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71. 发明专利

JP2010222429A Hydrogen production method and device 有权
标题翻译：氢生产方法和装置
公开(公告)号：JP2010222429A
公开(公告)日：2010-10-07
申请号：JP2009069512
申请日：2009-03-23
申请人： Hitachi Kyowa Engineering Co Ltd , Rei Okawa , 令大川 , 日立協和エンジニアリング株式会社
发明人： INAGE SHINICHI , OGURA TOSHIO , OGURO TOMOKATSU , KUGA MASUMI , OKAWA REI
IPC分类号： C10J3/46 , C10J3/00 , C10J3/48
摘要： PROBLEM TO BE SOLVED: To provide a method and a device for hydrogen production, capable of further improving reaction efficiency between a carbon material and steam and therefore hydrogen production efficiency. SOLUTION: The hydrogen production method comprises: applying a microwave to the carbon material 2 and the steam 1 fed to a reactor 10; and heating the carbon material with the microwave and inducing its reaction with the steam so as to produce hydrogen and carbon monoxide. In the hydrogen production process, a rotational flow 18 of the steam is formed in the reactor 10 so as to secure an air retention time of the carbon material in the steam. The microwave is applied to the carbon material and the steam in an air retention space so as to produce hydrogen and carbon monoxide. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够进一步提高碳材料与蒸汽之间的反应效率，从而提高氢生产效率的氢生产方法和装置。解决方案：氢气制备方法包括：向碳材料2和供给到反应器10的蒸汽1施加微波; 并用微波加热碳材料并引起与蒸汽的反应，以产生氢气和一氧化碳。在氢生产过程中，在反应器10中形成蒸汽的旋转流18，以确保碳材料在蒸汽中的空气滞留时间。将微波应用于空气滞留空间中的碳材料和蒸汽，以产生氢气和一氧化碳。版权所有（C）2011，JPO＆INPIT

72. 发明专利

JP2008279435A Method, apparatus and system for treating organic matter contained in wastewater, and bitumen recovery system 有权
标题翻译：用于处理废水中有机物的处理方法和装置以及二次回收系统
公开(公告)号：JP2008279435A
公开(公告)日：2008-11-20
申请号：JP2008086902
申请日：2008-03-28
申请人： Hitachi Kyowa Engineering Co Ltd , Hitachi Ltd , 日立協和エンジニアリング株式会社 , 株式会社日立製作所
发明人： HONCHI AKIO , ISHII HAYAHITO , MOCHIZUKI AKIRA , SAHO NORIHIDE , TSUYAMA TSUTOMU , ISOKAMI HISASHI
IPC分类号： C02F1/28 , B01D33/06 , B01J20/34 , C02F1/46 , C02F1/52 , C02F1/72 , C10G1/00
CPC分类号： C02F1/28 , B01J20/18 , B01J20/20 , B01J20/3408 , B01J20/3416 , B01J20/3441 , C02F1/281 , C02F1/283 , C02F1/4674 , C02F1/488 , C02F1/52 , C02F9/00 , C02F2001/46138 , C02F2201/4617 , C02F2201/46185 , C02F2209/08 , C02F2303/16
摘要： PROBLEM TO BE SOLVED: To provide a method, apparatus, and system for treating organic matter contained in waste water, which can efficiently desorb and decompose an organic matter adsorbed on an adsorbent after the separation of an organic matter contained in wastewater, and to provide a bitumen recovery system. SOLUTION: In this method for treating organic matter contained in wastewater, wastewater is supplied into an adsorption tank 2 packed with an adsorbent 3 to adsorb the organic matter on the adsorbent 3. An electrolyzed water obtained by energizing an anode 9 and a cathode 8 in an electrolysis tank 6 to electrolyze water containing an electrolyte is supplied to and brought into contact with the adsorbent 3 with the organic matter adsorbed thereon to desorb or decompose the organic matter adsorbed on the adsorbent 3. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：待解决的问题：提供一种用于处理废水中的有机物质的方法，装置和系统，其能够在分离废水中含有的有机物质之后有效地解吸和分解吸附在吸附剂上的有机物质，并提供沥青回收系统。解决方案：在这种处理废水中所含有机物质的方法中，将废水供给到装有吸附剂3的吸附罐2中，以将有机物质吸附在吸附剂3上。通过使阳极9和供给含有电解质的水的电解槽6中的阴极8与吸附剂3接触，吸附有机物以吸附或分解吸附剂3上吸附的有机物。版权所有（C））2009，JPO＆INPIT

