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    • 63. 发明授权
    • Cooling systems and electronic apparatus
    • 冷却系统和电子设备
    • US07903407B2
    • 2011-03-08
    • US12370651
    • 2009-02-13
    • Hitoshi MatsushimaHiroshi FukudaTadakatsu Nakajima
    • Hitoshi MatsushimaHiroshi FukudaTadakatsu Nakajima
    • H05K7/20
    • H05K7/20745
    • Temperature variation among electronic apparatuses installed in the data center is reduced, enhancement in reliability of the electronic apparatuses, and increase in service life are achieved, and efficient cooling of an electronic apparatus group is realized. Further, an electronic apparatus with low noise is provided. A front cover is provided on a front surface of an electronic apparatus, and a back cover is provided on a rear surface of it. A supplied air opening is formed at a lower side of the front cover, and an exhaust air opening is formed at an upper side of the back cover. The supplied air opening is connected to a blowing in opening from below the floor level, and the exhaust air opening is connected to a ceiling air duct. The ceiling air duct is provided with a heat exchanger, and indirect heat exchange is performed with external air.
    • 安装在数据中心的电子设备之间的温度变化减小,电子设备的可靠性提高,使用寿命延长,实现电子设备组的有效冷却。 此外,提供了具有低噪声的电子设备。 前盖设置在电子设备的前表面上,后盖设置在其后表面上。 在前盖的下侧形成供气口,在后盖的上侧形成有排气开口。 所供给的空气开口与地板下方的开口连通,排气口与天花板导风管连接。 天花板风管设有热交换器,并且用外部空气进行间接热交换。
    • 66. 发明授权
    • Controlling stress in MEMS structures
    • 控制MEMS结构中的应力
    • US07670861B2
    • 2010-03-02
    • US11698023
    • 2007-01-26
    • Yuko HanaokaTsukasa FujimoriHiroshi Fukuda
    • Yuko HanaokaTsukasa FujimoriHiroshi Fukuda
    • H01L21/00H01L21/44H01L21/461
    • B81C1/00246B81C2203/0735G01L9/0042G01L9/0073H01L21/32053
    • The objects of the present invention are to form MEMS structures of which stress is controlled while maintaining the performance of high-performance LSI, to integrate MEMS Structures and LSI on a single chip, to electrically and chemically protect the MEMS structure and to reduce the stress of the whole movable part of the MEMS structure. To achieve the above objects, a silicide film formable at a low temperature is used for the MEMS structure. The temperature at the silicide film deposition T1 is selected optionally with reference the heat treatment temperature T2 and the pseudo-crystallization temperature T3. T2, the temperature of manufacturing process after the silicide film deposition, is determined does not cause the degradation of the characteristics of the high-performance LSI indispensable. Thus, the residual stress of the MEMS structures may be controlled.
    • 本发明的目的是形成在保持高性能LSI的性能的同时控制应力的MEMS结构,将MEMS结构和LSI集成在单个芯片上,以电化学和化学保护MEMS结构并降低应力 的MEMS结构的整个可移动部分。 为了实现上述目的,在MEMS结构中使用了可在低温下形成的硅化物膜。 可选地参考热处理温度T2和假晶化温度T3来选择硅化物膜沉积T1处的温度。 T2,硅化物膜沉积后的制造工艺的温度被确定不会导致高性能LSI的特性劣化是不可缺少的。 因此,可以控制MEMS结构的残余应力。