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61. 发明授权

US6124629A Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip 失效
标题翻译：半导体装置包括使密封的半导体芯片的后表面露出的树脂密封构件
公开(公告)号：US6124629A
公开(公告)日：2000-09-26
申请号：US168097
申请日：1998-10-08
申请人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
发明人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L23/31 , H01L23/495 , H01L25/10 , H01L29/06 , H05K1/14 , H05K1/18 , H05K3/34
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/4951 , H01L23/49555 , H01L23/49558 , H01L23/49568 , H01L23/49586 , H01L24/05 , H01L24/06 , H01L25/105 , H01L29/0657 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05624 , H01L2224/06136 , H01L2224/16 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/73215 , H01L2224/85205 , H01L2224/8592 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H05K1/144 , H05K1/181 , H05K3/3421 , Y10T29/49121
摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.
摘要翻译：由于半导体芯片尺寸大，高集成度和加速度，所以难以将半导体芯片与包装中的引线组合在一起。鉴于这种困难，已经采用称为半导体和引线堆叠和封装的称为“片上引线”或“引线芯片”结构的封装结构。在该结构的封装中，根据本发明，内引线和半导体芯片的前端部之间的间隙比除引导端部和半导体芯片之外的内引线部分之间的间隙宽，从而减小杂散容量，提高信号传输速率和减少电气噪声。

62. 发明授权

US6100115A Semiconductor device 失效
公开(公告)号：US6100115A
公开(公告)日：2000-08-08
申请号：US166121
申请日：1998-10-05
申请人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
发明人： Gen Murakami , Kunihiro Tsubosaki , Masahiro Ichitani , Kunihiko Nishi , Ichiro Anjo , Asao Nishimura , Makoto Kitano , Akihiro Yaguchi , Sueo Kawai , Masatsugu Ogata , Syuuji Eguchi , Hiroyoshi Kokaku , Masanori Segawa , Hiroshi Hozoji , Takashi Yokoyama , Noriyuki Kinjo , Aizo Kaneda , Junichi Saeki , Shozo Nakamura , Akio Hasebe , Hiroshi Kikuchi , Isamu Yoshida , Takashi Yamazaki , Kazuyoshi Oshima , Tetsuro Matsumoto
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L23/31 , H01L23/495 , H01L25/10 , H01L29/06 , H05K1/14 , H05K1/18 , H05K3/34
CPC分类号： H01L24/32 , H01L23/3107 , H01L23/4951 , H01L23/49555 , H01L23/49558 , H01L23/49568 , H01L23/49586 , H01L24/05 , H01L24/06 , H01L25/105 , H01L29/0657 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05624 , H01L2224/06136 , H01L2224/16 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/73215 , H01L2224/85205 , H01L2224/8592 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/01043 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01092 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H05K1/144 , H05K1/181 , H05K3/3421 , Y10T29/49121
摘要： As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.

