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    • 65. 发明授权
    • Method for producing wiring layer transfer composite
    • 生产布线层转移复合材料的方法
    • US06419149B1
    • 2002-07-16
    • US09515072
    • 2000-02-28
    • Kentaro YanoSusumu OkikawaNoboru Hanai
    • Kentaro YanoSusumu OkikawaNoboru Hanai
    • B23K2004
    • H01L21/4846B23K20/02B23K2103/12H05K3/20
    • A wiring layer transfer composite constituted by a laminate composed of a carrier layer, a barrier layer and a wiring-forming layer, the barrier layer being a continuous layer substantially free from defects, can be produced by (a) preparing a first Cu-based metal foil having an average thickness of 50 &mgr;m or less and an average surface roughness Rz of 5 &mgr;m or less in both surfaces for the carrier layer; (b) preparing a second Cu-based metal foil having an average thickness of 20 &mgr;m or less and an average surface roughness Rz of 5 &mgr;m or less in both surfaces for the wiring-forming layer; (c) vapor-depositing a metal having different etchability from that of Cu onto at least one of the first metal foil and the second metal foil to form the barrier layer having an average thickness of 1 &mgr;m or less; and (b) pressure-welding both metal foils via the barrier layer.
    • 由通过载体层,阻挡层和布线形成层构成的层叠体构成的布线层转印复合体可以通过(a)制备基本上不含Cu的第一Cu基 在载体层的两个表面中平均厚度为50μm以下,平均表面粗糙度Rz为5μm以下的金属箔; (b)在布线形成层的两个表面上制备平均厚度为20μm以下且平均表面粗糙度Rz为5μm以下的第2 Cu系金属箔; (c)将具有与Cu的不同蚀刻性的金属气相沉积到第一金属箔和第二金属箔中的至少一个上,以形成平均厚度为1μm或更小的阻挡层; 和(b)经由阻挡层对两个金属箔进行加压焊接。