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    • 6. 发明申请
    • INSPECTION METHOD AND INSPECTION APPARATUS
    • 检验方法和检验装置
    • US20120050729A1
    • 2012-03-01
    • US13202727
    • 2009-12-04
    • Kenji MitomoKenji Oka
    • Kenji MitomoKenji Oka
    • G01N21/00
    • G01N21/9501G01N21/94G01N21/956G01N2021/4707G01N2021/8822
    • Technical ProblemIn the method of determining an inspection condition while measuring a signal in the dark-field inspection apparatus or the like, it takes time to produce the inspection condition, and the judgement as to the appropriateness of a sensitivity condition which is set is influenced by the operator's discretion.Solution to ProblemAn inspection apparatus includes: a stage which holds a specimen; an illumination optical system which illuminates a surface of the specimen held on the stage, with illumination light; a dark-field optical system which detects scattered light generated by the illumination light with which the specimen is illuminated; a photoelectric converter which converts the scattered light detected by the dark-field optical system, into an electric signal; an A/D converter which converts the electric signal obtained by conversion by the photoelectric converter, into a digital signal; a judgement unit which determines the dimension of a foreign substance on the surface of the specimen on the basis of a magnitude of the scattered light from the foreign substance; and a signal processor which determines an inspection condition by use of information on the scattered light from the specimen surface.
    • 技术问题在测量暗视野检查装置等中的信号时确定检查条件的方法中,产生检查条件需要时间,并且对设定的灵敏度条件的适当性的判断受到影响 由运营人自行决定。 解决问题的方法检查装置包括:保持试样的台架; 照明光学系统,用照明光照亮保持在舞台上的标本的表面; 一个暗场光学系统,用于检测被照射的照明光产生的散射光; 将由暗视场光学系统检测出的散射光转换成电信号的光电转换器; 将通过光电转换器的转换获得的电信号转换为数字信号的A / D转换器; 判断单元,其基于来自异物的散射光的大小来确定样品表面上的异物的尺寸; 以及信号处理器,其通过使用关于来自样本表面的散射光的信息来确定检查条件。
    • 7. 发明申请
    • SURFACE INSPECTING APPARATUS AND METHOD FOR CALIBRATING SAME
    • 表面检查装置及其校准方法
    • US20120046884A1
    • 2012-02-23
    • US13202734
    • 2010-02-02
    • Kenji OkaKenji MitomoKenichiro Komeda
    • Kenji OkaKenji MitomoKenichiro Komeda
    • G01N21/94G01N21/93
    • G01N21/9501G01N21/93G01N2201/103
    • While an illumination optical system 2 is irradiating the surface of a contaminated standard wafer 110 with illumination light, this illumination light is scanned over the surface of the contaminated standard wafer 110, then detectors 31 to 34 of a detection optical system 3 each detect the light scattered from the surface of the contaminated standard wafer 110, next a predefined reference value in addition to detection results on the scattered light is used to calculate a compensation parameter “Comp” for detection sensitivity correction of photomultiplier tubes 331 to 334 of the detectors 31 to 34, and the compensation parameter “Comp” is separated into a time-varying deterioration parameter “P”, an optical characteristics parameter “Opt”, and a sensor characteristics parameter “Lr”, and correspondingly managed.This makes it easy to calibrate the detection sensitivity.
    • 当照明光学系统2用照明光照射受污染的标准晶片110的表面时,该照明光被扫描在污染的标准晶片110的表面上,然后检测光学系统3的检测器31至34检测光 从受污染的标准晶片110的表面散射的下一个预定的参考值,除了散射光的检测结果之外,还用于计算用于检测器31到...的光电倍增管331至334的检测灵敏度校正的补偿参数“Comp” 34,补偿参数“Comp”被分离为时变劣化参数“P”,光学特性参数“Opt”和传感器特性参数“Lr”,并相应地被管理。 这样可以轻松校准检测灵敏度。
    • 8. 发明授权
    • Surface inspecting apparatus and method for calibrating same
    • 表面检查装置及其校准方法
    • US08949043B2
    • 2015-02-03
    • US13202734
    • 2010-02-02
    • Kenji OkaKenji MitomoKenichiro Komeda
    • Kenji OkaKenji MitomoKenichiro Komeda
    • G01N21/94G01N21/93G01N21/95
    • G01N21/9501G01N21/93G01N2201/103
    • While an illumination optical system is irradiating the surface of a contaminated standard wafer with illumination light, this illumination light is scanned over the surface of the contaminated standard wafer, then detectors of a detection optical system each detect the light scattered from the surface of the contaminated standard wafer, next a predefined reference value in addition to detection results on the scattered light is used to calculate a compensation parameter “Comp” for detection sensitivity correction of photomultiplier tubes of the detectors, and the compensation parameter “Comp” is separated into a time-varying deterioration parameter “P”, an optical characteristics parameter “Opt”, and a sensor characteristics parameter “Lr”, and correspondingly managed. This makes is easy to calibrate the detection sensitivity.
