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    • 67. 发明申请
    • MANUFACTURING METHOD OF ORGANIC SEMICONDUCTOR DEVICE
    • 有机半导体器件的制造方法
    • US20110053313A1
    • 2011-03-03
    • US12863538
    • 2009-01-21
    • Ken TominoMasanao MatsuokaTomomi SuzukiHiroki Maeda
    • Ken TominoMasanao MatsuokaTomomi SuzukiHiroki Maeda
    • H01L51/10
    • H01L51/0013H01L51/003H01L51/0076H01L51/0545H01L51/0558
    • The present invention provides a manufacturing method of an organic semiconductor device comprising a step of transferring an organic semiconductor layer to a gate insulation layer by a thermal transfer at a liquid crystal phase transition temperature of a liquid crystalline organic semiconductor material, and the step uses: an organic semiconductor layer-transferring substrate comprising a parting substrate having parting properties, and the organic semiconductor layer formed on the parting substrate and containing the liquid crystalline organic semiconductor material; and a substrate for forming an organic semiconductor device comprising a substrate, a gate electrode formed on the substrate, and the gate insulation layer formed to cover the gate electrode and having alignment properties which are capable of aligning the liquid crystalline organic semiconductor material on a surface of the gate insulation layer.
    • 本发明提供了一种有机半导体器件的制造方法,其包括通过在液晶有机半导体材料的液晶相变温度下的热转印将有机半导体层转印到栅极绝缘层的步骤,并且该步骤用途: 包括具有分离性质的分离基板的有机半导体层转移基板和形成在分型基板上并含有液晶有机半导体材料的有机半导体层; 以及用于形成有机半导体器件的衬底,包括衬底,形成在衬底上的栅极电极和形成为覆盖栅电极并具有能够使液晶有机半导体材料在表面上对准的取向性能的栅极绝缘层 的栅极绝缘层。
    • 68. 发明授权
    • System and method for load balancing based on service level objectives and information on the contents of start and finish processes of business services
    • 基于服务级别目标的负载平衡的系统和方法以及业务服务开始和结束流程内容的信息
    • US07672863B2
    • 2010-03-02
    • US10720758
    • 2003-11-25
    • Masahiro KurosawaYusuke NodaTomomi Suzuki
    • Masahiro KurosawaYusuke NodaTomomi Suzuki
    • G05B19/418
    • G06F9/5083G06Q10/06315H04L67/1002H04L67/1012
    • A load balancing method comprises the steps of: registering a business configuration definition of each business service including a schedule of the business service with a business configuration management repository; storing at least a service level objective of each business service; storing information on performance of each information processing module; acquiring the registered schedule and the stored service level objective of the designated business service; partitioning the schedule of the designated business service into a plurality of partial schedules according to the acquired service level objective; selecting one or more information processing modules whose performance information stored in the performance management table satisfies the service level objective in each partial schedule; and reserving the information processing modules selected for the partial schedules as information processing modules for executing the designated business service in the schedule. A partition fulfilling agreements on service quality can be constructed dynamically.
    • 一种负载平衡方法,包括以下步骤:通过业务配置管理库登记包括业务服务的日程表的每个业务服务的业务配置定义; 至少存储每个业务服务的服务级别目标; 存储关于每个信息处理模块的性能的信息; 获取指定商业服务的注册时间表和存储的服务级别目标; 根据获取的服务水平目标将指定业务服务的时间表划分为多个部分时间表; 选择一个或多个信息处理模块,其中存储在所述性能管理表中的性能信息满足每个部分时间表中的服务级别目标; 并将为部分时间表选择的信息处理模块保留为用于在时间表中执行指定的业务服务的信息处理模块。 可以动态构建实现服务质量协议的分区。
    • 69. 发明申请
    • Pressure-Sensitive Adhesive Sheet
    • 压敏粘合片
    • US20090053467A1
    • 2009-02-26
    • US11988548
    • 2006-07-20
    • Kiichiro KatoTadahiro TominoTomomi Suzuki
    • Kiichiro KatoTadahiro TominoTomomi Suzuki
    • B32B3/24
    • C09J7/38C09J2201/20Y10T428/24331
    • In a pressure-sensitive adhesive sheet 1 that comprises a base material 11 and a pressure-sensitive adhesive layer 12, and has formed therein by thermal processing a plurality of through holes 2 passing through one surface to the other surface of the pressure-sensitive adhesive sheet 1, as the base material 11, one is used for which, upon heating at a heating rate of 20° C./min under a nitrogen atmosphere, the temperature at a thermal decomposition peak where the mass reduction is greatest is not more than 450° C., or the difference between the temperature at the thermal decomposition peak and the temperature at a melting peak is not more than 250° C. According to this pressure-sensitive adhesive sheet 1, the appearance of the pressure-sensitive adhesive sheet 1 is not marred by the through holes 2 formed by the thermal processing.
    • 在包含基材11和粘合剂层12的压敏粘合片1中,通过热处理形成多个穿过压敏粘合剂的一个表面的另一个表面的通孔2 作为基材11的片材1,在氮气氛下以20℃/分钟的加热速度加热时,使用质量降低最大的热分解峰的温度不大于 或者热分解峰的温度与熔融峰的温度之间的差不超过250℃。根据该压敏粘合片1,粘合片的外观 1不会被热处理形成的通孔2所损坏。