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    • 62. 发明授权
    • Integrated circuit configuration with at least one capacitor and method for producing the same
    • 具有至少一个电容器的集成电路配置及其制造方法
    • US06525363B1
    • 2003-02-25
    • US09677433
    • 2000-10-02
    • Josef WillerBernhard SellDirk Schumann
    • Josef WillerBernhard SellDirk Schumann
    • H01L27108
    • H01L28/84H01L27/10852H01L27/10876H01L27/10885H01L28/86H01L28/90
    • A first capacitor electrode of the capacitor, which is arranged on a surface of a substrate (1), has a lower part (T) and a lateral part (S) arranged thereon. At least a first lateral area of the lateral part (S) is undulatory in such a way that it has bulges and indentations alternately which are formed along lines each running in a plane parallel to the surface of the substrate (1). The lateral part (T) can be produced by depositing conductive material in a depression (V) which is produced in a layer sequence whose layers are composed alternately of a first material and a second material and in which the first material is subjected to wet etching selectively with respect to the second material down to a first depth. The first capacitor electrode is provided with a capacitor dielectric (KD). A second capacitor electrode (P) adjoins the capacitor dielectric (KD).
    • 设置在基板(1)的表面上的电容器的第一电容电极具有布置在其上的下部(T)和侧部(S)。 横向部分(S)的至少第一横向区域以这样的方式波动,使得其具有沿着平行于基底(1)的表面的平面中的每条线条沿着线形成的凸起和凹陷。 横向部分(T)可以通过将导电材料沉积在层中产生的凹陷(V)中来制造,层的顺序是层,其层由第一材料和第二材料交替组成,并且其中第一材料经受湿蚀刻 相对于第二材料选择性地到达第一深度。 第一电容器电极设置有电容器电介质(KD)。 第二电容器电极(P)与电容器电介质(KD)相邻。
    • 63. 发明授权
    • SRAM cell arrangement and method for manufacturing same
    • SRAM单元布置及其制造方法
    • US06222753B1
    • 2001-04-24
    • US09446419
    • 1999-12-20
    • Bernd GoebelEmmerich BertagnolliJosef WillerBarbara HaslerPaul-Werner von Basse
    • Bernd GoebelEmmerich BertagnolliJosef WillerBarbara HaslerPaul-Werner von Basse
    • G11C700
    • H01L27/11H01L27/1104
    • An SRAM cell arrangement which includes six MOS transistors per memory cell wherein each transistor is formed as a vertical transistors. The MOS transistors are arranged at sidewalls of trenches. Parts of the memory cell such as, for example, gate electrodes or conductive structures fashioned as spacers are contacted via adjacent, horizontal, conductive structures arranged above a surface of a substrate. Connections between parts of memory cells occur via third conductive structures arranged at the sidewalls of the depressions and word lines via diffusion regions that are adjacent to the sidewalls of the depressions within the substrate, via first bit lines, via second bit lines and/or via conductive structures that are partially arranged at different heights with respect to an axis perpendicular to the surface. Contacts contact a plurality of parts of the MOS transistors simultaneously.
    • 每个存储单元包括六个MOS晶体管的SRAM单元布置,其中每个晶体管形成为垂直晶体管。 MOS晶体管布置在沟槽的侧壁。 存储单元的部分,例如栅极电极或形成为间隔物的导电结构,经由布置在衬底表面上方的相邻的水平导电结构接触。 存储器单元的部分之间的连接通过布置在凹陷和字线的侧壁处的第三导电结构经由第一位线经由第二位线和/或通孔的扩散区域经由衬底内的凹陷的侧壁相邻布置 相对于垂直于表面的轴部分地布置在不同高度的导电结构。 触头同时接触MOS晶体管的多个部分。
    • 68. 发明授权
    • Memory device and method providing logic connections for data transfer
    • 提供用于数据传输的逻辑连接的存储器件和方法
    • US07940575B2
    • 2011-05-10
    • US12058191
    • 2008-03-28
    • Roberto RavasioAndreas KuxDetlev RichterGirolamo GalloJosef WillerRamirez Xavier Veredas
    • Roberto RavasioAndreas KuxDetlev RichterGirolamo GalloJosef WillerRamirez Xavier Veredas
    • G11C7/10G11C8/12G11C16/06
    • G06F13/385Y02D10/14Y02D10/151
    • In an embodiment, a method for transferring data in a memory device is provided. The method may include transferring data from a first memory cell arrangement including a plurality of memory cells to a second memory cell arrangement including a plurality of memory cells via a connecting circuit arrangement coupled to the plurality of memory cell arrangements and providing a plurality of controllable connections via a plurality of connecting circuit terminals, the memory cell arrangements being connected with at least one connecting circuit terminal of the plurality of connecting circuit terminals, wherein the connecting circuit is configured to provide arbitrarily controllable signal flow connections between the plurality of connecting circuit terminals. The data are transferred via a logic connection using the controllable connections. Simultaneously, a further logic connection may be provided to a memory cell arrangement of the memory cell arrangements using the controllable connections.
    • 在一个实施例中,提供了一种用于在存储器件中传送数据的方法。 该方法可以包括经由耦合到多个存储器单元布置的连接电路装置将数据从包括多个存储单元的第一存储单元布置传送到包括多个存储单元的第二存储单元布置,并提供多个可控制的连接 通过多个连接电路端子,所述存储单元布置与所述多个连接电路端子中的至少一个连接电路端子连接,其中所述连接电路被配置为在所述多个连接电路端子之间提供任意可控的信号流连接。 数据通过使用可控连接的逻辑连接进行传输。 同时,可以使用可控制连接将另外的逻辑连接提供给存储器单元布置。
    • 70. 发明申请
    • Memory Device and Method Providing Logic Connections for Data Transfer
    • 为数据传输提供逻辑连接的存储器件和方法
    • US20090244949A1
    • 2009-10-01
    • US12058191
    • 2008-03-28
    • Roberto RavasioAndreas KuxDetlev RichterGirolamo GalloJosef WillerRamirez Xavier Veredas
    • Roberto RavasioAndreas KuxDetlev RichterGirolamo GalloJosef WillerRamirez Xavier Veredas
    • G11C5/06
    • G06F13/385Y02D10/14Y02D10/151
    • In an embodiment, a method for transferring data in a memory device is provided. The method may include transferring data from a first memory cell arrangement including a plurality of memory cells to a second memory cell arrangement including a plurality of memory cells via a connecting circuit arrangement coupled to the plurality of memory cell arrangements and providing a plurality of controllable connections via a plurality of connecting circuit terminals, the memory cell arrangements being connected with at least one connecting circuit terminal of the plurality of connecting circuit terminals, wherein the connecting circuit is configured to provide arbitrarily controllable signal flow connections between the plurality of connecting circuit terminals. The data are transferred via a logic connection using the controllable connections. Simultaneously, a further logic connection may be provided to a memory cell arrangement of the memory cell arrangements using the controllable connections.
    • 在一个实施例中,提供了一种用于在存储器件中传送数据的方法。 该方法可以包括经由耦合到多个存储器单元布置的连接电路装置将数据从包括多个存储单元的第一存储单元布置传送到包括多个存储单元的第二存储单元布置,并提供多个可控制的连接 通过多个连接电路端子,所述存储单元布置与所述多个连接电路端子中的至少一个连接电路端子连接,其中所述连接电路被配置为在所述多个连接电路端子之间提供任意可控的信号流连接。 数据通过使用可控连接的逻辑连接进行传输。 同时,可以使用可控制连接将另外的逻辑连接提供给存储器单元布置。