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61. 发明专利

JP2005254254A Lead-free solder, its manufacturing method and electronic component 审中-公开
标题翻译：无铅焊枪，其制造方法和电子元器件
公开(公告)号：JP2005254254A
公开(公告)日：2005-09-22
申请号：JP2004065859
申请日：2004-03-09
申请人： Toshiba Corp , 株式会社東芝
发明人： TAN TORONRON , KURI YUUJI , TANAKA AKIRA
IPC分类号： B23K35/26 , B23K35/22 , B23K35/28 , B23K35/40 , C22C12/00 , C22C13/00 , H01L21/52 , H01L21/60
CPC分类号： H01L24/29 , H01L2924/01012 , H01L2924/01029 , H01L2924/01322 , H01L2924/01327 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide lead-free solder capable of maintaining joining strength under high temperature, and also to provide its manufacturing method and an electronic component that is hierarchically connected at high temperature using this lead-free solder.
SOLUTION: Using the lead-free solder containing, in a first alloy phase composed of an Sn base alloy, a second alloy phase composed of Sb alloy having a melting point higher than that of the first alloy phase, joining strength can be maintained at a high temperature, enabling high temperature hierarchical connection.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供能够在高温下保持接合强度的无铅焊料，并且还提供其制造方法和使用该无铅焊料在高温下分级连接的电子部件。解决方案：使用在由Sn基合金构成的第一合金相中含有熔点高于第一合金相的Sb合金的第二合金相的无铅焊料，可以是接合强度保持在高温，实现高温分层连接。版权所有（C）2005，JPO＆NCIPI

62. 发明专利

JP2005189064A Small-sized fatigue tester and fatigue test method 审中-公开
标题翻译：小尺寸疲劳试验机和疲劳试验方法
公开(公告)号：JP2005189064A
公开(公告)日：2005-07-14
申请号：JP2003429875
申请日：2003-12-25
申请人： Toshiba Corp , 株式会社東芝
发明人： KURI YUUJI , NAKATANI YUJIRO , ITO YOSHIYASU , ISHIWATARI YUTAKA
IPC分类号： G01N3/32 , G01N3/34
摘要： PROBLEM TO BE SOLVED: To efficiently perform high-accuracy fatigue test on a minute test specimen according to the material characteristics of an inspecting object component that is the test specimen.
SOLUTION: A magnetostrictive actuator 18 provided on this small-sized fatigue tester 11 is drive-controlled by a controller 24 to perform fatigue test on the test specimen 15. In this event, the controller 24 previously estimates, via a useful life estimation part 35, the useful life of the inspecting object component based on the material characteristics and fatigue characteristics of the inspecting object component that is the test specimen 15, and determines test conditions for performing fatigue test on the test specimen 15 based on useful life estimation data obtained as the result of the estimation. By performing fatigue test according to the test conditions while drive-controlling the actuator 18, fatigue test can be efficiently performed for various components different in material characteristics by giving appropriate load to these components.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：根据作为试样的检查对象成分的材料特性，有效地对微小试验片进行高精度的疲劳试验。解决方案：设置在该小型疲劳试验机11上的磁致伸缩致动器18被控制器24驱动控制，以对试样15执行疲劳试验。在这种情况下，控制器24先前经过使用寿命估计部分35，基于作为试样15的检查对象部件的材料特性和疲劳特性的检查对象部件的使用寿命，并且基于使用寿命估计确定对试样15进行疲劳试验的试验条件作为估计结果获得的数据。通过在驱动控制致动器18的同时进行根据测试条件的疲劳试验，可以通过给这些部件赋予适当的载荷，来对材料特性不同的各种部件进行有效的疲劳试验。版权所有（C）2005，JPO＆NCIPI

63. 发明专利

JP2005148016A Method and device for diagnosing thermal fatigue life of solder weld part 有权
标题翻译：用于诊断焊接部件的热疲劳寿命的方法和装置
公开(公告)号：JP2005148016A
公开(公告)日：2005-06-09
申请号：JP2003389707
申请日：2003-11-19
申请人： Toshiba Corp , 株式会社東芝
发明人： KURI YUUJI , ITO YOSHIYASU , ITAYA MASAO , KITANO SEIJI
IPC分类号： G01N19/04 , B23K1/00 , G01N3/32 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To nondestructively estimate the thermal fatigue life of a solder weld part with high precision.
SOLUTION: This method comprises a process 12 for preliminarily determining a plastic strain (Δεp) resulted from a repeated thermal stress generated in a solder connection part 3 of an electric circuit by a finite element two-dimensional elastoplastic analysis; a process 18 for determining a crack extension rate equation showing the relation between a crack extension rate (da/dn) determined by observing the solder weld part after executing a temperature cycle test for the electric circuit and the plastic strain (Δεp); a process 20 for determining a life evaluation reference equation showing the relation among the plastic strain, the crack extension rate, the joint length of the solder weld part, and the life cycle number to penetration; and a process 20 for determining the life cycle number of a designated diagnostic object, corresponding to the joint length of the solder weld part of the electric circuit by use of the life evaluation reference equation.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：以非常高的精度非破坏性地估计焊接部件的热疲劳寿命。解决方案：该方法包括用于通过有限元二维弹塑性分析预先确定由电路的焊料连接部分3产生的反复热应力引起的塑性应变（Δεp）的工艺12; 确定裂纹延伸率方程的方法18，其显示在执行电路的温度循环试验和塑性应变（Δεp）之后观察焊接部分所确定的裂纹延伸率（da / dn）之间的关系; 用于确定表示塑性应变，裂纹延伸率，焊接部分的接头长度与穿透寿命周期数之间的关系的寿命评估参考方程的过程20; 以及用于通过使用寿命评估参考方程来确定与电路的焊接部分的接头长度相对应的指定诊断对象的寿命周期数的过程20。版权所有（C）2005，JPO＆NCIPI

