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    • 61. 发明申请
    • One-transistor floating-body DRAM cell in bulk CMOS process with electrically isolated charge storage region
    • 具有电隔离电荷存储区域的大容量CMOS工艺中的单晶体管浮体DRAM单元
    • US20040061148A1
    • 2004-04-01
    • US10676695
    • 2003-09-30
    • Monolithic System Technology, Inc.
    • Fu-Chieh Hsu
    • H01L027/148H01L029/768
    • H01L27/108H01L27/0214H01L27/10802H01L27/10873H01L29/7841
    • A one-transistor, floating-body (1T/FB) dynamic random access memory (DRAM) cell is provided that includes a field-effect transistor fabricated using a process compatible with a standard CMOS process. The field-effect transistor includes a source region and a drain region of a first conductivity type and a floating body region of a second conductivity type, opposite the first conductivity type, located between the source region and the drain region. A buried region of the first conductivity type is located under the source region, drain region and floating body region. The buried region helps to form a depletion region, which is located between the buried region and the source region, the drain region and the floating body region. The floating body region is thereby isolated by the depletion region. A bias voltage can be applied to the buried region, thereby controlling leakage currents in the 1T/FB DRAM cell.
    • 提供了一个单晶体管浮体(1T / FB)动态随机存取存储器(DRAM)单元,其包括使用与标准CMOS工艺兼容的工艺制造的场效应晶体管。 场效应晶体管包括位于源极区域和漏极区域之间的第一导电类型的源极区域和漏极区域以及与第一导电类型相反的第二导电类型的浮动体区域。 第一导电类型的掩埋区域位于源极区域,漏极区域和浮体区域的下方。 掩埋区域有助于形成耗尽区,其位于掩埋区域与源极区域,漏极区域和浮体区域之间。 浮体区由此被耗尽区隔离。 可以将偏置电压施加到掩埋区域,从而控制1T / FB DRAM单元中的漏电流。
    • 64. 发明申请
    • Non-volatile memory system
    • 非易失性存储器系统
    • US20020008271A1
    • 2002-01-24
    • US09948163
    • 2001-09-06
    • Monolithic System Technology, Inc.
    • Fu-Chieh HsuWingyu Leung
    • H01L029/76H01L027/108
    • H01L27/11521G11C7/20G11C16/0416G11C2216/10H01L21/28273H01L27/11558H01L29/66825
    • A non-volatile memory (NVM) system includes a NVM cell having: a semiconductor region having a first conductivity type; a gate dielectric layer located over the semiconductor region; a gate electrode located over the gate dielectric layer; a source region and a drain region of a second conductivity type, opposite the first conductivity type, located in the semiconductor region and aligned with the gate electrode; a crown electrode having a base that contacts the gate electrode and walls that extend vertically from the base region, away from the gate electrode; a dielectric layer located over the crown electrode, wherein the dielectric layer extends over at least interior surfaces of the walls; and a plate electrode located over the dielectric layer, wherein the plate electrode extends over at least interior surfaces of the walls.
    • 非易失性存储器(NVM)系统包括具有:具有第一导电类型的半导体区域的NVM单元; 位于所述半导体区域上方的栅介质层; 位于所述栅极电介质层上方的栅电极; 与第一导电类型相反的第二导电类型的源极区域和漏极区域,位于半导体区域中并与栅电极对准; 冠电极,其具有与栅电极接触的基极和从基极区域垂直延伸的壁,远离栅电极; 位于所述冠状电极之上的电介质层,其中所述电介质层至少在所述壁的内表面上延伸; 以及位于所述电介质层上方的平板电极,其中所述平板电极至少在所述壁的内表面上延伸。
    • 65. 发明授权
    • System utilizing a DRAM array as a next level cache memory and method
for operating same
    • 利用DRAM阵列作为下一级高速缓冲存储器的系统及其操作方法
    • US6128700A
    • 2000-10-03
    • US942254
    • 1997-10-01
    • Fu-Chieh HsuWingyu Leung
    • Fu-Chieh HsuWingyu Leung
    • G06F12/00G06F12/06G06F12/08
    • G06F12/0893G06F12/0855G06F12/0879G06F12/0897G06F12/10G11C11/406G11C11/4076G11C11/4096G11C7/10G11C7/1018G11C7/1051G11C7/1069G11C7/1078G11C7/1096
    • A method and structure for implementing a DRAM memory array as a second level cache memory in a computer system. The computer system includes a central processing unit (CPU), a first level SRAM cache memory, a CPU bus coupled to the CPU, and a second level cache memory which includes a DRAM array coupled to the CPU bus. When accessing the DRAM array, row access and column decoding operations are performed in a self-timed asynchronous manner. Predetermined sequences of column select operations are then performed in a synchronous manner with respect to a clock signal. A widened data path is provided to the DRAM array, effectively increasing the data rate of the DRAM array. By operating the DRAM array at a higher data rate than the CPU bus, additional time is provided for precharging the DRAM array. As a result, the precharging of the DRAM array is transparent to the CPU bus. A structure and method control the refresh and internal operations of the DRAM array.
