonem Beitelmal
发明人： Cullen E. Bash , Chandrakant D. Patel , Ratnesh K. Sharma , Abdlmonem Beitelmal
IPC分类号： G05B15/00 , F25D17/00 , F25D17/04
CPC分类号： G05D23/1934
摘要： In a method for correlating vent tiles with racks based upon vent tile settings and rack inlet temperatures, the vent tiles are set to a first setting, the first vent tile settings are recorded and the temperatures at the inlets of the racks are detected at the first vent tile settings. One of the vent tiles is closed to obtain a second setting, the second vent tile settings are recorded and the temperatures at the inlets of the racks are detected at the second vent tile settings. In addition, the vent tiles and the racks are correlated based upon the settings of the vent tiles and the temperatures detected at the first vent tile settings and the second vent tile settings.
摘要翻译：在根据排气瓦设置和机架入口温度将通风瓦与机架相关联的方法中，排气瓦被设置为第一设定，记录第一排气瓦设置，并且在第一次检测到机架入口处的温度通风瓦设置。一个通风瓦片关闭以获得第二设定，记录第二排气瓦设置，并且在第二排气瓦设置处检测机架入口处的温度。此外，排气瓦片和机架基于排气瓦片的设置和在第一排气瓦设置和第二排气瓦设置处检测到的温度而相关。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式