64. 发明专利

JP2019021831A 半導体装置及び半導体装置用サブモジュール审中-公开
公开(公告)号：JP2019021831A
公开(公告)日：2019-02-07
申请号：JP2017140784
申请日：2017-07-20
申请人： TOSHIBA CORP , TOSHIBA ENERGY SYSTEM & SOLUTION CORP
发明人： TAKIMOTO KAZUYASU , ICHIKURA YUTA , OBE TOSHIHARU , ITO HIROAKI , TADA NOBUMITSU , WATANABE NAOTAKE , HIRATSUKA DAISUKE , SEKIYA HIRONORI , KURI YUUJI , IIO HISATAKA , MATSUMURA HITOTSUGU
IPC分类号： H01L25/07 , H01L23/29 , H01L23/31 , H01L25/18
摘要：【課題】半導体素子に大電流が流れて半導体素子の近傍から隣接する樹脂部分にき裂が生じたときに、当該き裂を通じてガスの噴出を抑制可能な半導体装置を提供する。【解決手段】半導体装置用サブモジュール20は、そのチップ厚さ方向と垂直な方向に広がる第1主面23及び第2主面25を有する半導体素子と、第1主面23のうち少なくとも一部と電気的に接続されており、第1外面35を有する第1金属導体30と、第2主面25のうち少なくとも一部と電気的に接続されてており、第2外面を有する第2金属導体50とを有する。半導体装置10は、さらに、第1外面35の少なくとも一部と第2外面55の少なくとも一部がそれぞれサブモジュール20外に露出するように、半導体素子22、第1金属導体30及び第2金属導体50を樹脂封止する樹脂部60と、当該樹脂部60に隣接して配置されており、当該樹脂部を少なくとも部分的に囲うケース70を有する。【選択図】図2

65. 发明专利

JP2019021684A 半導体パッケージ审中-公开
公开(公告)号：JP2019021684A
公开(公告)日：2019-02-07
申请号：JP2017136512
申请日：2017-07-12
申请人： TOSHIBA CORP , TOSHIBA ENERGY SYSTEM & SOLUTION CORP
发明人： WATANABE NAOTAKE , ITO HIROAKI , ICHIKURA YUTA , OBE TOSHIHARU , TAKIMOTO KAZUYASU , TADA NOBUMITSU , HIRATSUKA DAISUKE , SEKIYA HIRONORI , KURI YUUJI , IIO HISATAKA , MATSUMURA HITOTSUGU
IPC分类号： H01L25/07 , H01L23/36 , H01L23/473 , H01L23/48 , H01L25/18
摘要：【課題】半導体チップに不具合が生じても、被害の拡大を抑制できる半導体パッケージを提供する。【解決手段】半導体パッケージは、半導体チップと、第1金属板と、第2金属板と、封止部材と、を備える。前記半導体チップの第1面には第1電極が設けられ、第2面には第2電極が設けられている。前記第1金属板は、前記半導体チップの前記第1面上に積層され、前記半導体チップの側方において、端部の第1部分が前記第1面から前記第2面に向かう第1方向に向けて延出している。前記第1部分の先端は前記第2面よりも前記第1方向側に配置されている。前記第2金属板は、前記半導体チップの前記第2面上に積層され、前記半導体チップ及び前記第1部分の側方において、端部の第2部分が前記第2面から前記第1面に向かう第2方向に向けて延出している。前記第2部分の先端は前記第1部分の先端よりも前記第2方向側に配置されている。【選択図】図1

66. 发明专利

JP2001358429A METHOD FOR DETECTING DETERIORATION OF PRINTED WIRING BOARD AND DEVICE THEREOF 失效
公开(公告)号：JP2001358429A
公开(公告)日：2001-12-26
申请号：JP2000179841
申请日：2000-06-15
申请人： TOSHIBA CORP
发明人： TODO YOKO , IKEGAYA TAKEHIKO , MINAMI YUJI , KURI YUUJI
IPC分类号： H05K3/28 , H05K3/00
摘要： PROBLEM TO BE SOLVED: To early detect a deterioration of a printed wiring board which responds to the harmful degree of the environment wherein the board is to be used, without making a breakdown test of the wiring board by drawing out the wiring board from an electronic device or the like and to prevent a system failure or the like. SOLUTION: Electrode conductors 5 and 6 of a printed wiring board are printed and formed at positions independent of a conductor 3 constituting an electronic circuit 2, and a deterioration of the conductor 3 constituting the circuit 2 is detected from a sequential change in the electrical characteristics, which are measured in the conductors 5 and 6, of the conductor 3.