    • 当照明光学系统用照明光照射污染的标准晶片的表面时,该照明光被扫描在受污染的标准晶片的表面上,然后检测光学系统的检测器每个都检测从污染的表面散射的光 标准晶片,接下来的预定参考值除了散射光上的检测结果之外,用于计算检测器的光电倍增管的检测灵敏度校正的补偿参数“Comp”,并将补偿参数“Comp”分为时间 - 变化劣化参数“P”,光学特性参数“Opt”和传感器特性参数“Lr”,并相应地管理。 这使得检测灵敏度变得容易。
    • 9. 发明授权
    • Inspection method and inspection apparatus
    • 检验方法和检验仪器
    • US08804108B2
    • 2014-08-12
    • US13202727
    • 2009-12-04
    • Kenji MitomoKenji Oka
    • Kenji MitomoKenji Oka
    • G01N21/00
    • G01N21/9501G01N21/94G01N21/956G01N2021/4707G01N2021/8822
    • This application relates to an inspection apparatus including: a stage which holds a specimen; an illumination optical system which illuminates a surface of the specimen held on the stage, with illumination light; a dark-field optical system which detects scattered light generated by the illumination light with which the specimen is illuminated; a photoelectric converter which converts the scattered light detected by the dark-field optical system, into an electric signal; an A/D converter which converts the electric signal obtained by conversion by the photoelectric converter, into a digital signal; a judgement unit which determines the dimension of a foreign substance on the surface of the specimen on the basis of a magnitude of the scattered light from the foreign substance; and a signal processor which determines an inspection condition by use of information on the scattered light from the specimen surface.
    • 本申请涉及一种检查装置,包括:保持试样的台架; 照明光学系统,用照明光照亮保持在舞台上的标本的表面; 一个暗场光学系统,用于检测被照射的照明光产生的散射光; 将由暗视场光学系统检测出的散射光转换成电信号的光电转换器; 将通过光电转换器的转换获得的电信号转换为数字信号的A / D转换器; 判断单元,其基于来自异物的散射光的大小来确定样品表面上的异物的尺寸; 以及信号处理器,其通过使用关于来自样本表面的散射光的信息来确定检查条件。
    • 10. 发明授权
    • Apparatus and method for inspecting surface of semiconductor wafer or the like
    • 用于检查半导体晶片等的表面的装置和方法
    • US06798504B2
    • 2004-09-28
    • US09961513
    • 2001-09-24
    • Tatsuya SatoYuichiro KatoKenji Mitomo
    • Tatsuya SatoYuichiro KatoKenji Mitomo
    • G01N2188
    • G01N21/9501
    • Light beam is irradiated onto a surface of a substrate to be inspected and scattered lights from the surface of the substrate are received at different light reception angles, so that first and second light detection signals corresponding to the different light reception angles are generated. Reference function defining a correlation in level value between the first and second light detection signals is set, a comparison is made between respective level values of the first and second light detection signals using the reference function as a comparison reference, and it is determined, on the basis of a result of the comparison, which of a plurality of different types of defects, such as a foreign substance and crystal-originated pit, a possible defect present on the surface of the substrate, which is represented by the light detection signals, corresponds to. Also, the level value of a predetermined one of a plurality of the light detection signals is weighted with a predetermined coefficient, and a comparison is made between the weighted level value of the predetermined light detection signal and the level value of the remaining light detection signal, to thereby identify any of a plurality of different types of defects, such as a foreign substance and scratch, present on the surface of the substrate.
    • 将光束照射到要检查的基板的表面上,并且以不同的光接收角接收来自基板表面的散射光,从而产生与不同的光接收角对应的第一和第二光检测信号。 设定定义第一和第二光检测信号之间的电平值的相关性的参考功能,使用参考功能作为比较基准比较第一和第二光检测信号的各个电平值,并且确定为 比较结果的基础,由光检测信号表示的多种不同类型的缺陷中的哪一种,例如异物和晶体起源的凹坑,存在于基板的表面上的可能的缺陷, 对应。 此外,多个光检测信号中的预定一个光检测信号的电平值以预定系数加权,并且比较预定光检测信号的加权电平值和剩余光检测信号的电平值 ,从而识别存在于基板表面上的多种不同类型的缺陷,例如异物和划痕。