73. 发明专利

JP2008275440A Carbon nanotube cantilever for scanning probe microscope and method of manufacturing the same, and scanning probe microscope 审中-公开
标题翻译：碳纳米管扫描仪用于扫描探针显微镜及其制造方法和扫描探针显微镜
公开(公告)号：JP2008275440A
公开(公告)日：2008-11-13
申请号：JP2007119201
申请日：2007-04-27
申请人： Hitachi Kenki Fine Tech Co Ltd , Hitachi Kyowa Engineering Co Ltd , 日立協和エンジニアリング株式会社 , 日立建機ファインテック株式会社
发明人： HIROOKA MASAYUKI , HIDAKA KISHIFU , HAYASHIBARA MITSUO , MORIMOTO TAKASHI , SEKINO SATOSHI , TANAKA HIROKI , TAKASHINA MASATO , UOZUMI YUKI
IPC分类号： G01Q60/38 , G01Q70/12
摘要： PROBLEM TO BE SOLVED: To approach unevenness of sample surface and measure surface state at high resolution by solving such problems as destruction, deformation of a base probe, destruction of a jointed part, caused by distortion and slipping of the CNT probe, which cause problems in observing the sample surface with a scanning probe microscope using a CNT cantilever.
SOLUTION: In a cantilever for a scanning probe microscope which measures surface state with a CNT probe joined to a base probe, the tip part of the base probe is non-sharpened. Moreover, when the cantilever is arranged in measuring state, the non-sharpened tip part of the base probe is arranged closer to the sample surface than the tip of the joined part. With this arrangement, when the CNT probe, due to distortion or slipping, collides with the sample surface, destruction and deformation of the tip part of the base probe and tip part of the joined part can be prevented to provide the CNT cantilever having high durability for a scanning probe microscope.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了通过解决由CNT探针的变形和滑动引起的基底探针的破坏，变形，接合部件的破坏等问题，以高分辨率来测量样品表面的不均匀性并测量表面状态，这使得使用CNT悬臂的扫描探针显微镜观察样品表面的问题。
解决方案：在用与探针连接的CNT探针测量表面状态的扫描探针显微镜的悬臂中，基底探针的尖端部分不被削尖。此外，当悬臂布置在测量状态时，基底探针的非锋利尖端部分比接合部分的尖端更靠近样品表面。通过这种布置，当CNT探针由于变形或滑动与样品表面碰撞时，可以防止基底探针的末端部分和接合部分的尖端部分的破坏和变形，从而提供具有高耐久性的CNT悬臂用于扫描探针显微镜。版权所有（C）2009，JPO＆INPIT

