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    • 62. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08799560B2
    • 2014-08-05
    • US13389260
    • 2010-06-18
    • Satoru Hanzawa
    • Satoru Hanzawa
    • G06F12/00
    • G11C13/0004G11C13/004G11C13/0061G11C13/0069G11C13/0097
    • A high-speed large-capacity phase-change memory is achieved. A semiconductor device according to the present invention includes: a plurality of memory planes MP; a plurality of storage information register groups SDRBK paired with the plurality of memory planes; and a chip control circuit CPCTL. The plurality of memory planes include a plurality of memory cells. Also, the plurality of storage information register groups temporarily retain information to be stored in the plurality of memory planes. Further, the chip control circuit includes a register which temporarily stores a value indicating volume of the storage information, and a first storage information volume is smaller than a second storage information volume. When the first storage information volume is written, the plurality of memory planes and the plurality of storage information register groups are activated during a first period. When the second storage information volume is written, the plurality of memory planes and the plurality of storage information register groups are activated during a second period. By such a structure, the first period is shorter than the second period.
    • 实现了高速大容量相变存储器。 根据本发明的半导体器件包括:多个存储器平面MP; 与多个存储器平面配对的多个存储信息寄存器组SDRBK; 和芯片控制电路CPCTL。 多个存储器平面包括多个存储单元。 此外,多个存储信息寄存器组临时保留要存储在多个存储器平面中的信息。 此外,芯片控制电路包括临时存储指示存储信息的卷的值的寄存器,并且第一存储信息量小于第二存储信息量。 当第一存储信息量被写入时,多个存储器平面和多个存储信息寄存器组在第一时段期间被激活。 当第二存储信息量被写入时,多个存储器平面和多个存储信息寄存器组在第二时段期间被激活。 通过这种结构,第一周期比第二周期短。
    • 64. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08248843B2
    • 2012-08-21
    • US12986178
    • 2011-01-07
    • Satoru HanzawaYoshikazu Iida
    • Satoru HanzawaYoshikazu Iida
    • G11C11/00
    • G11C13/0069G11C13/0004G11C13/004G11C2213/79
    • In a memory array MCA which includes memory cells MC each having a variable-resistance-based memory device RQ and a select transistor MQ, an object is to receive a fixed quantity of storage data for a short time, and to realize writing operation to the memory cell, with suppressed peak current. In order to achieve the object, the data bus occupation time in rewriting operation is shortened by using plural sense amplifiers and storing storage data temporarily, and plural programming circuits are provided and activated using the control signals with different phases. By the above, the phase change memory system with low current consumption can be realized, without causing degradation of the utilization ratio of the data bus.
    • 在包括具有可变电阻的存储器件RQ和选择晶体管MQ的存储单元MC的存储器阵列MCA中,目的是在短时间内接收固定量的存储数据,并且实现对 存储单元,具有抑制的峰值电流。 为了实现该目的,通过使用多个读出放大器和临时存储存储数据来缩短重写操作中的数据总线占用时间,并且使用具有不同相位的控制信号来提供和激活多个编程电路。 通过上述,可以实现具有低电流消耗的相变存储器系统,而不会降低数据总线的利用率。
    • 66. 发明申请
    • SEMICONDUCTOR STORAGE DEVICE
    • 半导体存储设备
    • US20100061132A1
    • 2010-03-11
    • US12516690
    • 2006-12-07
    • Yoshihisa FujisakiSatoru HanzawaKenzo KurotsuchiNozomu MatsuzakiNorikatsu Takaura
    • Yoshihisa FujisakiSatoru HanzawaKenzo KurotsuchiNozomu MatsuzakiNorikatsu Takaura
    • G11C11/00H01L45/00G11C5/02G11C7/00
    • H01L45/144G11C13/0004G11C13/0069G11C2213/75H01L27/2436H01L27/2463H01L27/2472H01L45/06H01L45/1233
    • In a semiconductor storage device such as a phase change memory, a technique which can realize high integration is provided. The semiconductor storage device includes a phase change thin film 101 having two stable phases of a crystal state with low electric resistance and an amorphous state with high electric resistance, upper plug electrodes 102 and 103 provided on one side of the phase change thin film 101, a lower electrode 104 provided on the other side of the phase change thin film 101, a selecting transistor 114 whose drain/source terminals are connected to the upper plug electrode 102 and the lower electrode 104, and a selecting transistor 115 whose drain/source terminals are connected to the upper plug electrode 103 and the lower electrode 104, and a first memory cell is configured with the selecting transistor 114 and a phase change region 111 in the phase change thin film 101 sandwiched between the upper plug electrode 102 and the lower electrode 104, and a second memory cell is configured with the selecting transistor 115 and a phase change region 112 in the phase change thin film 101 sandwiched between the upper plug electrode 103 and the lower electrode 104.
    • 在诸如相变存储器的半导体存储装置中,提供了可以实现高集成度的技术。 半导体存储装置包括:具有低电阻的晶体状态的两个稳定相和具有高电阻的非晶态的相变薄膜101,设置在相变薄膜101一侧的上部插塞电极102和103, 设置在相变薄膜101的另一侧的下部电极104,漏极/源极端子连接到上部插塞电极102和下部电极104的选择晶体管114,以及选择晶体管115,其漏极/源极端子 连接到上插头电极103和下电极104,并且第一存储单元配置有夹在上插头电极102和下电极之间的相变薄膜101中的选择晶体管114和相变区域111 104,并且第二存储单元配置有夹在b中的相变薄膜101中的选择晶体管115和相变区域112 在上塞电极103和下电极104之间。