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71. 发明申请

US20110259627A1 Circuit board with buried circuit pattern 审中-公开
标题翻译：电路板埋设电路图案
公开(公告)号：US20110259627A1
公开(公告)日：2011-10-27
申请号：US13067883
申请日：2011-07-01
申请人： Hoe-Ku Jung , Je-Gwang Yoo , Myung-Sam Kang , Ji-Eun Kim , Jeong-Woo Park , Jung-Hyun Park
发明人： Hoe-Ku Jung , Je-Gwang Yoo , Myung-Sam Kang , Ji-Eun Kim , Jeong-Woo Park , Jung-Hyun Park
IPC分类号： H05K1/09 , H05K1/11
CPC分类号： H05K3/205 , H01L21/4846 , H01L23/49816 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/15311 , H05K3/4007 , H05K2201/09745 , H05K2201/10674 , H05K2203/0338 , H05K2203/0435 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49165
摘要： A circuit board includes: an insulator having a groove; a circuit layer filling a portion of the groove; a solder pad on the circuit layer filling the remainder of the groove; and a circuit pattern electrically connected with the circuit layer, the circuit pattern buried in the insulator such that a portion of the circuit pattern is exposed at a surface of the insulator.
摘要翻译：电路板包括：具有凹槽的绝缘体; 填充所述凹槽的一部分的电路层; 电路层上的填充凹槽其余部分的焊盘; 以及与电路层电连接的电路图案，电路图案埋在绝缘体中，使得电路图案的一部分在绝缘体的表面露出。

72. 发明授权

US07970806B2 Methods and apparatus for file management using partitioned file metadata 失效
标题翻译：使用分区文件元数据进行文件管理的方法和装置
公开(公告)号：US07970806B2
公开(公告)日：2011-06-28
申请号：US12015878
申请日：2008-01-17
申请人： Jeong-woo Park , Gwang-ok Go , Jun-young Cho
发明人： Jeong-woo Park , Gwang-ok Go , Jun-young Cho
IPC分类号： G06F17/30
CPC分类号： G06F17/30218 , G06F3/0608 , G06F3/0643 , G06F3/0679 , G06F12/0246 , G06F2212/1044 , G06F2212/7207
摘要： Management of files in a memory, such as a flash memory, includes storing in the memory a first node including a first type of metadata of the file, a second node including data of the file and a third node including a second type of metadata of the file including file status and memory location information for the first and second nodes. The third node may include a node including memory location information for the second node and a node including an index table that cross-references a memory location for the memory location information for the second node to a memory location of the first node. Methods and devices may be provided.
摘要翻译：管理诸如闪速存储器的存储器中的文件包括在存储器中存储包括文件的第一类型的元数据的第一节点，包括文件的数据的第二节点和包括文件的第二类型的第二类型的元数据该文件包括用于第一和第二节点的文件状态和存储位置信息。第三节点可以包括包括用于第二节点的存储器位置信息的节点和包括索引表的节点，所述索引表将用于第二节点的存储器位置信息的存储器位置交叉引用到第一节点的存储器位置。可以提供方法和装置。