63. 发明授权

US5854508A Semiconductor memory device having zigzag bonding pad arrangement 失效
标题翻译：具有之字形焊盘布置的半导体存储器件
公开(公告)号：US5854508A
公开(公告)日：1998-12-29
申请号：US618381
申请日：1996-03-19
申请人： Kazuhiko Kajigaya , Kazuyuki Miyazawa , Manabu Tsunozaki , Kazuyoshi Oshima , Takashi Yamazaki , Yuji Sakai , Jiro Sawada , Yasunori Yamaguchi , Tetsurou Matsumoto , Shinji Udo , Hiroshi Yoshioka , Hirokazu Saito , Mitsuhiro Takano , Makoto Morino , Sinichi Miyatake , Eiji Miyamoto , Yasuhiro Kasama , Akira Endo , Ryoichi Hori , Jun Etoh , Masashi Horiguchi , Shinichi Ikenaga , Atsushi Kumata
发明人： Kazuhiko Kajigaya , Kazuyuki Miyazawa , Manabu Tsunozaki , Kazuyoshi Oshima , Takashi Yamazaki , Yuji Sakai , Jiro Sawada , Yasunori Yamaguchi , Tetsurou Matsumoto , Shinji Udo , Hiroshi Yoshioka , Hirokazu Saito , Mitsuhiro Takano , Makoto Morino , Sinichi Miyatake , Eiji Miyamoto , Yasuhiro Kasama , Akira Endo , Ryoichi Hori , Jun Etoh , Masashi Horiguchi , Shinichi Ikenaga , Atsushi Kumata
IPC分类号： G11C5/00 , G11C5/02 , G11C11/406 , H01L23/485 , H01L23/48
CPC分类号： H01L24/05 , G11C11/406 , G11C5/025 , H01L24/06 , H01L24/48 , H01L2224/04042 , H01L2224/05553 , H01L2224/05556 , H01L2224/05624 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/48624 , H01L2224/73215 , H01L24/45 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01021 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01033 , H01L2924/01037 , H01L2924/01038 , H01L2924/01039 , H01L2924/01041 , H01L2924/01043 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01054 , H01L2924/01055 , H01L2924/01058 , H01L2924/01059 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01087 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/3011 , H01L2924/3025 , Y10S257/908
摘要： Herein disclosed is a semiconductor memory device, in which peripheral circuits are arranged in a cross area of a semiconductor chip composed of the longitudinal center portions and the transverse center portions, and in which memory arrays are arranged in the four regions which are divided by the cross area. Thanks to this structure in which the peripheral circuits are arranged at the center portion of the chip, the longest signal transmission paths can be shortened to about one half of the chip size to speed up the DRAM which is intended to have a large storage capacity.
摘要翻译：这里公开了一种半导体存储器件，其中外围电路布置在由纵向中心部分和横向中心部分组成的半导体芯片的交叉区域中，并且其中存储器阵列布置在由交叉区域。由于外围电路布置在芯片的中心部分的这种结构，最长的信号传输路径可以缩短到芯片尺寸的大约一半，以加快DRAM的大容量。

64. 发明授权

US5777978A Disk unit and process for assembling transmission mechanism used for driving head carriage 失效
标题翻译：用于驱动头架的组合传动机构的磁盘单元和过程
公开(公告)号：US5777978A
公开(公告)日：1998-07-07
申请号：US432173
申请日：1995-06-26
申请人： Toshiro Ota , Masakatsu Hosoya , Takashi Yamazaki
发明人： Toshiro Ota , Masakatsu Hosoya , Takashi Yamazaki
IPC分类号： G11B7/085 , G11B17/04 , G11B21/04 , G11B21/02
CPC分类号： G11B17/056 , G11B21/046 , G11B7/08582 , G11B7/085
摘要： Coil springs 96 and 97 are incorporated in a driving-side transmission mechanism 61 so as to absorb backlashes between a rack 55 and a drive gear 59a. Since the respective backlashes between the drive gear 59a and the rack 55 are absorbed by way of the coil springs 96 and 97, merely phase matching at the sole driving-side transmission mechanism 61 is required as phase matching work of toothed portions of gears during assembly, thereby simplifying the assembling task and shortening assembly time. Additionally, since a coil spring is not included in the rack 55, the rack can be designed to be small-sized in its width direction, thereby minimizing the moment of a force about the meshed engagement point, acting on an optical head carriage 53, and reducing transfer loss in the head.
摘要翻译： PCT No.PCT / JP94 / 01510 Sec。 371日期：1995年6月26日 102（e）日期1995年6月26日PCT 1994年9月12日PCT PCT。公开号WO95 / 08172 日期1995年3月23日线弹簧96和97并入驱动侧传动机构61中，以吸收齿条55与驱动齿轮59a之间的间隙。由于驱动齿轮59a和齿条55之间的相应的间隙被螺旋弹簧96和97吸收，因此仅需要在底部驱动侧传动机构61处的相位匹配作为在组装期间齿轮的齿形部分的相位匹配工作从而简化组装任务，缩短装配时间。此外，由于螺旋弹簧不包括在齿条55中，所以齿条可以被设计成在其宽度方向上的尺寸小，从而最小化作用在光学头滑架53上的啮合接合点周围的力的力矩，并减少头部的转移损失。

