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    • 62. 发明授权
    • High-density plasma etching of carbon-based low-k materials in a integrated circuit
    • 集成电路中碳基低k材料的高密度等离子体蚀刻
    • US06284149B1
    • 2001-09-04
    • US09156956
    • 1998-09-18
    • Zongyu LiKarsten SchneiderAxel WalterJian Ding
    • Zongyu LiKarsten SchneiderAxel WalterJian Ding
    • H01L21033
    • H01L21/7681H01J37/321H01J37/32706H01L21/31138H01L21/76804H01L21/76807
    • A plasma etching process for etching a carbon-based low-k dielectric layer in a multi-layer inter-level dielectric. The low-k dielectric may be divinyl siloxane-benzocyclobutene (BCB), which contains about 4% silicon, the remainder being carbon, hydrogen, and a little oxygen. The BCB etch uses an etching gas of oxygen, a fluorocarbon, and nitrogen and no argon. An N2/O2 ratio of between 1:1 and 3:1 produces vertical walls in the BCB. In a dual-damascene structure, the inter-level dielectric includes two BCB layers, each underlaid by a respective stop layer. Photolithography with an organic photoresist needs a hard mask of silicon oxide or nitride over the upper BCB layer. After the BCB etch has cleared all the photoresist, the bias power applied to the cathode supporting the wafer needs to be set to a low value while the separately controlled plasma source power is set reasonably high, thereby reducing faceting of the exposed hard mask. Chamber pressures of no more than 5 milliTorr increase the selectivity of BCB over photoresist. Substrate temperatures of less than 0° C. increase the BCB etch rate. A low fluorocarbon flow increases the etch rate, but a minimum amount of fluorocarbon is required for the silicon component of BCB. In a counterbore dual-damascene etch, the lower stop layer is composed of nitride, and the preferred fluorocarbon is difluoroethane (CH2F2). A silicon-free carbon-based low-k dielectric can be etched under similar chamber conditions with a etching gas of oxygen and nitrogen in about equal amounts but including no fluorocarbon nor argon.
    • 一种用于蚀刻多层级间电介质中的碳基低k电介质层的等离子体蚀刻工艺。 低k电介质可以是二乙烯基硅氧烷 - 苯并环丁烯(BCB),其含有约4%的硅,其余是碳,氢和少量的氧。 BCB蚀刻使用氧气,碳氟化合物和氮气的蚀刻气体,而不使用氩气。 在1:1和3:1之间的N2 / O2比率在BCB中产生垂直壁。 在双镶嵌结构中,层间电介质包括两个BCB层,每个BCB层由相应的停止层覆盖。 使用有机光致抗蚀剂的光刻法需要在上BCB层上的氧化硅或氮化物的硬掩模。 在BCB蚀刻已经清除了所有光致抗蚀剂之后,施加到支撑晶片的阴极的偏置功率需要被设置为低值,而单独控制的等离子体源功率被设置得相当高,从而减少了暴露的硬掩模的刻痕。 室压不超过5毫乇可提高BCB对光致抗蚀剂的选择性。 衬底温度小于0℃会增加BCB蚀刻速率。 低碳氟化合物流量增加了蚀刻速率,但BCB的硅组分需要最少量的碳氟化合物。 在沉孔双镶嵌蚀刻中,下停止层由氮化物组成,优选的碳氟化合物是二氟乙烷(CH 2 F 2)。 可以在类似的腔室条件下用大约相等量的氧和氮的蚀刻气体蚀刻无硅碳基低k电介质,但不包括氟碳和氩。