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61. 发明专利

JPH0851513A COMPLETE CLOSE CONTACT IMAGE SENSOR UNIT 失效
公开(公告)号：JPH0851513A
公开(公告)日：1996-02-20
申请号：JP18748094
申请日：1994-08-09
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKAMURA TETSURO , TANAKA EIICHIRO , FUJIWARA SHINJI , HONGOU HIROTAKA
IPC分类号： H04N1/028 , H01L33/58 , H01L33/00
摘要： PURPOSE:To attain a reading with high quality and high resolution and small sensitivity dispersion without flare light and crosstalk of light. CONSTITUTION:A circuit conductor layer 44 is formed on the front side of an opaque glass board 48 having a transparent glass plate 47 and an optical fiber array 46 formed by putting side by side lots of optical fibers having an optical absorbing layer on the outer surface and an image sensor chip 41 is bonded on the layer 44 via a transparent light curing insulation resin 45 in a face-down form. A light receiving element array 42 is mounted on the board corresponding to the optical fiber array 46. A light shield layer 52 is formed to the end of the transparent glass plate 47 toward an original close contact side, a light intake rod 49 is formed to the light receiving element side and a linear light source 50 is arranged close thereto and the original 51 is lighted through the transparent glass plate 47 and the optical fiber array 46. The light information from the original 51 is led to the light receiving element array 42 through the optical fiber array 47 without optical complication.

62. 发明专利

JPH06350066A FULL CONTACT TYPE IMAGE SENSOR AND ITS MANUFACTURE 失效
公开(公告)号：JPH06350066A
公开(公告)日：1994-12-22
申请号：JP13822593
申请日：1993-06-10
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKAGAWA MASAHIRO , NAKAMURA TETSURO , TANAKA EIICHIRO , FUJIWARA SHINJI
IPC分类号： G02B5/00 , H01L27/14 , H04N1/028
摘要： PURPOSE:To provide a full contact type image sensor capable of preventing the cross talk of transmitted light and the generation of stray light, and having a higher MTF value and higher resolution. CONSTITUTION:First and second slits 15 and 16 are formed with high precision on the front and rear surfaces of a translucent substrate 1, by forming shading layers 8 and 10 with the same mask along with a circuit conductor layer 2 on the front and rear surfaces of the translucent substrate 1, and a route for light is secured with high precision. Consequently, it becomes possible to obtain high-performance full contact type image sensor unit capable of eliminating the cross talk of light and unnecessary lights (stray light) at the time of reading.

63. 发明专利

JPH06261176A COMPLETE CONTACT TYPE IMAGE SENSOR AND UNIT 失效
公开(公告)号：JPH06261176A
公开(公告)日：1994-09-16
申请号：JP30261593
申请日：1993-12-02
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKAMURA TETSURO , KAWAMOTO EIJI , FUJIWARA SHINJI
IPC分类号： G02B6/00 , H04N1/028
摘要： PURPOSE:To eliminate the crosstalk of light and flare light by generating an optical fiber plate with two opaque glass substrates holding an optical fiber array and transparent glass between there. CONSTITUTION:This unit is constituted of an image sensor chip 21, a photodetector array 22 formed on the surface of the image sensor chip 21, an electrode 23 provided on the surface of the image sensor chip 21, a circuit conductive layer 24 formed on the surface of the opaque glass substrate 28, the optical fiber array 26 arranged so as to correspond to the photodetector array 22, the transparent glass plate 27 arranged so as to be adhered closely with the side plane of the optical fiber array 26, and a pair of opaque glass substrates 28 holding the optical fiber array 26 and the transparent glass plate 27 between there, etc. An original 30 is irradiated with the light from a light source 29 transmitting a transparent member that is a slit or the optical fiber array 26, and reflected light is introduced to the photodetector array 22, then, optical image information is converted to an electrical image signal.

