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    • 69. 发明授权
    • Method of forming stacked gate for flash memories
    • 形成闪存存储堆叠栅的方法
    • US06677224B2
    • 2004-01-13
    • US09976823
    • 2001-10-12
    • Horng-Huei Tseng
    • Horng-Huei Tseng
    • H01L213205
    • H01L27/11521H01L21/76224H01L27/115
    • The method of the present invention includes the steps of forming doped regions in the semiconductor substrate. A pad oxide layer is formed on the semiconductor substrate. A masking layer is formed on the pad oxide layer. A masking layer, the pad oxide layer and the semiconductor substrate are patterned to form a trench therein. A gap-filling material is refilled into the trench and over the semiconductor substrate. A portion of the gap-filling material is removed to an upper surface of the masking layer. Next step is to remove the masking layer. A first conductive layer is formed along the surface of the substrate, then removing a portion of the first conductive layer to expose an upper surface of the gap-filling material. An inter polysilicon dielectric layer is formed on the first conductive layer and a second conductive layer is formed on the inter polysilicon dielectric layer.
    • 本发明的方法包括在半导体衬底中形成掺杂区的步骤。 在半导体衬底上形成衬垫氧化物层。 在衬垫氧化物层上形成掩模层。 掩模层,衬垫氧化物层和半导体衬底被图案化以在其中形成沟槽。 间隙填充材料被再填充到沟槽中并在半导体衬底上。 间隙填充材料的一部分被去除到掩模层的上表面。 下一步是去除掩模层。 沿着衬底的表面形成第一导电层,然后去除第一导电层的一部分以暴露间隙填充材料的上表面。 在第一导电层上形成多晶硅间介质层,在多晶硅间介质层上形成第二导电层。
    • 70. 发明授权
    • Nonvolatile memory device with reduced floating gate and increased coupling ratio and manufacturing method thereof
    • 具有减小的浮动栅极和增加耦合比的非易失性存储器件及其制造方法
    • US06589840B2
    • 2003-07-08
    • US09891408
    • 2001-06-27
    • Horng-Huei Tseng
    • Horng-Huei Tseng
    • H01L21336
    • H01L27/11521H01L27/115H01L29/42324Y10S257/90
    • A nonvolatile memory device with a reduced size floating gate and an increased coupling ratio is disclosed. The nonvolatile memory device includes two isolation structures protruding above a semiconductor substrate. Two dielectric spacers are disposed on a pair of opposing sidewalls of the two isolation structures. The two dielectric spacers are spaced from one another at a distance that defines a gate width which is beyond lithography limit. A tunnel dielectric and a floating gate are provided on substrate and confined between the two dielectric spacers. The floating gate has a smaller bottom surface area relative to its top surface area and has a surface substantially coplanar with a surface of the isolation structures. On the coplanar surface, an inter-gate dielectric and a control gate are provided. Optionally, a lightly doped region is provided beside the floating gate 118 and within the substrate. A manufacturing method for forming such memory device is also disclosed.
    • 公开了一种具有减小尺寸的浮动栅极和增加的耦合比的非易失性存储器件。 非易失性存储器件包括在半导体衬底上突出的两个隔离结构。 两个电介质间隔物设置在两个隔离结构的一对相对的侧壁上。 两个电介质间隔物以限定超出光刻极限的栅极宽度的距离彼此间隔开。 隧道电介质和浮栅设置在衬底上并被限制在两个电介质间隔物之间​​。 浮动栅极相对于其顶表面区域具有较小的底表面积,并且具有与隔离结构的表面基本上共面的表面。 在共面上设置栅极间电介质和控制栅极。 可选地,在浮置栅极118旁边和衬底内设置轻掺杂区域。 还公开了一种用于形成这种存储器件的制造方法。