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    • 61. 发明申请
    • Method of Transmitting Feedback Information for Performing Collaborative Mimo
    • 传输反馈信息的方法,用于执行协作模拟
    • US20100309996A1
    • 2010-12-09
    • US12739351
    • 2008-12-28
    • Dong Guk LimSu Nam KimBin Chul IhmJae Wan Kim
    • Dong Guk LimSu Nam KimBin Chul IhmJae Wan Kim
    • H04L27/28
    • H04B7/024H04B7/0417H04B7/0621H04B7/0626H04B7/063H04B7/0632H04B7/0639
    • A method of transmitting information necessary for performing collaborative multi input multi output (MIMO) operation between a mobile station and a base station in order to improve reception performance of the mobile station in a multi-cell environment is provided. The mobile station may receive a feedback channel for the collaborative MIMO which is allocated by a serving base station and transmit a collaborative MIMO indicator including information indicating that the collaborative MIMO is started to the serving base station. In addition, the mobile station may transmit the feedback information of each of the serving base station and a collaborative base station to the serving base station through the feedback channel, and the serving base station may transmit the feedback information to the collaborative base station via a backbone network. The mobile station may receive the collaborative MIMO supported by the serving base station and the collaborative base station.
    • 提供了一种在移动台和基站之间传送执行协同多输入多输出(MIMO)操作所必需的信息以提高移动台在多小区环境中的接收性能的方法。 移动台可以接收由服务基站分配的协作MIMO的反馈信道,并发送包括表示协作MIMO开始的服务基站的信息的协作MIMO指示符。 此外,移动台可以通过反馈信道将服务基站和协作基站中的每一个的反馈信息发送到服务基站,并且服务基站可以经由以下操作将反馈信息发送到协作基站 骨干网。 移动台可以接收由服务基站和协作基站支持的协作MIMO。
    • 65. 发明申请
    • DEVICE AND METHOD FOR MEASURING VIA HOLE OF SILICON WAFER
    • 用于通过硅波孔测量的装置和方法
    • US20130206992A1
    • 2013-08-15
    • US13820575
    • 2011-06-24
    • Jong Han JinJae Wan KimJong Ahn KimChu-Shik Kang
    • Jong Han JinJae Wan KimJong Ahn KimChu-Shik Kang
    • G01B11/22G01B11/12
    • G01B11/22G01B9/02008G01B11/12G01B2210/56G01N21/9501G01N2021/95653
    • The present invention pertains to a device and a method for measuring a via hole of a silicon wafer, wherein it is possible to precisely measure the depth of the via hole without damaging the wafer. Broadband infrared light is radiated to a silicon wafer which has a superior light transmission property, so that the depth of the via hole may be measured from the light which is reflected from each boundary surface of the wafer and the interference signal of reference light. The via hole measuring device according to the present invention includes: a light source unit for generating broadband infrared light; and an interferometer for radiating the light generated from the light source unit to a silicon wafer, so as to measure the depth of a via hole formed on the wafer according to the spectrum period of the interference signal of the light, which is reflected from the silicon wafer.
    • 本发明涉及用于测量硅晶片的通孔的装置和方法,其中可以精确地测量通孔的深度而不损坏晶片。 宽带红外光被照射到具有优异的透光性的硅晶片,从而可以从从晶片的每个边界面反射的光和参考光的干涉信号测量通孔的深度。 根据本发明的通孔测量装置包括:用于产生宽带红外光的光源单元; 以及干涉仪,用于将从光源单元产生的光发射到硅晶片,以便根据光的干涉信号的光谱周期来测量形成在晶片上的通孔的深度,该距离从 硅晶片。