64. 发明专利

JPH06141129A CLOSE CONTACT TYPE IMAGE SENSOR UNIT 失效
公开(公告)号：JPH06141129A
公开(公告)日：1994-05-20
申请号：JP28575992
申请日：1992-10-23
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKAGAWA MASAHIRO , NAKAMURA TETSURO , FUJIWARA SHINJI
IPC分类号： H01L27/14 , H04N1/028 , H04N5/335 , H04N5/359
摘要： PURPOSE:To keep the S/N of picture reading, the resolution and a light transfer efficiency by providing a conductive light shield layer between a rear side of a transparent board and a conductive transparent film so as to prevent crosstalk of light and to improve the static electricity resistance. CONSTITUTION:The structure of the sensor is devised that a stray light hardly generated by providing a transparent board 1 with a circuit conductor layer 2 formed thereon, a semiconductor image sensor chip 3 having a light receiving element 7 fitted to the surface of the base 1 via a transparent light curing insulating resin 5 in a face-down form, an extracting electrode 4 formed on the semiconductor image sensor chip 3 in press contact with the circuit conductor layer 2 and light shield layer 10 to the surface (semiconductor element mount face) of the transparent base 1. A conductive light shield layer 8 and a conductive transparent film 9 are provided between the rear side of the transparent base 1 and an original 11, the conductive transparent film 9 is used for the original close mount face, an incident angle sigma17 from the original carrying direction of the light source 12 is just above (0 deg. incident angle) the semiconductor element to 30 deg., the reflected light from the original 11 is led to the semiconductor element for the reading.

65. 发明专利

JPH05292245A 失效
公开(公告)号：JPH05292245A
公开(公告)日：1993-11-05
申请号：JP8854292
申请日：1992-04-09
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TANAKA EIICHIRO , NAKAMURA TETSURO , NAKAGAWA MASAHIRO , FUJIWARA SHINJI
IPC分类号： H01L27/14 , H04N1/028
摘要： PURPOSE:To obtain the arrangement of a photodetector with high positioning accuracy by arranging an optical fiber on an image sensor fixed on a translucent supporting body linearly, and adhering an optical fiber array substrate embedded in a substrate on it. CONSTITUTION:A semiconductor integrated circuit (sensor IC) 14 on which the photodetector 15 is arranged in one-dimensional fashion is adhered on the translucent supporting body 11 by die bonding with an adhesive. A protrusive electrode 18 is formed on the sensor IC 14, and it is connected confronting with an electrode formed on a flexible circuit board 12, and is fixed on the translucent supporting body 11 with a supporter 19. A translucent sheet 13 on which a translucent conductive layer 10 is formed is fixed on a supporter 17 and the sensor IC 14 with translucent resin 16. UV curing resin of silicon system or acrylate system, or temperature or heat curing type resin is used as the translucent resin. Thereby, it is possible to position and fix the arrangement of each photodetector with satisfactory accuracy, and to prevent an image from being deteriorated between the semiconductor integrated circuits.

66. 发明专利

JPH05183680A CLOSE CONTACT TYPE IMAGE SENSOR UNIT 失效
公开(公告)号：JPH05183680A
公开(公告)日：1993-07-23
申请号：JP34613191
申请日：1991-12-27
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKAMURA TETSURO , FUJIWARA SHINJI
IPC分类号： H01L27/14 , H04N1/028
摘要： PURPOSE:To provide the simple, compact and inexpensive close contact type image sensor unit in which a semiconductor image sensor element is mounted on a printed circuit board simply in a short time, a convergent rod lens is assembled with no adjustment and an original is read with high resolution. CONSTITUTION:A semiconductor image sensor having a light receiving element array 6 is mounted on the surface of a 1st light transmission board 1 on the surface of which a circuit conductor layer 2 is formed via a light curing type insulation resin 5 in a face-down way so that its electrode 4 and the circuit conductor layer 2 are pressed into contact. A convergent rod lens array 7 placed between light transparent plates 8 is mounted on the rear side of the said 1st light transparent board 1 and a 2nd light transparent board 9 with the same thickness as the 1st light transparent board 1 is mounted on the rear side furthermore the rear side of the 2nd light transparent board 9 is used for an original close contact face and the original is lighted from the upper part with a light source (LED array) 10 to read the original.