    • 一种用于在计算机系统中实现DRAM存储器阵列作为第二级高速缓冲存储器的方法和结构。 计算机系统包括中央处理单元(CPU),第一级SRAM缓存存储器,耦合到CPU的CPU总线,以及包括连接到CPU总线的DRAM阵列的第二级高速缓冲存储器。 当访问DRAM阵列时,以自定时的异步方式执行行访问和列解码操作。 然后以相对于时钟信号的同步方式执行列选择操作的预定序列。 向DRAM阵列提供加宽的数据路径,有效地增加DRAM阵列的数据速率。 通过以比CPU总线更高的数据速率操作DRAM阵列,为DRAM阵列预充电提供了额外的时间。 结果,DRAM阵列的预充电对CPU总线是透明的。 一种结构和方法来控制DRAM阵列的刷新和内部操作。
    • 67. 发明授权
    • Method and structure for implementing a cache memory using a DRAM array
    • 使用DRAM阵列实现高速缓冲存储器的方法和结构
    • US5829026A
    • 1998-10-27
    • US812000
    • 1997-03-05
    • Wingyu LeungFu-Chieh Hsu
    • Wingyu LeungFu-Chieh Hsu
    • G06F12/08
    • G06F12/0897G06F12/0893
    • A method and structure for implementing a DRAM memory array as a second level cache memory in a computer system. The computer system includes a central processing unit (CPU), a first level SRAM cache memory, a CPU bus coupled to the CPU, and a second level cache memory which includes a DRAM array coupled to the CPU bus. When accessing the DRAM array, row access and column decoding operations are performed in a self-timed asynchronous manner. Predetermined sequences of column select operations are then performed in a synchronous manner with respect to a clock signal. The DRAM array is operated at a higher frequency than the frequency of the CPU bus clock signal, thereby reducing the access latency of the DRAM array. By operating the DRAM array at a higher frequency than the CPU bus, additional time is provided for precharging the DRAM array. As a result, the precharging of the DRAM array is transparent to the CPU bus.
    • 一种用于在计算机系统中实现DRAM存储器阵列作为第二级高速缓冲存储器的方法和结构。 计算机系统包括中央处理单元(CPU),第一级SRAM缓存存储器,耦合到CPU的CPU总线,以及包括连接到CPU总线的DRAM阵列的第二级高速缓冲存储器。 当访问DRAM阵列时,以自定时的异步方式执行行访问和列解码操作。 然后以相对于时钟信号的同步方式执行列选择操作的预定序列。 DRAM阵列的操作频率高于CPU总线时钟信号的频率,从而降低了DRAM阵列的访问延迟。 通过以比CPU总线更高的频率操作DRAM阵列,为DRAM阵列的预充电提供了额外的时间。 结果,DRAM阵列的预充电对CPU总线是透明的。
    • 69. 发明授权
    • Method and structure for controlling internal operations of a DRAM array
    • 用于控制DRAM阵列的内部操作的方法和结构
    • US5708624A
    • 1998-01-13
    • US757866
    • 1996-11-27
    • Wingyu Leung
    • Wingyu Leung
    • G11C7/10G11C8/18G11C11/4076G11C11/4091G11C7/00
    • G11C8/18G11C11/4076G11C11/4091G11C7/1072
    • A method and structure for controlling the timing of an access to a DRAM array in response to a row access (RAS#) signal and the rising and/or falling edges of a clock signal. Row address decoding and the deactivation of equalization circuits are initiated when the row access signal is received and a first transition of the clock signal is detected. The row address decoding and the deactivation of the equalization circuits are completed before a second transition of the clock signal occurs. The second transition is then used to initiate the turning on of the sense amplifiers of the DRAM array. The sense amplifiers are turned on before a third transition of the clock signal. The third transition of the clock signal is then used to initiate the column address decoding operation of the DRAM array. In an alternative embodiment, the column address decoding is initiated when a column access (CAS#) signal is asserted and the clock signal undergoes the third transition. The first, second and third transitions can be consecutive or non-consecutive edges of the clock signal. A test mode is included which allows the DRAM array to be operated asynchronously for testing purposes.
    • 响应于行访问(RAS#)信号和时钟信号的上升沿和/或下降沿来控制对DRAM阵列的访问的定时的方法和结构。 当接收到行访问信号并且检测到时钟信号的第一次转换时,行地址解码和均衡电路的去激活。 在时钟信号的第二次转换发生之前,行地址解码和均衡电路的去激活完成。 然后第二个转变用于启动DRAM阵列的读出放大器的导通。 读出放大器在时钟信号的第三次转换之前导通。 时钟信号的第三次转换然后用于启动DRAM阵列的列地址解码操作。 在替代实施例中,当列访问(CAS#)信号被断言并且时钟信号经历第三转换时,启动列地址解码。 第一,第二和第三转换可以是时钟信号的连续或不连续的边缘。 包括测试模式,允许DRAM阵列异步运行以进行测试。