74. 发明专利

JP2007324447A Electronic component mounting substrate, and electronic component and device 有权
标题翻译：电子元件安装基板和电子元件和器件
公开(公告)号：JP2007324447A
公开(公告)日：2007-12-13
申请号：JP2006154445
申请日：2006-06-02
申请人： Hitachi Kyowa Engineering Co Ltd , 日立協和エンジニアリング株式会社
发明人： HATA SHOHEI , MATSUSHIMA NAOKI , SAKAMOTO EIJI , HIROSE KAZUHIRO , TOMOBE TETSUYA , TAKEMORI HIDEAKI , KOIZUMI TOSHIAKI , FUJINAGA TAKESHI
IPC分类号： H01L21/52 , H01L21/60
CPC分类号： H01L24/32 , H01L24/73 , H01L2224/16225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/01322 , H01L2924/15174 , H01L2924/15311 , H01L2924/15787 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a solder coating, the surface oxidization of which can be prevented for a long term, the connection to which can be performed with fluxless method at a low temperature, and the micropattern formation of which can be performed.
SOLUTION: An electronic component mounting board 300 or an electronic component comprises a substrate 1, metallized layers 2 to 4 which are formed on the substrate, and a soldering part 5 which is formed on a portion of a surface of the metallized layer 4 with Bi-Sn as the main ingredient. The surface oxidization of the soldering part 5 is prevented by forming an Ag film 6 on the surface of the soldering part 5 having the Bi-Sn as the main ingredient. Furthermore, the soldering part 5 is connected to an Au metallized layer 12 or an Au bump to form an Au-Sn compound 13 and a Bi-rich structure 14, and to improve a thermal resistance of the connection.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供可以长期防止其表面氧化的焊料涂层，可以在低温下用无焊剂方法进行连接，并且其微观形式可以是执行。解决方案：电子部件安装板300或电子部件包括基板1，形成在基板上的金属化层2〜4，以及形成在金属化层的表面的一部分上的焊接部5 4以Bi-Sn为主要成分。通过在具有Bi-Sn的焊接部5的表面上形成Ag膜6来防止焊接部5的表面氧化。此外，焊接部分5连接到Au金属化层12或Au凸块以形成Au-Sn化合物13和富含Bi的结构14，并且提高连接的热阻。版权所有（C）2008，JPO＆INPIT

75. 发明专利

JP2007256049A Cantilever, and inspecting apparatus using it 审中-公开
标题翻译： CANTILEVER和检查设备使用它
公开(公告)号：JP2007256049A
公开(公告)日：2007-10-04
申请号：JP2006080306
申请日：2006-03-23
申请人： Hitachi Kenki Fine Tech Co Ltd , Hitachi Kyowa Engineering Co Ltd , 日立協和エンジニアリング株式会社 , 日立建機ファインテック株式会社
发明人： HIDAKA KISHIFU , HIROOKA MASAYUKI , HAYASHIBARA MITSUO , FUJIEDA TADASHI , TANAKA HIROKI , TAKASHINA MASATO , UOZUMI YUKI , MORIMOTO TAKASHI , SEKINO SATOSHI
IPC分类号： G01Q60/24 , G01Q60/36 , G01Q60/38 , G01Q70/00 , G01Q70/12
摘要： PROBLEM TO BE SOLVED: To prevent slip of a probe in a contact type cantilever having the carbon-made probe.
SOLUTION: Metal such as tungsten, platinum, gold, aluminum and molybdenum is applied to a sample contact part of the probe tip of the cantilever having the probe formed of a carbon nanotube or high-density carbon. Slip of the probe is suppressed and highly accurate image data can be acquired. The probe is made of heterocarbon, the deformation of the probe can be prevented, and more highly accurate image data can be acquired.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了防止具有碳制探针的接触型悬臂中的探针滑动。解决方案：将金属如钨，铂，金，铝和钼施加到具有由碳纳米管或高密度碳形成的探针的悬臂的探针尖端的样品接触部分。抑制了探针的滑移，可以获得高精度的图像数据。探头由异质碳化物制成，可以防止探头的变形，并可获得更高精度的图像数据。版权所有（C）2008，JPO＆INPIT