65. 发明授权

US4949617A Apparatus for applying and dispensing masking paper 失效
标题翻译：用于施加和分配掩蔽纸的装置
公开(公告)号：US4949617A
公开(公告)日：1990-08-21
申请号：US271874
申请日：1988-11-16
申请人： Takashi Yamazaki
发明人： Takashi Yamazaki
IPC分类号： B05B15/04 , B65H35/00 , C09J7/02
CPC分类号： B65H35/004 , B05B15/0456 , C09J7/02 , C09J2203/31 , Y10T83/8784 , Y10T83/8822 , Y10T83/9454
摘要： A masking paper is wound in a roll form and includes a relatively thin synthetic resin film folded in a plurality of parallel pleats and a relatively thick tape disposed along a longitudinal margin of the film and having a pressure sensitive adhesive layer formed on the opposite sides thereof. An apparatus for applying and dispensing the masking paper includes a housing accommodating the masking paper in a roll form, a group of rolls for taking the masking paper out of the housing and a cutter blade for cutting the masking paper. The cutter blade is reciprocated back and forth across the masking paper, and is retracted from the masking paper during its movement from a starting position.
摘要翻译：掩模纸以卷状卷绕，并且包括折叠成多个平行褶皱的相对薄的合成树脂膜和沿着膜的纵向边缘布置的相对厚的带，并且在其相对侧上形成有压敏粘合剂层。用于施加和分配掩模纸的装置包括容纳卷状掩模纸的壳体，用于将掩模纸从壳体中取出的一组辊和用于切割掩模纸的切割刀。切割刀片在掩模纸上往复运动，并且在从起始位置移动时从掩模纸退回。

66. 发明授权

US4930583A Portable battery-powered tool 失效
标题翻译：便携式电池供电工具
公开(公告)号：US4930583A
公开(公告)日：1990-06-05
申请号：US255824
申请日：1988-10-11
申请人： Fusao Fushiya , Takashi Yamazaki , Mikio Saito
发明人： Fusao Fushiya , Takashi Yamazaki , Mikio Saito
IPC分类号： B25D17/04 , B25F5/00 , B25F5/02
CPC分类号： B25F5/003 , B25D17/04 , B25F5/02
摘要： A portable, cordless battery-powered tool with a relatively small overall length is provided. A handle section forms the rearmost part of the tool. An electric motor is located below a spindle and forwardly of the handle section. The motor has a rotatable shaft located in parallel with the spindle. The handle section is provided with a switch trigger which is substantially aligned with the central axis of the spindle at its top.
摘要翻译：提供了一种具有相对较小总体长度的便携式，无绳电池供电的工具。手柄部分形成工具的最后部分。电动机位于主轴下方并且在手柄部分的前方。电动机具有与主轴平行的旋转轴。手柄部分设置有开关触发器，其在其顶部基本上与心轴的中心轴线对准。

67. 外观设计

USD300230S Combined tape dispenser and cutter blade 失效
公开(公告)号：USD300230S
公开(公告)日：1989-03-14
申请号：US809917
申请日：1985-12-17
申请人： Takashi Yamazaki
设计人： Takashi Yamazaki

68. 发明授权

US4641794A Wire accumulator 失效
标题翻译：蓄电池
公开(公告)号：US4641794A
公开(公告)日：1987-02-10
申请号：US669153
申请日：1984-11-07
申请人： Takashi Yamazaki , Katsuji Sakamoto
发明人： Takashi Yamazaki , Katsuji Sakamoto
IPC分类号： B65H51/26 , B65H51/20 , B65H51/22 , C03B37/00
CPC分类号： B65H51/20
摘要： An accumulator wherein the peripheral speeds of separate, accumulating guide roller assemblies are caused by respective independent mechanical arrangements to coincide with the take-up speeds of first and second take-up devices. Using this arrangement, the speed of the optical fiber being accumulated is always equal to the peripheral speed of the accumulating guide rollers so that there is no instantaneous tension change that would otherwise result from a backlash of interconnecting gears.
摘要翻译：一种蓄能器，其中单独的累积引导辊组件的圆周速度是由各自独立的机械装置引起的，以与第一和第二卷绕装置的卷取速度一致。使用这种布置，被累积的光纤的速度总是等于累积导辊的圆周速度，使得不会由互连齿轮的间隙引起的瞬时张力变化。

