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    • 72. 发明授权
    • Trench isolation for semiconductor devices
    • 半导体器件的沟槽隔离
    • US07071531B2
    • 2006-07-04
    • US10848389
    • 2004-05-19
    • Howard E. Rhodes
    • Howard E. Rhodes
    • H01L29/00
    • H01L27/1463H01L21/76237H01L27/14643H01L27/14689
    • A method of fabricating an integrated circuit includes forming an isolation trench in a semiconductor substrate and partially filling the trench with a dielectric material so that at least the sidewalls of the trench are coated with the dielectric material. Ions are implanted into the substrate in regions directly below the isolation trench after partially filling the trench with the dielectric material. The dielectric along the sidewalls of the trenches can serve as a mask so that substantially all of the ions implanted below the isolation trenches are displaced from the active regions. After the ions are implanted in the substrate below the trenches, the remainder of the trench can be filled with the same or another dielectric material. The trench isolation technique can be used to fabricate memory, logic and imager devices which can exhibit reduced current leakage and/or reduced optical cross-talk.
    • 一种制造集成电路的方法包括在半导体衬底中形成隔离沟槽,并用电介质材料部分地填充沟槽,使得至少沟槽的侧壁被电介质材料涂覆。 在用介电材料部分地填充沟槽之后,将离子注入到隔离沟槽正下方的区域中的衬底中。 沿着沟槽的侧壁的电介质可以用作掩模,使得注入到隔离沟槽下方的基本上所有的离子从活性区域移位。 在离子注入到沟槽下方的衬底中之后,沟槽的其余部分可以用相同或另一种电介质材料填充。 沟槽隔离技术可用于制造可以显示减少的电流泄漏和/或减少的光学串扰的存储器,逻辑和成像器件。
    • 73. 发明授权
    • Single poly CMOS imager
    • 单晶CMOS成像仪
    • US06998657B2
    • 2006-02-14
    • US10688974
    • 2003-10-21
    • Howard E. Rhodes
    • Howard E. Rhodes
    • H01L27/148
    • H01L27/14643H01L27/14689
    • More complete charge transfer is achieved in a CMOS or CCD imager by reducing the spacing in the gaps between gates in each pixel cell, and/or by providing a lightly doped region between adjacent gates in each pixel cell, and particularly at least between the charge collecting gate and the gate downstream to the charge collecting gate. To reduce the gaps between gates, an insulator cap with spacers on its sidewalls is formed for each gate over a conductive layer. The gates are then etched from the conductive layer using the insulator caps and spacers as hard masks, enabling the gates to be formed significantly closer together than previously possible, which, in turn increases charge transfer efficiency. By providing a lightly doped region on between adjacent gates, a more complete charge transfer is effected from the charge collecting gate.
    • 通过减小每个像素单元中的栅极之间的间隙和/或通过在每个像素单元中的相邻栅极之间提供轻掺杂区域,特别是至少在电荷之间,在CMOS或CCD成像器中实现更完整的电荷转移 收集门和下游的门到电荷收集门。 为了减小栅极之间的间隙,在导电层上为每个栅极形成在其侧壁上具有间隔物的绝缘体盖。 然后使用绝缘体盖和间隔物作为硬掩模,从导电层蚀刻栅极,使得栅极能够形成得比先前可能的显着更靠近在一起,这又增加了电荷转移效率。 通过在相邻栅极之间提供轻掺杂区域,从电荷收集栅极实现更完整的电荷转移。
    • 78. 发明授权
    • CMOS imager with a self-aligned buried contact
    • CMOS成像器具有自对准埋地接触
    • US06844580B2
    • 2005-01-18
    • US10361710
    • 2003-02-11
    • Howard E. Rhodes
    • Howard E. Rhodes
    • H01L27/146H01L31/062H01L31/113
    • H01L27/14601H01L27/14636
    • An imaging device formed as a CMOS semiconductor integrated circuit includes a buried contact line between the floating diffusion region and the gate of a source follower output transistor. The self-aligned buried contact in the CMOS imager decreases leakage from the diffusion region into the substrate which may occur with other techniques for interconnecting the diffusion region with the source follower transistor gate. Additionally, the self-aligned buried contact is optimally formed between the floating diffusion region and the source follower transistor gate which allows the source follower transistor to be placed closer to the floating diffusion region, thereby allowing a greater photo detection region in the same sized imager circuit.
    • 形成为CMOS半导体集成电路的成像装置包括在浮动扩散区域和源极跟随器输出晶体管的栅极之间的埋置接触线。 CMOS成像器中的自对准埋入触点减少了从扩散区到衬底的泄漏,这可能与用于将扩散区与源极跟随器晶体管栅互连的其它技术发生。 此外,在浮动扩散区域和源极跟随器晶体管栅极之间最佳地形成自对准埋入触点,其允许源极跟随器晶体管放置得更靠近浮动扩散区域,从而允许在相同尺寸的成像器中的较大光电检测区域 电路。
    • 79. 发明授权
    • Dual doped gates
    • 双掺杂栅极
    • US06821852B2
    • 2004-11-23
    • US09782743
    • 2001-02-13
    • Howard E. Rhodes
    • Howard E. Rhodes
    • H01L218234
    • H01L21/823892H01L21/2652H01L21/823842
    • A method of forming an integrated circuit dual gate structure using only one mask is disclosed. In one embodiment, a substrate is prepared for the fabrication of a dual gate structure, a first gate structure having an NWELL is formed without using a mask, and a second gate structure having a PWELL is formed using only one mask. In an alternate embodiment, a substrate is prepared for the fabrication of a dual gate structure, a first gate structure having a PWELL is formed without using a mask, and a second gate structure having an NWELL is formed using only one mask.
    • 公开了仅使用一个掩模形成集成电路双栅极结构的方法。 在一个实施例中,制备用于制造双栅极结构的衬底,在不使用掩模的情况下形成具有NWELL的第一栅极结构,并且仅使用一个掩模形成具有PWELL的第二栅极结构。 在替代实施例中,准备用于制造双栅极结构的衬底,在不使用掩模的情况下形成具有PWELL的第一栅极结构,并且仅使用一个掩模形成具有NWELL的第二栅极结构。