73. 发明授权

US07928442B2 Optical device having strained buried channel 有权
标题翻译：具有应变埋入通道的光学器件
公开(公告)号：US07928442B2
公开(公告)日：2011-04-19
申请号：US12441381
申请日：2007-08-17
申请人： Bongki Mheen , Jeong-Woo Park , Hyun-Soo Kim , Gyungock Kim
发明人： Bongki Mheen , Jeong-Woo Park , Hyun-Soo Kim , Gyungock Kim
IPC分类号： H01L31/036
CPC分类号： G02F1/025 , G02F1/2257 , H01L33/0037
摘要： Provided is an optical device having a strained buried channel area. The optical device includes: a semiconductor substrate of a first conductive type; a gate insulating layer formed on the semiconductor substrate; a gate of a second conductive type opposite to the first conductive type, formed on the gate insulating layer; a high density dopant diffusion area formed in the semiconductor substrate under the gate and doped with a first conductive type dopant having a higher density than the semiconductor substrate; a strained buried channel area formed of a semiconductor material having a different lattice parameter from a material of which the semiconductor substrate is formed and extending between the gate insulating layer and the semiconductor substrate to contact the high density dopant diffusion area; and a semiconductor cap layer formed between the gate insulating layer and the strained buried channel area.
摘要翻译：提供了具有应变埋入通道区域的光学装置。该光学器件包括：第一导电类型的半导体衬底; 形成在半导体衬底上的栅极绝缘层; 形成在栅极绝缘层上的与第一导电类型相反的第二导电类型的栅极; 形成在所述半导体衬底下的高密度掺杂剂扩散区，并且掺杂有比所述半导体衬底更高密度的第一导电型掺杂剂; 由半导体材料形成的应变掩埋沟道区域，具有与形成半导体衬底的材料不同的晶格参数，并且在栅极绝缘层和半导体衬底之间延伸以接触高密度掺杂剂扩散区域; 以及形成在栅绝缘层和应变埋入沟道区之间的半导体盖层。

74. 发明申请

US20100187803A1 COVER CAPABLE OF SUPPORTING DIARY OR CALENDAR 审中-公开
标题翻译：可以支持日记或日历
公开(公告)号：US20100187803A1
公开(公告)日：2010-07-29
申请号：US12668637
申请日：2008-07-09
申请人： Jeong Woo Park
发明人： Jeong Woo Park
IPC分类号： B42D3/00
CPC分类号： B42D5/043 , B42D1/06 , B42D3/12 , B42D3/126 , B42P2241/02 , B42P2241/12
摘要： A cover, which is capable of supporting multi-purpose contents and of improving portability and utility, is disclosed. The cover capable of supporting multi-purpose contents includes a front cover and a back cover which are superposed on front and back surfaces of a page unit and are bound by a binder. The front cover includes a main front cover part and a subsidiary front cover part which are separated from each other by a separation line, and an angle holding unit is provided between the main front cover part and the subsidiary front cover part to maintain an angle between the main front cover part and the subsidiary front cover part. Further, a position holding unit may be provided between the front cover and the back cover to hold the front and back covers in a folded or erected position.
摘要翻译：公开了一种能够支持多用途内容并提高便携性和效用的封面。能够支撑多用途内容物的盖子包括前盖和后盖，该前盖和后盖重叠在页单元的前表面和后表面上并且由粘合剂约束。前盖包括通过分隔线彼此分离的主前盖部分和辅助前盖部分，并且在主前盖部分和辅助前盖部分之间设置有角度保持单元，主前盖部分和辅助前盖部分。此外，位置保持单元可以设置在前盖和后盖之间，以将前盖和后盖保持在折叠或竖立的位置。

75. 发明申请

US20100013094A1 SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：US20100013094A1
公开(公告)日：2010-01-21
申请号：US12503274
申请日：2009-07-15
申请人： Chajea JO , Uihyoung LEE , Jae-hyun PHEE , Jeong-Woo PARK , Ha-Young YIM
发明人： Chajea JO , Uihyoung LEE , Jae-hyun PHEE , Jeong-Woo PARK , Ha-Young YIM
IPC分类号： H01L23/498
CPC分类号： H01L21/563 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/17 , H01L2224/0401 , H01L2224/05558 , H01L2224/06051 , H01L2224/06102 , H01L2224/1146 , H01L2224/11472 , H01L2224/11505 , H01L2224/11902 , H01L2224/11912 , H01L2224/13027 , H01L2224/13082 , H01L2224/13111 , H01L2224/13113 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/14104 , H01L2224/1411 , H01L2224/14131 , H01L2224/17107 , H01L2224/73204 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/014 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor package and a method of manufacturing the semiconductor package. The semiconductor package include a substrate including a plurality of pads and a plurality of bumps evenly disposed on an entire region of the substrate regardless of an arrangement of the plurality of pads. According to the present invention, a simplification of a process can be accomplished, a cost of a process can be reduced, reliability can be improved and an under-filling can become easy.
摘要翻译：半导体封装以及半导体封装的制造方法。半导体封装包括基板，其包括多个焊盘和均匀地设置在基板的整个区域上的多个凸块，而与多个焊盘的布置无关。根据本发明，可以实现工艺的简化，可以降低工艺成本，可以提高可靠性，并且能够容易地进行填充不足。

