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61. 发明申请

US20060274075A1 Moving picture conversion apparatus and method, moving picture reconstruction apparatus and method, and computer program 审中-公开
标题翻译：运动图像转换装置和方法，运动图像重建装置和方法以及计算机程序
公开(公告)号：US20060274075A1
公开(公告)日：2006-12-07
申请号：US11418095
申请日：2006-05-05
申请人： Toshio Yamazaki , Seiji Kobayashi , Yasutaka Hirasawa
发明人： Toshio Yamazaki , Seiji Kobayashi , Yasutaka Hirasawa
IPC分类号： G06F12/02
CPC分类号： H04N19/59 , H04N19/132 , H04N19/137 , H04N19/176 , H04N19/587 , H04N19/61
摘要： A moving-picture conversion apparatus includes a block generator configured to generate blocks by dividing each frame forming moving picture data into the blocks, an amount-of-movement detector configured to detect an amount of movement of a subject corresponding to each block generated by the block generator, a block processor configured to receive the blocks generated by the block generator and information concerning the amount of movement detected by the amount-of-movement detector to perform decimation processing on the blocks, and a packing processor configured to receive the blocks decimated by the block processor to generate a packed block including pixel data forming the decimated blocks. The packing processor generates a packed block by correcting positions of pixels forming the packed block substantially to relative positions of the corresponding pixels forming an original image.
摘要翻译：运动图像转换装置包括块生成器，其被配置为通过将形成运动图像数据的每个帧划分为块来生成块;运动量检测器，被配置为检测与由所述块生成的每个块相对应的被摄体的移动量块生成器，块处理器，被配置为接收由块生成器生成的块和关于由移动量检测器检测到的移动量的信息以对块执行抽取处理;以及打包处理器，被配置为接收被舍弃的块通过块处理器来产生包括形成抽取块的像素数据的压缩块。打包处理器通过将形成打包块的像素的位置基本上校正到形成原始图像的对应像素的相对位置来生成打包块。

62. 发明申请

US20050054762A1 Silicone rubber coating composition and airbag 失效
标题翻译：硅橡胶涂料组合物和气囊
公开(公告)号：US20050054762A1
公开(公告)日：2005-03-10
申请号：US10934355
申请日：2004-09-07
申请人： Atsushi Yaginuma , Toshiyuki Ozai , Toshio Yamazaki , Masayuki Yoshida
发明人： Atsushi Yaginuma , Toshiyuki Ozai , Toshio Yamazaki , Masayuki Yoshida
IPC分类号： B60R21/16 , B05D7/00 , B05D7/24 , C08K5/5455 , C09D7/12 , C09D183/04 , D06M11/79 , D06M15/564 , C08K3/34 , C08K5/24
CPC分类号： C08K5/5455 , Y10T428/31663 , C08L83/04
摘要： A silicone rubber coating composition comprising (A) a diorganopolysiloxane containing an average of at least two alkenyl groups, (B) silica powder having a specific surface area of at least 50 m2/g, (C) an organosilicon compound containing a ureido group, an isocyanuric acid ester modified with an organosilicon compound or a (partial) hydrolytic condensate thereof, and (D) a curing agent is applied and vulcanized to base fabric to form a coated fabric, from which airbags are prepared. The composition has a sufficient adhesion to withstand high temperature and abrupt elongation upon inflation of the airbag even after long-term storage under hot humid conditions.
摘要翻译：一种硅橡胶涂料组合物，其包含（A）含有平均至少两个烯基的二有机聚硅氧烷，（B）比表面积至少为50m 2 / g的二氧化硅粉末，（C）含有脲基，用有机硅化合物或其（部分）水解缩合物改性的异氰脲酸酯，和（D）固化剂，并将其硫化成基布，形成涂布的织物，制备安全气囊。该组合物具有足够的粘附性，即使在热潮湿条件下长期储存后，气囊充气时也能承受高温和突然伸长。

63. 发明授权

US06770728B2 Process for preparing ocular lens with urethane compound and process for preparing urethane compound for medical instruments 失效
标题翻译：用氨基甲酸酯化合物制备眼镜片的方法和用于制备医疗器械的聚氨酯化合物的方法
公开(公告)号：US06770728B2
公开(公告)日：2004-08-03
申请号：US10284112
申请日：2002-10-31
申请人： Tsuyoshi Watanabe , Eri Ito , Sadayasu Tanikawa , Shoji Ichinohe , Toshio Yamazaki , Mouad Lamrani
发明人： Tsuyoshi Watanabe , Eri Ito , Sadayasu Tanikawa , Shoji Ichinohe , Toshio Yamazaki , Mouad Lamrani
IPC分类号： C08G1822
CPC分类号： C08G18/2063 , C08G18/222 , C08G18/672 , C08G18/8175 , C08G18/61
摘要： A process for preparing an ocular lens with a urethane compound comprising the steps of a) preparing a urethane compound by reacting at least one hydroxyl compound and at least one isocyanate compound in the presence of an organic iron compound, b) removing the organic iron compound from the urethane compound obtained in the step a) c) mixing the urethane compound obtained in the step b) with at least one compound selected from the group consisting of another copolymerizable compound, a crosslinking agent, a UV absorbent, a dye, a polymerization initiator, a photosensitizer, and an organic solvent to obtain a mixture, and d) curing the mixture obtained in the step c) to prepare a lens.
摘要翻译：一种制备具有氨基甲酸酯化合物的眼用透镜的方法，包括以下步骤：a）在有机铁化合物存在下使至少一种羟基化合物和至少一种异氰酸酯化合物反应制备氨基甲酸酯化合物，b）从有机铁化合物中除去有机铁化合物在步骤a）中获得的氨基甲酸酯化合物c）将步骤b）中获得的氨基甲酸酯化合物与至少一种选自另一种可共聚化合物，交联剂，UV吸收剂，染料，聚合引发剂，光敏剂和有机溶剂以获得混合物，并且d）固化步骤c）中获得的混合物以制备透镜。

