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    • 63. 发明授权
    • Methods for fabricating an integrated circuit
    • 制造集成电路的方法
    • US07622348B2
    • 2009-11-24
    • US11616858
    • 2006-12-28
    • James Pan
    • James Pan
    • H01L21/8242
    • H01L21/76897H01L21/28568H01L21/288H01L27/10855H01L27/10888H01L27/10894
    • Methods are provided for reducing the aspect ratio of contacts to bit lines in fabricating an IC including logic and memory. The method includes the steps of forming a first group of device regions to be contacted by a first level of metal and a second group of memory bit lines to be contacted by a second level of metal, the first level separated from the second level by at least one layer of dielectric material. Conductive material is plated by electroless plating on the device regions and bit lines and first and second conductive plugs are formed overlying the conductive material. The first conductive plugs are contacted by the first level of metal and the second conductive plugs are contacted by the second level of metal. The thickness of the plated conductive material provides a self aligned process for reducing the aspect ratio of the conductive plugs.
    • 提供了用于在制造包括逻辑和存储器的IC中减小与位线的触点的纵横比的方法。 该方法包括以下步骤:形成将由金属的第一级接触的第一组器件区域和与第二级金属接触的第二组存储器位线,该第一级与第二级与第二级分开 至少一层介电材料。 导电材料通过化学镀在器件区域和位线上进行电镀,并且第一和第二导电插塞形成在导电材料上。 第一导电插头与第一级金属接触,第二导电插头与第二级金属接触。 镀覆的导电材料的厚度提供了一种自对准的方法,用于减小导电插头的纵横比。