76. 发明申请

US20090100115A1 Methods and Apparatus for File Management Using Partitioned File Metadata 失效
标题翻译：使用分区文件元数据进行文件管理的方法和装置
公开(公告)号：US20090100115A1
公开(公告)日：2009-04-16
申请号：US12015878
申请日：2008-01-17
申请人： Jeong-woo Park , Gwang-ok Go , Jun-young Cho
发明人： Jeong-woo Park , Gwang-ok Go , Jun-young Cho
IPC分类号： G06F12/02
CPC分类号： G06F17/30218 , G06F3/0608 , G06F3/0643 , G06F3/0679 , G06F12/0246 , G06F2212/1044 , G06F2212/7207
摘要： Management of files in a memory, such as a flash memory, includes storing in the memory a first node including a first type of metadata of the file, a second node including data of the file and a third node including a second type of metadata of the file including file status and memory location information for the first and second nodes. The third node may include a node including memory location information for the second node and a node including an index table that cross-references a memory location for the memory location information for the second node to a memory location of the first node. Methods and devices may be provided.
摘要翻译：管理诸如闪速存储器的存储器中的文件包括在存储器中存储包括文件的第一类型的元数据的第一节点，包括文件的数据的第二节点和包括文件的第二类型的第二类型的元数据该文件包括用于第一和第二节点的文件状态和存储位置信息。第三节点可以包括包括用于第二节点的存储器位置信息的节点和包括索引表的节点，所述索引表将用于第二节点的存储器位置信息的存储器位置交叉引用到第一节点的存储器位置。可以提供方法和装置。

77. 发明申请

US20090011220A1 Carrier and method for manufacturing printed circuit board 审中-公开
标题翻译：载体和制造印刷电路板的方法
公开(公告)号：US20090011220A1
公开(公告)日：2009-01-08
申请号：US12153155
申请日：2008-05-14
申请人： Jung-Hyun Park , Jeong-Woo Park , Sang-Duck Kim , Jong-Gyu Choi , Ji-Eun Kim , Myung-Sam Kang
发明人： Jung-Hyun Park , Jeong-Woo Park , Sang-Duck Kim , Jong-Gyu Choi , Ji-Eun Kim , Myung-Sam Kang
IPC分类号： H05K1/05 , B29C65/42 , B32B7/00 , B32B7/12
CPC分类号： H05K3/205 , H05K3/108 , H05K3/4602 , H05K2203/1536 , Y10T428/249984 , Y10T428/31504 , Y10T428/31511 , Y10T428/3154 , Y10T428/31678 , Y10T428/31721 , Y10T428/31993
摘要： A carrier and a method for manufacturing a printed circuit board are disclosed. The method for manufacturing a printed circuit board may include: forming a first circuit pattern on each of a pair of release layers, which are attached respectively to either side of a base layer by adhesive layers; detaching the pair of release layers from the base layer; stacking and pressing the pair of release layers onto either side of an insulation substrate such that the first circuit patterns are buried in the insulation substrate; and separating the pair of release layers. By forming a circuit pattern on each of a pair of release layers with a single process, and transferring the circuit pattern into each side of an insulation substrate, the manufacturing process can be shortened and circuit patterns can be formed to a high density.
摘要翻译：公开了载体和制造印刷电路板的方法。制造印刷电路板的方法可以包括：在一对剥离层中的每一个上形成第一电路图案，其分别通过粘合剂层附着在基层的任一侧; 将一对释放层从基层分离; 堆叠并将一对释放层压在绝缘基板的任一侧上，使得第一电路图案被埋在绝缘基板中; 并分离一对释放层。通过利用单一工艺在一对释放层的每一个上形成电路图案，并将电路图案转移到绝缘基板的每一侧，可以缩短制造工艺并且可以以高密度形成电路图案。