69. 发明授权

US09601979B2 Alloy material for R-T-B system rare earth permanent magnet, method for producing R-T-B system rare earth permanent magnet, and motor 有权
公开(公告)号：US09601979B2
公开(公告)日：2017-03-21
申请号：US13876348
申请日：2011-09-02
申请人： Kenichiro Nakajima , Takashi Yamazaki
发明人： Kenichiro Nakajima , Takashi Yamazaki
IPC分类号： C22C38/00 , H02K21/00 , B22F1/00 , H01F1/057 , H01F41/02 , C22C38/06 , C22C38/10 , C22C38/16 , C22C33/02 , H01F1/06 , C22C1/02
CPC分类号： H02K21/00 , B22F1/0003 , C22C1/02 , C22C33/0278 , C22C38/002 , C22C38/005 , C22C38/06 , C22C38/10 , C22C38/16 , H01F1/0577 , H01F1/06 , H01F41/0266
摘要： An alloy material for an R-T-B system rare earth permanent magnet having a high orientation rate and high coercivity (Hcj), and a method for producing an R-T-B system rare earth permanent magnet using the alloy material. The alloy material includes a plurality of R-T-B system alloys having different compositions and a metal powder. The respective R-T-B system alloys are formed of R which is composed of two or more kinds selected from rare earth elements, T which is composed of a transition metal essentially containing Fe, B, and unavoidable impurities. A first alloy having the greatest Dy content contains 17 mass % or greater of Dy, and a Dy concentration difference between the first alloy and a second alloy having the smallest Dy concentration difference with respect to the first alloy among the plurality of R-T-B system alloys is 5 mass % or greater.

70. 发明授权

US09552826B2 Frequency characteristic modification device 有权
标题翻译：频率特性修改装置
公开(公告)号：US09552826B2
公开(公告)日：2017-01-24
申请号：US14373721
申请日：2012-12-14
申请人： Masaru Kimura , Takashi Yamazaki
发明人： Masaru Kimura , Takashi Yamazaki
IPC分类号： G10L21/0208 , H04R3/04 , H03G5/16 , H03G9/00 , H03G9/02 , G10L21/0232
CPC分类号： G10L21/0208 , G10L21/0232 , H03G5/165 , H03G9/005 , H03G9/025 , H04R3/04
摘要： A device includes a HPF 702 that modifies frequency characteristics of a target signal; a phase correcting unit 701 that corrects the phase characteristics of the target signal to make the phase characteristics nearly equal to phase characteristics of the HPF 702; a first multiplier 705 that adjusts the gain of the signal output from the phase correcting unit 701; a second multiplier 706 that adjusts the gain of the signal output from the HPF 702; a coefficient determining unit that determines the gain coefficients of the first and second multipliers 705 and 706 in such a manner that the sum of the gain coefficient of the first multiplier 705 and the gain coefficient of the second multiplier 706 becomes a fixed value; and an adder 713 that adds the two signals output from the first multiplier 705 and second multiplier 706.
摘要翻译：装置包括修改目标信号的频率特性的HPF 702; 相位校正单元701，其校正目标信号的相位特性，以使相位特性几乎等于HPF 702的相位特性; 调整从相位校正单元701输出的信号的增益的第一乘法器705; 调节从HPF 702输出的信号的增益的第二乘法器706; 系数确定单元，其以第一乘法器705的增益系数和第二乘法器706的增益系数的和变为固定值的方式确定第一和第二乘法器705和706的增益系数; 以及将从第一乘法器705和第二乘法器706输出的两个信号相加的加法器713。

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