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    • 63. 发明授权
    • Lateral semiconductor device and manufacturing method for the same
    • 侧面半导体器件及其制造方法相同
    • US08871643B2
    • 2014-10-28
    • US13976266
    • 2011-02-08
    • Hiroomi EguchiTakashi OkawaAtsushi Onogi
    • Hiroomi EguchiTakashi OkawaAtsushi Onogi
    • H01L21/302H01L29/66H01L29/423H01L29/739H01L21/306
    • H01L29/6625H01L21/30604H01L29/4236H01L29/66325H01L29/7394
    • A manufacturing method for manufacturing a lateral semiconductor device having an SOI (Silicon on Insulator) substrate, the lateral semiconductor device comprising a semiconductor layer that includes a buried oxide layer and a drift region, the manufacturing method comprising an etching process of etching, by a predetermined depth, a LOCOS oxide that projects from a surface of the semiconductor layer by a predetermined thickness and is embedded in the semiconductor layer by a predetermined thickness, and a trench forming process of simultaneously forming a first trench extending from the drift region toward the buried oxide layer, and a second trench extending from a portion obtained by the etching in the etching process toward the buried oxide layer, at a same etching rate, and stopping forming the first trench and the second trench at a time when the second trench reaches the buried oxide layer.
    • 一种用于制造具有SOI(绝缘体上硅)衬底的横向半导体器件的制造方法,所述横向半导体器件包括包括掩埋氧化物层和漂移区的半导体层,所述制造方法包括通过蚀刻的蚀刻工艺, 预定深度,从半导体层的表面突出预定厚度并以预定厚度嵌入到半导体层中的LOCOS氧化物,以及沟槽形成工艺,其同时形成从漂移区延伸到掩埋的第一沟槽 氧化物层,以及从蚀刻处理中通过蚀刻获得的部分以相同的蚀刻速率向掩埋氧化物层延伸的第二沟槽,并且在第二沟槽到达第二沟槽时停止形成第一沟槽和第二沟槽 掩埋氧化层。