67. 发明专利

JP2001074801A WHISKER DETECTING APPARATUS 失效
公开(公告)号：JP2001074801A
公开(公告)日：2001-03-23
申请号：JP25237999
申请日：1999-09-07
申请人： TOSHIBA CORP
发明人： KURI YUUJI , MOTOKI MITSUO
IPC分类号： H05K3/00 , G01N27/00 , G01R31/02
摘要： PROBLEM TO BE SOLVED: To provide a whisker detecting apparatus capable of detecting whiskers when a product is used. SOLUTION: In this whisker detecting apparatus, a component equivalent to a component to be used in an actual product is mounted on a base 2, and a whisker detecting circuit 6 is formed when a part position where it is presumed that a whisker 5 of the component mounted on the base 2 will be generated is shout-circuitted. When the whisker detecting circuit 6 is formed, a whisker detection signal is outputted to the outside from an output part 7.

68. 发明专利

JPH0931624A CERAMIC COATING FILM AND ITS PRODUCTION 失效
公开(公告)号：JPH0931624A
公开(公告)日：1997-02-04
申请号：JP18364995
申请日：1995-07-20
申请人： TOSHIBA CORP
发明人： KURI YUUJI
IPC分类号： C23C14/00 , C23C14/06
摘要： PROBLEM TO BE SOLVED: To obtain a high reliability ceramic coating film excellent in heat resistance by specifying the amt. of Al in an AlN film when the AlN film is formed on the surface of a substrate. SOLUTION: The treatment temp. of an AlN coating film treated in vacuum at the time of film formation is regulated to >=400 deg.C, -100 to -300V voltage is impressed on a substrate and Al is evaporated by irradiation with 400-450mA electron beams. Gaseous N2 is fed and allowed to react with the evaporated Al in 1.5×10 -4.0×10 Torr vacuum. By this reaction, an AIN film contg. 40-45at.% Al is formed on the surface of the substrate and the objective high reliability ceramic coating film excellent in heat resistance and insulating property is obtd.

69. 发明专利

JPH08235953A CONTACT AND ITS MANUFACTURE 失效
公开(公告)号：JPH08235953A
公开(公告)日：1996-09-13
申请号：JP4063695
申请日：1995-02-28
申请人： TOSHIBA CORP
发明人： KURI YUUJI
IPC分类号： H01H1/62
摘要： PURPOSE: To increase current-carrying capacity and minimize the shape of a contact by coating the surface of the contact with high radiation material so as to suppress the temperature rise of the contact. CONSTITUTION: A contact 1 is composed of a conductor 2 of a stripped metal material whose one end is bent into the U shape and a contact point 3 is fixed to one side of the U-shaped end. The surface of the conductor 2 except the contact point 3 part is uniformly coated with a radiation material. In this case, radiation rate of the radiation material which is applied on the surface of the conductor 2 of the contact 1 is set to 0.5 or more. The heat radiation of the contact 1 can be thus improved so as to reduce temperature rise, provide more superior coating film according to the treatment contents, simplify the miniaturization of the contact 1, and miniaturize the switch device adopting this contact 1.

70. 发明专利

JPH08144042A PRODUCTION OF CERAMIC COATING FILM 失效
公开(公告)号：JPH08144042A
公开(公告)日：1996-06-04
申请号：JP28760494
申请日：1994-11-22
申请人： TOSHIBA CORP
发明人： KURI YUUJI
IPC分类号： B08B3/12 , C23C14/02 , C23G5/032
摘要： PURPOSE: To enable coating with a high quality ceramic coating film without causing peeling by successively subjecting the surface of a member to be coated to ultrasonic cleaning in acetone and ultrasonic cleaning in alcohol and then successively washing the member with acetone and alcohol. CONSTITUTION: When the top of a member such as a stainless steel member is coated with ceramics, the surface of the member to be coated is successively subjected to ultrasonic cleaning in acetone for about 5-10min and ultrasonic cleaning in alcohol such as methanol for about 5-10min. The member is then washed with acetone at 30-50 deg.C for 30-40min and is further washed with alcohol at 30-50 deg.C for 15-30min. The member can be coated with a high quality ceramic coating film without causing peeling to the member.

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