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    • 61. 发明申请
    • Substrate processing method
    • 基板加工方法
    • US20060231124A1
    • 2006-10-19
    • US11433616
    • 2006-05-15
    • Hiroshi WatanabeTamotsu MezakiShigeru KidoKiyofumi Sakaguchi
    • Hiroshi WatanabeTamotsu MezakiShigeru KidoKiyofumi Sakaguchi
    • B08B3/00
    • H01L21/67086B08B3/10H05K3/26
    • Provided is a processing method capable of reliably processing the inside of a depression such as a trench, a contact hole, a deep pattern, or a pore of a porous substrate. A chemical solution M is supplied into a processing bath 1 placing a substrate W, and the processing bath 1 is repetitively evacuated and pressurized several times at a pressure lower than the atmospheric pressure. Alcohol X is brought into contact with the surface of the substrate W and supplied into a depression W−1. The chemical solution M is supplied into the processing bath 1 containing the substrate W until the chemical solution M reaches a water level at which the substrate W is dipped, thereby allowing the chemical solution M to enter the depression W−1. The chemical solution M is discharged from the processing bath 1, and a portion of the chemical solution M entering the depression W−1 and mixed with the alcohol X is evaporated by evacuating the processing bath 1. This process is repeated several times.
    • 提供了能够可靠地处理诸如沟槽,接触孔,深图案或多孔基材的孔的凹陷的内部的处理方法。 将化学溶液M供给到放置基板W的处理槽1中,并且处理槽1在低于大气压的压力下重复抽真空并加压数次。 使酒精X与基板W的表面接触并供给到凹部W-1中。 将化学溶液M供给到含有基板W的处理槽1中,直到化学溶液M达到浸渍基板W的水位,从而使化学溶液M进入凹部W-1。 从处理槽1排出化学溶液M,通过抽出处理槽1蒸发进入凹部W-1并与醇X混合的部分化学溶液M. 这个过程重复几次。
    • 63. 发明授权
    • Edge-emitting type semiconductor laser
    • 边缘发射型半导体激光器
    • US07116691B2
    • 2006-10-03
    • US10766035
    • 2004-01-29
    • Masanobu AndoHiroshi Watanabe
    • Masanobu AndoHiroshi Watanabe
    • H01S5/20
    • B82Y20/00H01S5/22H01S5/34H01S2301/18
    • The interval Λ between each stripe of interference fringe generated in a conventional n-type contact layer is determined by a function (f(λ)=λ(n2−neq2)−1/2/2) wherein λ, n, and neq represent luminous wavelength λ of lights radiated from a light emitting part 104, refractive index n of the n-type contact layer, and equivalent refractive index neq of the n-type contact layer in guided wave mode, respectively. The remaining thickness δ of the n-type contact layer 102 at the concave part D which is formed at the back surface of the crystal growth substrate may be about Λ/2. When at least one portion of the n-type contact layer which is formed right beneath the laser cavity remains with about δ in thickness, the n-type contact layer arranged even right beneath the laser cavity can maintain excellent contact to a negative electrode. As a result, effective light confinement enables to adequately suppress ripples in FFP owing to lights leaked into the n-type contact layer, to thereby provide a semiconductor laser which oscillates stable lights.
    • 在常规n型接触层中产生的每条条纹干涉条纹之间的间隔Lλ由函数(f(λ)=λ(n≥0) 2/2)其中λ,n和n eq表示从发光部分辐射的光的发光波长λ 104,导向波模式中n型接触层的n型接触层的折射率n和等效折射率n eq eq 。 形成在晶体生长衬底的背面的凹部D处的n型接触层102的剩余厚度δ可以为约λ/ 2。 当在激光腔正下方形成的n型接触层的至少一部分保持厚度约为三角形时,即使在激光腔正下方布置的n型接触层可以保持与负电极的良好接触。 结果,有效的光限制能够充分地抑制由于光泄漏到n型接触层中的FFP中的波纹,从而提供振荡稳定的光的半导体激光器。