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    • 66. 发明授权
    • Process for producing aromatic carboxylic acid
    • 芳香族羧酸的制造方法
    • US06506931B1
    • 2003-01-14
    • US09656997
    • 2000-09-07
    • Masayasu IshibashiHiroshi Tomita
    • Masayasu IshibashiHiroshi Tomita
    • C07C51255
    • C07C51/265C07C63/26
    • A process for producing an aromatic carboxylic acid by a liquid phase oxidation of an alkylaromatic compound with molecular oxygen in a reaction solvent comprising a lower aliphatic carboxylic acid in the presence of an oxidation catalyst, in which an aromatic carboxylic acid having an improved hue of the powdery product thereof and exhibiting an improved light transmittance when dissolved in an aqueous solution of a base can be produced efficiently in a simple manner by suppressing contamination due to the intermediates and by-products formed by side reactions, the said process comprising performing the liquid phase oxidation of the alkylaromatic compound in the presence of a hydrogen gas-treated liquid containing the catalyst.
    • 在氧化催化剂存在下,通过在含有低级脂肪族羧酸的反应溶剂中通过烷基芳族化合物与分子氧进行液相氧化来制备芳族羧酸的方法,其中具有改进的色调的芳族羧酸 通过抑制由副反应形成的中间体和副产物引起的污染,可以以简单的方式有效地制备溶解在碱的水溶液中时提高其透光度的粉末状产物,所述方法包括进行液相 在含有催化剂的氢气处理液体存在下,烷基芳族化合物的氧化。
    • 67. 发明授权
    • Wafer drying apparatus and method with residual particle removability enhancement
    • 晶圆干燥装置和残留颗粒去除性提高方法
    • US06286524B1
    • 2001-09-11
    • US09257384
    • 1999-02-25
    • Hisashi OkuchiHiroshi TomitaSoichi NadaharaKatsuya Okumura
    • Hisashi OkuchiHiroshi TomitaSoichi NadaharaKatsuya Okumura
    • B08B704
    • H01L21/67034Y10S134/902
    • A wafer dry cleaning method and apparatus capable of eliminating or suppressing adhesion of dust and particles on dried wafer surfaces while minimizing generation of water marks thereon. To achive this, the wafer dryer apparatus is configured including a surface cleaning/drying chamber structure which houses therein a set of spaced-apart silicon wafer workpieces. The dry chamber is operatively associated with a vacuum evacuation device for retaining the interior of this chamber at low pressures required. A water-drain device is provided for forcing water content separated off from the wafer surfaces to drain out of the drying vessel. During such wafer drying process, the wafers may be driven rotating at high speeds to thereby accelerate centrifugal spin-off of residual drops of water on wafer surfaces. Preferably, a chosen purge gas may be fed into the chamber during wafer rotation. The purge gas supply gets started substantially simultaneously upon activation of a vacuum pump for chamber evacuation, or after completion of such vacuum evacuation. In one illustrative embodiment ultrapure water may be used to rinse the wafers in the chamber.
    • 一种晶片干洗方法和装置,其能够消除或抑制灰尘和颗粒在干燥的晶片表面上的粘附,同时最小化其上的水痕的产生。 为了实现这一点,晶片干燥装置被构造成包括其中容纳一组间隔开的硅晶片工件的表面清洁/干燥室结构。 干燥室与真空排气装置可操作地相关联,用于将该室的内部保持在所需的低压。 设置排水装置,用于迫使从晶片表面分离的含水量从干燥容器排出。 在这样的晶片干燥过程中,晶片可被驱动高速旋转,从而加速晶片表面上剩余的水滴离心分离。 优选地,在晶片旋转期间可以将所选择的吹扫气体进料到室中。 在用于室抽真空的真空泵激活时或在完成这种真空排气之后,净化气体供应基本上同时启动。 在一个说明性实施例中,可以使用超纯水冲洗腔室中的晶片。