67. 发明专利

JPH0475381A SEMICONDUCTOR DEVICE AND IMAGE SENSOR USING THE SAME 失效
公开(公告)号：JPH0475381A
公开(公告)日：1992-03-10
申请号：JP18893190
申请日：1990-07-17
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TANAKA EIICHIRO , NAKAMURA TETSURO , FUJIWARA SHINJI
IPC分类号： H04N1/028 , H01L21/60 , H01L27/14 , H01L31/02
摘要： PURPOSE:To obtain a highly reliable optical semiconductor device which can cope with a small pitch by using a resin whose glass transition temperature is 60 deg.C or higher after hardening as a light-hardenining type insulating resin. CONSTITUTION:A semiconductor process is used, and a photodetector 14 and an access circuit are provided on a single-crystal silicon substrate. Thereafter, this wafer is cut by a highly accurate dicing technology, and a semiconductor image sensor chip 13 is formed. Then, a circuit conductor layer 12 which is formed by a film thickness printing is formed on a glass substrate 11. An acrylate-based transparent hardening-type insulating resin 16 is applied by a specified amount on the specified position. The semiconductor image sensor 13 is arranged thereon in the face-down pattern so that the chip is in contact with the specified circuit conductor layer 12. Thereafter, pressure is applied on the image sensor chip 13 from the upper side, and ultraviolet rays are cast on the transparent light-hardening type insulating film 16. Thus the resin is hardened. A resin such as silicone is further applied from the upper side with a dispenser and the like, and a protecting film 17 is formed. As a result, the highly reliable image sensor is obtained in the environment of broad temperature and humidity ranges.

68. 发明专利

JPH03265357A OPTICAL ORIGINAL READER 失效
公开(公告)号：JPH03265357A
公开(公告)日：1991-11-26
申请号：JP6468090
申请日：1990-03-15
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKAMURA TETSURO
IPC分类号： H04N1/028
摘要： PURPOSE:To eliminate the need for the adjustment of a rod lens and to reduce the height by mounting a photodetector onto an opaque with a window shaped transparent part corresponding to the photodetector and providing a light source opposite to the light incident part formed on a prolonged line of one side of the transparent part. CONSTITUTION:A photodetector 3 is provided an upper face of a window shaped transparent part 5 provided on intermittently onto an opaque base 4, one side of the transparent window 5 is prolonged to be an incident part 5a and a light source 7 is provided to the incident part 5a accordingly. The light from the light source 7 radiates an original 6 through the transparent window 5 and light information from the original 6 is led to the photodetector 3 through the transparent window 5 by one to one correspondence. Thus, the base 4 acts like a lens and the size is reduced by the corresponding size and the assembly and adjustment of the lens are not required.

69. 发明专利

JPH03233978A LIGHT EMITTING DEVICE 失效
公开(公告)号：JPH03233978A
公开(公告)日：1991-10-17
申请号：JP2902090
申请日：1990-02-08
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HONGOU HIROKI , MURATA TAKAHIKO , NAKAMURA TETSURO
IPC分类号： H01L33/30 , H01L33/40 , H01L33/62
摘要： PURPOSE:To improve a light emitting amount by mounting a first electrode at the periphery of a light emitting surface side directly on a predetermined circuit conductor layer, and connecting second electrodes provided on the rear surface sides of light emitting elements to the predetermined positions of the circuit conductor layer. CONSTITUTION:A first electrode 4 formed on the periphery of a light emitting element 1 at its light emitting surface side is mounted directly on a circuit conductor layer 6, and second electrodes 8 provided at the rear surface side of the element 1 are connected to predetermined positions of the layer 6. A light generated from a P-N junction of the light emitting diode 1 is externally emitted through a transparent ultraviolet ray curable insulting resin 7 and a glass transparent board 5. Since the electrode 4 of the element 1 is formed at the periphery of the light emitting surface side, no shield exists at the center of the light emitting surface, thereby improving its light emitting amount.

70. 发明专利

JPH02153567A OPTICAL MANUSCRIPT-READING DEVICE 失效
公开(公告)号：JPH02153567A
公开(公告)日：1990-06-13
申请号：JP30735088
申请日：1988-12-05
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKAMURA TETSURO , MURATA TAKAHIKO
IPC分类号： H04N1/028 , H01L27/146
摘要： PURPOSE:To miniaturize a reading device of this design in constitution by a method wherein a sealing material of an image sensing element is formed of a transparent material possessed of required optical properties. CONSTITUTION:An image sensing element 2 is composed of a light source 4 and a photodetective element 3 sealed up with a sealing material 1 on a substrate 7. The sealing material 7 is formed of a transparent material which varies in refractive index to light rays of specified wavelength and functions also as a sealed lens, so that a lens can be omitted and consequently an optical manuscript-reading device of structure small in height can be obtained.

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