76. 发明专利

JP2007064812A Probe for inspection device, and method for manufacturing same 审中-公开
标题翻译：用于检查装置的检测装置及其制造方法
公开(公告)号：JP2007064812A
公开(公告)日：2007-03-15
申请号：JP2005251767
申请日：2005-08-31
申请人： Hitachi Kenki Fine Tech Co Ltd , Hitachi Kyowa Engineering Co Ltd , 日立協和エンジニアリング株式会社 , 日立建機ファインテック株式会社
发明人： HIDAKA KISHIO , HIROOKA MASAYUKI , HAYASHIBARA MITSUO , FUJIEDA TADASHI , TANAKA HIROKI , BUSHI NORIAKI , MORIMOTO TAKASHI , SEKINO SATOSHI
IPC分类号： B82B1/00 , G01Q60/38 , G01Q70/12 , G01Q70/16
摘要： PROBLEM TO BE SOLVED: To provide a cantilever capable of solving a noise in an image caused by buckling and bending of a carbon nanotube, that is a problem in observation of a sample surface by an atomic force microscope (AMF) or the like using the cantilever with the carbon nanotube, so as to acquire a stable AFM image, and the AFM of high resolution using the same.
SOLUTION: The present invention provides the cantilever with the carbon nanotube with a metal layer deposited on the carbon nanotube from at least opposed two directions in the vicinity of a tip of the cantilever, and a manufacturing method therefor. Resultingly, an exposed length of a carbon nanotube probe is controlled to prevent the carbon nanotube from being buckled when contacting with a sample.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供能够解决由碳纳米管弯曲和弯曲引起的图像中的噪声的悬臂，这是通过原子力显微镜（AMF）或样品表面观察样品表面的问题像使用具有碳纳米管的悬臂，以获得稳定的AFM图像，并且使用相同的高分辨率的AFM。解决方案：本发明提供了具有碳纳米管的悬臂，其具有从悬臂的尖端附近的至少相对的两个方向沉积在碳纳米管上的金属层及其制造方法。因此，控制碳纳米管探针的暴露长度以防止当与样品接触时碳纳米管弯曲。版权所有（C）2007，JPO＆INPIT

77. 发明专利

JP2005054206A Plating unit, plating apparatus and plating method 审中-公开
标题翻译：涂层单元，镀层装置和镀层方法
公开(公告)号：JP2005054206A
公开(公告)日：2005-03-03
申请号：JP2003206196
申请日：2003-08-06
申请人： Hitachi Kyowa Engineering Co Ltd , 日立協和エンジニアリング株式会社
发明人： KATSUYAMA KUNIO , EGUCHI TAKEYA , MAKI TAKUMI
IPC分类号： C23C18/31 , C25D7/12 , C25D17/00 , C25D21/10 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive plating apparatus of a dipping type by simplifying an operation and reducing the number of part items.
SOLUTION: A plating unit or the plating apparatus has a plating tank having an opening on a side face, and a substrate stage for holding an article to be plated, which is separated after having been pressed to the opening so as to close it. The substrate stage has the center of its back side connected to a revolving arm unit with a longer radius than that of the substrate stage through a spherical bearing, and is moved toward a horizontal direction while being rotated by a rotating action of the revolving arm unit.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过简化操作和减少零件的数量来提供一种廉价的浸渍型电镀装置。电镀单元或电镀装置具有在侧面具有开口的电镀槽，以及用于保持要被电镀的物品的基板台，该基板台被压到开口之后被分离以封闭它。衬底台的后侧的中心通过球面轴承连接到具有比衬底台的半径更长的半径的旋转臂单元，并且通过旋转臂单元的旋转动作旋转而向水平方向移动。版权所有（C）2005，JPO＆NCIPI

78. 发明专利

JP2004268076A Automatic welding method and automatic welding apparatus 审中-公开
公开(公告)号：JP2004268076A
公开(公告)日：2004-09-30
申请号：JP2003060783
申请日：2003-03-07
申请人： Hitachi Kyowa Engineering Co Ltd , Hitachi Ltd , 日立協和エンジニアリング株式会社 , 株式会社日立製作所
发明人： IMANAGA AKIYOSHI , HANEDA MITSUAKI , SEKI TATSURO , TOYODA SEIICHI , SATO TOSHIMI
IPC分类号： B23K9/09 , B23K9/095 , B23K9/127 , H02M9/00
摘要： PROBLEM TO BE SOLVED: To provide a welding method and a welding apparatus which are suitable to change the length of a power feeding cable used in arc welding using a welding wire as an electrode.
SOLUTION: In the a welding work of joint members which requires to change the length of the power feeding cable, average welding voltage E in which average arc voltage Va corresponding to the magnitude of desired average welding current Ia, the predicted value of first cable voltage Vk1 which is consumed by average welding current Ia which flows the round-trip length of a changed power feeding cable and first reactor voltage V
L 1 which is consumed in a reactor on a welding circuit are preliminarily added is set to a pulse welding power source 10 and desired average arc voltage Va is outputted in an arc welding part. By setting the pulse voltage Vp or the pulse current Ip is set by which a second reactor voltage Vk2 which is consumed by the pulse current Ip which flows the round-trip length of the changed power feeding cable and a second reactor voltage V
L 2 which is consumed in the reactor on the welding circuit can be replenished and outputting the desired pulse current Ia and the pulse arc voltage Va, welding is performed.
COPYRIGHT: (C)2004,JPO&NCIPI

