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    • 62. 发明专利
    • FORMING APPARATUS OF THIN FILM
    • JPH0430523A
    • 1992-02-03
    • JP13779590
    • 1990-05-28
    • MATSUSHITA ELECTRIC IND CO LTD
    • SHIBUYA MUNEHIROHIRAO TAKASHIKITAGAWA MASATOSHIYOSHIDA TETSUHISAHAYASHI SHIGENORIKAMATA TAKESHI
    • H01L21/205H01L21/31
    • PURPOSE:To introduce a vaporized material into a vacuum chamber, as it is, without making it reliquefied and resolidified and thereby to enable formation of a thin film being excellent in characteristics by a construction wherein a lower electrode is heated by a heater, a gas introduction passage is made to have a double structure and a cooling device is provided in the outer peripheral part of the passage, while a material gas is heated by the heater. CONSTITUTION:A substrate 14 and an electrode 13 are heated by a heater 15. A solid or a liquid of a material in an ampule 9 is heated by a heater 8, and a material gas bubbled by a gas supplied from a cylinder 18 and subjected to a flow rate control is introduced between electrodes while it is heated and kept hot by a heater 22 incorporated inside an introduction passage 20 and an electrode 21. Accordingly, the introduced gas reaches the electrode 13 without being cooled down by the adiabatic expansion occurring when it is introduced into a vacuum chamber. Besides, the outer peripheral part of the introduction passage is cooled down by a cooler 25 in order to prevent heating by the heater 22. The vaporized material can reach the inside of the vacuum chamber without being cooled. Therefore the material contributes to the formation of a film effectively and a powder-form decomposition product is hardly brought forth.
    • 63. 发明专利
    • FORMING DEVICE AND METHOD OF CDTE THIN FILM
    • JPH0430479A
    • 1992-02-03
    • JP13594590
    • 1990-05-25
    • MATSUSHITA ELECTRIC IND CO LTD
    • NISHITANI MIKIHIKOHIRAKAWA KAZUEIKEDA KOSUKEHIRAO TAKASHI
    • H01L31/04H01L27/146
    • PURPOSE:To enable a P-type CdTe thin film of low resistance to be formed by a method wherein a Te evaporation source is provided, and the doping of the CdTe thin film with Cu impurities is improved in efficiency through the presence of Te vapor. CONSTITUTION:A Te evaporation source K3 is provided, and a substrate, a CdTe evaporation source, and a Cu evaporation source are kept constant at temperatures of 400 deg.C, 500 deg.C, and 1100 deg.C respectively, and the Te evaporation source K3 is made to change in temperature from a room temperature to 700 deg.C to deposit a CdTe thinfilm on a glass substrate. An excellent P-type CdTe thin film whose electrical conductivity and mobility are 10 (OMEGA cm) or so and 10 cm /V.sec or so respectively can be obtained when the Te evaporation source K3 is kept at a temperature of 600-700 deg.C. That is, the doping of a CdTe thin film with Cu impurities can be improved in efficiency through the presence of Te vapor. The same effect can be expected when the substrate is kept at a temperature of 400 deg.C or above, a CdTe evaporation source is kept at a temperature higher than that of the substrate by 100 deg.C or so, a Te evaporation source is kept at a temperature of 600-700 deg.C, and a Cu evaporation source is kept at a temperature of 1000-1100 deg.C.
    • 70. 发明专利
    • WEAR RESISTANT THIN FILM AND PRODUCTION THEREOF
    • JPH0324266A
    • 1991-02-01
    • JP15653889
    • 1989-06-19
    • MATSUSHITA ELECTRIC IND CO LTD
    • KITAGAWA MASATOSHIYOSHIDA TETSUHISAHIRAO TAKASHI
    • C23C14/58C23C14/06C23C16/30C23C16/511H01L21/316
    • PURPOSE:To stably produce the wear resistant thin film having high performance by forming a thin film of silicon oxynitride having uniform quality and accelerating and implanting ions contg. a carbon element to this thin film, thereby forming a structure contg. carbon near the surface. CONSTITUTION:The inside of an insulated vacuum chamber 10 is evacuated to a vacuum and a high frequency is introduced from a high-frequency oscillator 13 via an electrode 12 into a plasma generating chamber. A magnetic field is impressed by an electromagnet 15. Gaseous raw materials (a gaseous mixture composed of CO, N2 and O2) is introduced from a gas introducing port 16 and the inside of the vacuum chamber 10 is kept at about 1.0Torr. The intensity of the magnetic field is so set as to satisfy the conditions to stabilize the electric discharge, by which plasma 17 of a high degree ef dissociation is generated under a low pressure. This plasma 17 is regulated to + several KV by a potential regulating meshed electrode 18 and is led out via an ion leading out window 19. The ions contg. the carbon are accelerated and implanted to the surface (about 100 to 500 deg.C) of the thin film of the silicon oxynitride which has the uniform quality and is formed on a holder 20, by which the surface of the thin film is. made into the carbon-contg. structure. The thin film having the wear resistance and adhesive property in combination is formed in this way.