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    • 72. 发明授权
    • Transparent, impact-resistant molding materials
    • 透明,耐冲击成型材料
    • US5457157A
    • 1995-10-10
    • US174338
    • 1993-12-28
    • Andreas DeckersNorbert GuentherbergKristin Tiefensee
    • Andreas DeckersNorbert GuentherbergKristin Tiefensee
    • C08K5/00C08L25/02C08L25/12C08L33/00C08L33/04C08L33/06C08L33/24C08L35/00C08L51/00C08L51/02C08L51/04C08L51/06C08L73/00C08L79/08
    • C08L33/24C08L51/04C08L25/12C08L33/06
    • Molding materials contain from 5 to 50% by weight of a first polymer obtained by polymerizing a C.sub.1 -C.sub.20 -alkyl ester of methacrylic or acrylic acid;from 5 to 50% by weight of a second polymer obtained by polymerizing a monomer mixture offrom 75 to 82% by weight of a vinyl aromatic monomer and from 18 to 25% by weight of acrylonitrile or methacrylonitrile;from 10 to 40% by weight of a third polymer containing from 10 to 90% by weight of units of the general formula I ##STR1## where R.sup.1 is hydrogen or C.sub.1 -C.sub.4 -alkyl and R.sup.2 is C.sub.1 -C.sub.18 -alkyl, C.sub.5 -C.sub.12 -cycloalkyl, C.sub.6 -C.sub.10 -aryl or C.sub.6 -C.sub.10 -aryl-C.sub.1 -C.sub.4 -alkyl, andfrom 10 to 90% by weight of a C.sub.1 -C.sub.20 -alkyl ester of methacrylic or acrylic acid;from 5 to 60% by weight of a graft copolymer having a mean particle diameter (weight average) of less than 200 nm and obtained by polymerizing from 20 to 70% by weight of a monomer mixture offrom 30 to 100% by weight of a C.sub.1 -C.sub.20 -alkyl ester of methacrylic or acrylic acid andfrom 0 to 70% by weight of a vinyl aromatic monomer in the pressure of from 30 to 80% by weight of a grafting base, obtained by polymerizing at least one monomer selected from the group consisting of butadiene, isoprene, vinylaromatic monomers and C.sub.4 -C.sub.20 -alkyl esters of acrylic acid; andfrom 0 to 20% by weight, of conventional additives. The difference between the refractive index of the graft copolymer and that of the mixture of the first, second and third polymers being less than 0.01.
    • 成型材料含有5至50重量%的通过聚合甲基丙烯酸或丙烯酸的C 1 -C 20烷基酯获得的第一聚合物; 通过将75至82重量%的乙烯基芳族单体和18至25重量%的丙烯腈或甲基丙烯腈的单体混合物聚合而获得的第二聚合物为5至50重量% 10至40重量%的含有10至90重量%的通式I的单元的第三聚合物,其中R1是氢或C1-C4-烷基,R2是C1-C18烷基,C5 -C 12 - 环烷基,C 6 -C 10 - 芳基或C 6 -C 10 - 芳基-C 1 -C 4 - 烷基,以及10至90重量%的甲基丙烯酸或丙烯酸的C 1 -C 20烷基酯; 5〜60重量%的平均粒径(重量平均)小于200nm的接枝共聚物,通过将20〜70重量%的30〜100重量%的单体混合物 甲基丙烯酸或丙烯酸的C 1 -C 20烷基酯和0至70重量%的乙烯基芳族单体,其压力为接枝碱的30至80重量%,通过聚合至少一种选自 由丁二烯,异戊二烯,乙烯基芳族单体和丙烯酸的C 4 -C 20烷基酯组成的组; 和0至20重量%的常规添加剂。 接枝共聚物的折射率与第一,第二和第三聚合物的混合物的折射率之差小于0.01。
    • 74. 发明授权
    • Molding materials based on homo- and copolyamides with olefinic double
bonds
    • 基于具有烯属双键的均聚酰胺和共聚酰胺的成型材料
    • US5266656A
    • 1993-11-30
    • US25881
    • 1993-03-03
    • Walter GoetzBrigitte GareissAndreas DeckersPetra Baierweck
    • Walter GoetzBrigitte GareissAndreas DeckersPetra Baierweck
    • C08K3/34C08G69/02C08G69/26C08G69/36C08K5/03C08K5/51C08K7/02C08L9/00C08L21/00C08L77/00C08L77/02C08L77/04C08L77/06
    • C08L77/00C08G69/02C08G69/26C08G69/36
    • Molding materials are composed ofA) from 40 to 100% by weight, based on the total weight of the molding material, of a polyamide mixture based ona.sub.1) from 5 to 30% by weight, based on the total weight of the polyamide mixture, of at least one homo- or copolyamide that contains olefinic double bonds and comprises.alpha.) from 40 to 100 mol %, based on homo- or copolyamide, of at least one monomer that contains at least one olefinic double bond (monomers .alpha.) from the group of the.alpha..sub.1) olefinically unsaturated lactams,.alpha..sub.2) olefinically unsaturated aminocarboxylic acids,.alpha..sub.3) olefinically unsaturated dicarboxylic acids,.alpha..sub.4) olefinically unsaturated diamines, and.beta.) from 0 to 60 mol %, based on homo- or copolyamide, of at least one monomer that contains no olefinic double bonds (monomers .beta.) from the group of the.beta..sub.1) lactams.beta..sub.2) aminocarboxylic acids,.beta..sub.3) dicarboxylic acids,.beta..sub.4) diamines, anda.sub.2) from 70 to 95% by weight based, on the total weight of the polyamide mixture, of at least one polyamide that contains no olefinic double bonds,B) from 0 to 35% by weight, based on the total weight of the molding material, of an impact-modifying rubber,C) from 0 to 50% by weight, based on the total weight of the molding material, of a filler or reinforcing agent,D) from 0 to 20% by weight, based on the total weight of the molding material, of a flame retardant, and, if desired,E) further additives and aids.
    • 成型材料由下列组成:A)40-100重量%,基于模塑材料的总重量,基于a1)5-30重量%的聚酰胺混合物,基于聚酰胺混合物的总重量 的至少一种含有烯属双键的均聚或共聚酰胺,并且包含α)基于均聚或共聚酰胺的40-100mol%的至少一种含有至少一个烯属双键(单体α)的单体 基于均聚或共聚酰胺的α1)烯属不饱和内酰胺,α2)烯属不饱和氨基羧酸,α3)烯属不饱和二羧酸,α4)烯属不饱和二胺和β)0至60摩尔% 的至少一种不含来自β1)内酰胺β2)氨基羧酸,β3)二羧酸,β4)二胺的烯属双键(单体β)的单体,和a2)70至95% 以总重量计 聚酰胺混合物的至少一种不含烯属双键的聚酰胺,B)0至35重量%,基于成型材料的总重量,冲击改性橡胶,C)为0至 50重量%,基于成型材料的总重量,填料或增强剂,D)0至20重量%,基于成型材料的总重量,阻燃剂,以及如果 所需的,E)其他添加剂和助剂。