79. 发明专利

JP2004174522A Composite solder, production method therefor, and electronic equipment 审中-公开
公开(公告)号：JP2004174522A
公开(公告)日：2004-06-24
申请号：JP2002341218
申请日：2002-11-25
申请人： Hitachi Kyowa Engineering Co Ltd , Hitachi Ltd , 日立協和エンジニアリング株式会社 , 株式会社日立製作所
发明人： SOGA TASAO , HATA HIDEYOSHI , OKAMOTO MASAHIDE , IKEDA YASUSHI , AIDA TOSHIYUKI , SUGISAWA HIROSHI
IPC分类号： B23K1/00 , B23K35/14 , B23K35/26 , B23K35/40 , B23K101/40 , C22C49/00 , C22C111/00 , C22C121/02 , H01L21/52 , H05K3/34
CPC分类号： H01L24/743 , H01L24/27 , H01L24/29 , H01L24/75 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2224/83101 , H01L2924/00011 , H01L2924/01015 , H01L2924/01047 , H01L2924/01322 , H01L2924/10253 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/207 , H01L2924/00 , H01L2924/00014 , H01L2924/0002 , H01L2924/00012 , H01L2924/01005 , H01L2924/01033
摘要： PROBLEM TO BE SOLVED: To provide solder which can be used for solder connection on the high temperature side in temperature hierarchical connection in a Pb-free state. SOLUTION: The composite solder 1 is composed in such a manner that metal nets 2 made of Cu are held between two pieces of solder foils and press-fixed. By rolling the metal nets 2 and the solder foils 3 so as to be piled in this way, Sn in the solder foils 3 infiltrates into the gaps of the metal nets 2. The composite solder 1 is used for temperature hierarchical connection such as die bonding of a semiconductor chip. On the die bonding, the semiconductor chip is contacted with the mounting face of a wiring board via the composite solder 1, and bonding is caused while performing heating and pressurizing. COPYRIGHT: (C)2004,JPO

80. 发明专利

JP2004124111A Electroplating method and apparatus for substrate having fine via hole 审中-公开
公开(公告)号：JP2004124111A
公开(公告)日：2004-04-22
申请号：JP2002285693
申请日：2002-09-30
申请人： Denso Corp , Fujitsu Ltd , Hitachi Kyowa Engineering Co Ltd , Sony Corp , ソニー株式会社 , 富士通株式会社 , 日立協和エンジニアリング株式会社 , 株式会社デンソー
发明人： KADOTA HIROYUKI , YONEMURA HITOSHI , HOSHINO MASATAKA , TOMISAKA MANABU
IPC分类号： C25D5/18 , C25D7/12 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide an electroplating method and an apparatus therefor by which a metal can be filled into a fine via hole without causing defects.
SOLUTION: In electroplating for a semiconductor 1 or a compound substrate having fine wiring and Via holes, energizing is performed so as to optionally change pulse electrolysis conditions in accordance with the ratio between the opening size and depth of the hole, so that electroplating is filled into the Via hole. As for the pulse electrolysis conditions, energizing current density and the ratio of the energizing/halting time are set in accordance with the ratio between the opening size and depth of the Via hole, and the thickness or electric resistance of an electroconductive film formed on the substrate.
COPYRIGHT: (C)2004,JPO

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