78. 发明申请

US20080310909A1 Ring Binder 审中-公开
标题翻译：活页夹
公开(公告)号：US20080310909A1
公开(公告)日：2008-12-18
申请号：US12094978
申请日：2005-12-08
申请人： Jeong-Woo Park
发明人： Jeong-Woo Park
IPC分类号： B42F13/20
CPC分类号： B42F13/26
摘要： A ring binder includes at least two first and second pipes which are hollow inside; a first ring positioned at an end of the first pipe to be opened and closed; a second ring positioned between the first pipe and the second pipe to be opened and closed; a third ring positioned at an end of the second pipe to be opened and closed; and a support bar passing through the first and second pipes and the first through third rings and holding the first and third rings so that the first and third rings are not separated from the first and second pipes, wherein ends of first, second, and third stationary half rings are combined with and separated from ends of first, second, and third rotating half rings.
摘要翻译：环形活页夹包括至少两个在内部是中空的第一和第二管道; 第一环，其位于所述第一管的端部以被打开和关闭; 位于第一管和第二管之间的第二环，其被打开和关闭; 位于所述第二管的端部以打开和关闭的第三环; 以及支撑杆，其穿过第一和第二管和第一至第三环并保持第一和第三环，使得第一和第三环不与第一和第二管分离，其中第一，第二和第三环的端部固定半环与第一，第二和第三旋转半环的端部组合并与其分离。

79. 发明申请

US20080101045A1 Circuit board and manufacturing method thereof 有权
标题翻译：电路板及其制造方法
公开(公告)号：US20080101045A1
公开(公告)日：2008-05-01
申请号：US11976070
申请日：2007-10-19
申请人： Hoe-Ku Jung , Je-Gwang Yoo , Myung-Sam Kang , Ji-Eun Kim , Jeong-Woo Park , Jung-Hyun Park
发明人： Hoe-Ku Jung , Je-Gwang Yoo , Myung-Sam Kang , Ji-Eun Kim , Jeong-Woo Park , Jung-Hyun Park
IPC分类号： H05K1/18 , H05K3/20
CPC分类号： H05K3/205 , H01L21/4846 , H01L23/49816 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/15311 , H05K3/4007 , H05K2201/09745 , H05K2201/10674 , H05K2203/0338 , H05K2203/0435 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49165
摘要： A method of manufacturing a circuit board, which includes a bump pad on which a solder bump may be placed, may include forming a solder pad on a surface of a first carrier; forming a metal film, which covers the solder pad and which extends to a bump pad forming region; forming a circuit layer and a circuit pattern, which are electrically connected with the metal film, on a surface of the first carrier; pressing the first carrier and an insulator such that a surface of the first carrier and the insulator faces each other; and removing the first carrier. Utilizing this method, the amount of solder for the contacting of a flip chip can be adjusted, and solder can be filled inside the board, so that after installing a chip, the overall thickness of the package can be reduced.
摘要翻译：一种制造电路板的方法，包括可以放置焊锡凸块的凸块焊盘，可以包括在第一载体的表面上形成焊盘; 形成覆盖焊盘并延伸到凸块焊盘形成区域的金属膜; 在所述第一载体的表面上形成与所述金属膜电连接的电路层和电路图案; 按压所述第一载体和绝缘体，使得所述第一载体和所述绝缘体的表面彼此面对; 并移除第一载体。利用这种方法，可以调节用于接合倒装芯片的焊料的量，并且可以在板内填充焊料，使得在安装芯片之后，可以减小封装的整体厚度。

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