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    • 74. 发明申请
    • IMAGE HEATING DEVICE
    • 图像加热装置
    • US20120099882A1
    • 2012-04-26
    • US13279736
    • 2011-10-24
    • MASANOBU TANAKA
    • MASANOBU TANAKA
    • G03G15/20
    • G03G15/205G03G2215/2019
    • An image heating device includes a rotatable member, an opposing member for forming a nip, between itself and the rotatable member, in which recording paper on which an image is carried is to be nip conveyed and heated, and a heater contacting the rotatable member's outer surface and including a belt, a first roller stretching the belt at an upstream side of the rotatable member with respect to a rotational direction of the rotatable member, a second roller downstream of the first roller, and first and second heating portions for heating the first and second rollers to first and second target temperatures, respectively. The device also includes a heating control portion for controlling the heater, and a portion for executing an operation in a control mode in which the second target temperature is set so as to be lower than the first target temperature.
    • 图像加热装置包括可旋转构件,用于在其自身与可旋转构件之间形成辊隙的相对构件,其中承载有图像的记录纸被夹持传送和加热,加热器与可旋转构件的外部接触 表面,并且包括带,第一辊相对于可旋转构件的旋转方向在可旋转构件的上游侧延伸带,第二辊在第一辊的下游,以及第一和第二加热部,用于加热第一 和第二辊分别为第一和第二目标温度。 该装置还包括用于控制加热器的加热控制部分和用于执行其中将第二目标温度设定为低于第一目标温度的控制模式的操作的部分。
    • 77. 发明申请
    • Method of manufacturing electronic device and display
    • 制造电子设备和显示器的方法
    • US20100237380A1
    • 2010-09-23
    • US12656471
    • 2010-02-01
    • Masanobu Tanaka
    • Masanobu Tanaka
    • H01L21/50H01L33/62
    • H01L27/1266H01L24/83H01L24/95H01L27/1214H01L27/3244H01L51/56H01L2224/83192H01L2227/326
    • A method of manufacturing an electronic device includes the steps of: forming a sacrifice layer made of at least one of an alkali metal oxide and an alkali earth metal oxide in a part of a first substrate; forming a supporting layer covering the sacrifice layer; forming an electronic device on the sacrifice layer with the supporting layer in between; exposing at least a part of a side face of the sacrifice layer by removing a part of the supporting layer; forming a support body between the electronic device and the supporting layer, and a surface of the first substrate; removing the sacrifice layer; breaking the support body and transferring the electronic device onto a second substrate by bringing the electronic device into close contact with an adhesion layer provided on a surface of the second substrate; removing a fragment of the support body belonging to the electronic device; removing at least an exposed region in the adhesion layer not covered with the electronic device; and forming a fixing layer on a surface of the electronic device and the surface of the second substrate.
    • 一种制造电子器件的方法包括以下步骤:在第一衬底的一部分中形成由碱金属氧化物和碱土金属氧化物中的至少一种制成的牺牲层; 形成覆盖所述牺牲层的支撑层; 在牺牲层上形成电子器件,其间具有支撑层; 通过移除支撑层的一部分来暴露牺牲层的侧面的至少一部分; 在所述电子设备和所述支撑层之间形成支撑体,以及所述第一基板的表面; 去除牺牲层; 通过使电子装置与设置在第二基板的表面上的粘合层紧密接触来破坏支撑体并将电子装置转移到第二基板上; 去除属于所述电子设备的所述支撑体的片段; 去除未被电子装置覆盖的粘附层中的至少一个暴露区域; 以及在所述电子设备的表面和所述第二基板的表面上形成固定层。