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    • 62. 发明授权
    • Apparatus and method for forming heat sinks on silicon on insulator wafers
    • 用于在绝缘体硅片上形成散热片的装置和方法
    • US07119431B1
    • 2006-10-10
    • US10665897
    • 2003-09-18
    • Peter J. HopperIouri MirgorodskiVladislav VashchenkoPeter Johnson
    • Peter J. HopperIouri MirgorodskiVladislav VashchenkoPeter Johnson
    • H01L23/34H01L27/12
    • H01L29/78606H01L23/3677H01L23/481H01L2924/0002H01L2924/00
    • An apparatus and method for a heat sink to dissipate the heat sourced by the encapsulated transistors in a SOI wafer. The apparatus includes a transistor formed in the active silicon layer of the wafer. The active surface is formed over an oxide layer and a bulk silicon layer. A heat sink is formed in the bulk silicon layer and configured to sink heat through the bulk silicon layer, to the back surface of the wafer. After the transistor is fabricated, the heat sink is formed by masking, patterning and etching the back surface of the wafer to form plugs in the bulk silicon layer. The plug extends through the thickness of the bulk layer to the oxide layer. Thereafter, the plug is filled with a thermally conductive material, such as a metal or DAG (thermally conductive paste). During operation, heat from the transistor is dissipated through the heat sink. In various embodiments of the invention, the plug hole is formed using either an anisotropic plasma or wet etch.
    • 散热器散热由SOI晶片中的封装晶体管产生的热量的装置和方法。 该装置包括形成在晶片的有源硅层中的晶体管。 活性表面形成在氧化物层和体硅层上。 在体硅层中形成散热器,并且构造成将热量通过体硅层吸收到晶片的背面。 在制造晶体管之后,通过掩模,图案化和蚀刻晶片的背面来形成散热器,以在体硅层中形成插塞。 塞子延伸穿过本体层的厚度到氧化物层。 此后,塞子填充有导热材料,例如金属或DAG(导热浆)。 在运行期间,来自晶体管的热量通过散热器消散。 在本发明的各种实施例中,插塞孔使用各向异性等离子体或湿蚀刻形成。
    • 65. 发明授权
    • Electrostatic discharge (ESD) protection circuit
    • 静电放电(ESD)保护电路
    • US06560081B1
    • 2003-05-06
    • US09690558
    • 2000-10-17
    • Vladislav VashchenkoPeter J. Hopper
    • Vladislav VashchenkoPeter J. Hopper
    • H02H900
    • H02H9/046H01L27/0259H01L2924/0002H02H3/006H01L2924/00
    • An ESD protection circuit that can be easily configured to provide ESD event protection against a range of ESD event voltages. The circuit is also compatible with high frequency ICs. The ESD protection circuit includes an input terminal configured to receive an ESD event signal and a diode sub-circuit. The diode sub-circuit includes at least one diode (e.g., either a single diode or a plurality of diodes connected in series or parallel configuration), a diode input node and a diode output node. The diode sub-circuit is configured to receive an ESD event signal from the input terminal and to operate under forward bias conditions to provide a diode output signal at the diode output node. The circuit also includes a bipolar junction transistor (e.g., a Si—Ge bipolar junction transistor) with a base, a collector and an emitter. The emitter is configured to receive the ESD event signal from the input terminal, while the base is configured to receive the diode output signal from the diode output node. A resistor, with a resistor input node, a resistor output node and an output terminal, is also included in the circuit. The resistor input node is electrically connected to the diode output node and the output terminal is connected to the resistor output node, the emitter and ground. By predetermining the electrical characteristics (e.g., forward bias voltage) and number of diodes in the diode sub-circuit, the circuit can be adapted to provide ESD protection against a range of ESD event voltages.
    • ESD保护电路可以轻松配置,以提供ESD事件保护,防止一系列ESD事件电压。 该电路还兼容高频IC。 ESD保护电路包括被配置为接收ESD事件信号的输入端子和二极管子电路。 二极管子电路包括至少一个二极管(例如,串联或并联配置连接的单个二极管或多个二极管),二极管输入节点和二极管输出节点。 二极管子电路被配置为从输入端子接收ESD事件信号并且在正向偏置条件下操作以在二极管输出节点处提供二极管输出信号。 该电路还包括具有基极,集电极和发射极的双极结型晶体管(例如,Si-Ge双极结型晶体管)。 发射极被配置为从输入端子接收ESD事件信号,而基极配置为从二极管输出节点接收二极管输出信号。 电路中还包括一个带有电阻输入节点的电阻,一个电阻输出节点和一个输出端子。 电阻输入节点电连接到二极管输出节点,输出端子连接到电阻输出节点,发射极和地。 通过预先确定二极管子电路中的电特性(例如,正向偏置电压)和二极管的数量,该电路可适用于针对一系列ESD事件电压提供ESD保护。