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1. 发明专利

JP2006152377A Plating device and plating method 有权
标题翻译：镀层装置和镀层方法
公开(公告)号：JP2006152377A
公开(公告)日：2006-06-15
申请号：JP2004345066
申请日：2004-11-30
申请人： Hitachi Kyowa Engineering Co Ltd , 日立協和エンジニアリング株式会社
发明人： MAKI TAKUMI , SUGANO RYUICHI , KADOTA HIROYUKI
IPC分类号： C25D17/00 , C25D7/12 , C25D17/06
摘要： PROBLEM TO BE SOLVED: To provide a plating device where a new plating liquid can be easily fed to the surface of the object to be plated having a deep hole, a deep groove or a hole having a high aspect ratio, and plating can be performed at high speed, and to provide a plating method therefor.
SOLUTION: In the plating device comprising: a plating tank; an anode plate arranged at the plating tank; and a holding means of holding the object to be plated arranged so as to be confronted with the anode plate, the plating tank has a passage wall of forming a plating liquid passage allowing a plating liquid to flow in one direction, and the passage wall has an opening part corresponding to the surface requiring plating in the object to be plated.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种电镀装置，其中可以将新的电镀液容易地供给到具有深孔，深沟槽或具有高纵横比的孔的被电镀物体的表面，以及电镀可以高速进行，并提供其电镀方法。解决方案：在电镀装置中，包括：镀槽; 布置在镀槽处的阳极板; 以及保持装置，其保持被布置成与阳极板相对的布置对象，镀槽具有形成电镀液通道的通道壁，允许电镀液体沿一个方向流动，并且通道壁具有对应于要镀覆的物体中需要电镀的表面的开口部分。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2005054206A Plating unit, plating apparatus and plating method 审中-公开
标题翻译：涂层单元，镀层装置和镀层方法
公开(公告)号：JP2005054206A
公开(公告)日：2005-03-03
申请号：JP2003206196
申请日：2003-08-06
申请人： Hitachi Kyowa Engineering Co Ltd , 日立協和エンジニアリング株式会社
发明人： KATSUYAMA KUNIO , EGUCHI TAKEYA , MAKI TAKUMI
IPC分类号： C23C18/31 , C25D7/12 , C25D17/00 , C25D21/10 , H01L21/288
摘要： PROBLEM TO BE SOLVED: To provide an inexpensive plating apparatus of a dipping type by simplifying an operation and reducing the number of part items.
SOLUTION: A plating unit or the plating apparatus has a plating tank having an opening on a side face, and a substrate stage for holding an article to be plated, which is separated after having been pressed to the opening so as to close it. The substrate stage has the center of its back side connected to a revolving arm unit with a longer radius than that of the substrate stage through a spherical bearing, and is moved toward a horizontal direction while being rotated by a rotating action of the revolving arm unit.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：通过简化操作和减少零件的数量来提供一种廉价的浸渍型电镀装置。电镀单元或电镀装置具有在侧面具有开口的电镀槽，以及用于保持要被电镀的物品的基板台，该基板台被压到开口之后被分离以封闭它。衬底台的后侧的中心通过球面轴承连接到具有比衬底台的半径更长的半径的旋转臂单元，并且通过旋转臂单元的旋转动作旋转而向水平方向移动。版权所有（C）2005，JPO＆NCIPI

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