64. 发明授权

US06365432B1 Fabrication process of semiconductor package and semiconductor package 失效
公开(公告)号：US06365432B1
公开(公告)日：2002-04-02
申请号：US09487682
申请日：2000-01-19
申请人： Naoki Fukutomi , Yoshiaki Tsubomatsu , Fumio Inoue , Toshio Yamazaki , Hirohito Ohhata , Shinsuke Hagiwara , Noriyuki Taguchi , Hiroshi Nomura
发明人： Naoki Fukutomi , Yoshiaki Tsubomatsu , Fumio Inoue , Toshio Yamazaki , Hirohito Ohhata , Shinsuke Hagiwara , Noriyuki Taguchi , Hiroshi Nomura
IPC分类号： H01L2144
CPC分类号： H01L21/568 , H01L21/4803 , H01L21/56 , H01L21/561 , H01L23/3121 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/97 , H01L2221/68377 , H01L2224/16237 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/83001 , H01L2224/83102 , H01L2224/8319 , H01L2224/83385 , H01L2224/8381 , H01L2224/8385 , H01L2224/85001 , H01L2224/92125 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15183 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/203 , H01L2924/351 , H05K3/20 , H01L2224/85 , H01L2924/00014 , H01L2224/83 , H01L2224/92247 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2924/0002
摘要： A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.

65. 发明授权

US6064111A Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package 失效
标题翻译：用于保持半导体封装芯片，半导体封装和半导体封装的制造工艺的衬底
公开(公告)号：US6064111A
公开(公告)日：2000-05-16
申请号：US903996
申请日：1997-07-31
申请人： Yoshiki Sota , Koji Miyata , Toshio Yamazaki , Fumio Inoue , Hidehiro Nakamura , Yoshiaki Tsubomatsu , Yasuhiko Awano , Shigeki Ichimura , Masami Yusa , Yorio Iwasaki
发明人： Yoshiki Sota , Koji Miyata , Toshio Yamazaki , Fumio Inoue , Hidehiro Nakamura , Yoshiaki Tsubomatsu , Yasuhiko Awano , Shigeki Ichimura , Masami Yusa , Yorio Iwasaki
IPC分类号： H01L23/02 , H01L23/498 , H01L23/495 , H01L21/44
CPC分类号： H01L23/4985 , H01L24/97 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/83192 , H01L2224/97 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/12042 , H01L2924/15183 , H01L2924/15311 , H01L2924/181
摘要： A semiconductor packaging chip-supporting substrate of the present invention comprises an insulating supporting substrate, wiring provided on the substrate, and an insulating film provided on the wiring. The wiring each have i) an inner connection that connects to a semiconductor chip electrode and ii) a semiconductor chip-mounting region. An opening is also provided in the insulating supporting a substrate at its part where each of the wiring is formed on the insulating supporting substrate, which is the part where an outer connection conducting to the inner connection is provided. The insulating film is formed at the part on which the semiconductor chip is mounted, covering the semiconductor chip-mounting region of the wiring.
摘要翻译：本发明的半导体封装芯片支撑基板包括绝缘支撑基板，设置在基板上的布线和设置在布线上的绝缘膜。布线各自具有i）连接到半导体芯片电极的内部连接，以及ii）半导体芯片安装区域。在绝缘支撑基板上的绝缘性支撑基板上形成有各自的配线的绝缘物的绝缘体上设置开口部，绝缘性支撑基板是设置有内部连接部的外部连接部的部分。绝缘膜形成在安装有半导体芯片的部分，覆盖布线的半导体芯片安装区域。

66. 发明授权

US5976912A Fabrication process of semiconductor package and semiconductor package 失效
标题翻译：半导体封装和半导体封装的制造工艺
公开(公告)号：US5976912A
公开(公告)日：1999-11-02
申请号：US716362
申请日：1996-09-18
申请人： Naoki Fukutomi , Yoshiaki Tsubomatsu , Fumio Inoue , Toshio Yamazaki , Hirohito Ohhata , Shinsuke Hagiwara , Noriyuki Taguchi , Hiroshi Nomura
发明人： Naoki Fukutomi , Yoshiaki Tsubomatsu , Fumio Inoue , Toshio Yamazaki , Hirohito Ohhata , Shinsuke Hagiwara , Noriyuki Taguchi , Hiroshi Nomura
IPC分类号： H01L21/48 , H01L21/56 , H01L21/58 , H01L21/68 , H01L23/31 , H01L23/498 , H05K3/20 , H01L23/28
CPC分类号： H01L21/568 , H01L21/4803 , H01L21/56 , H01L21/561 , H01L23/3121 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/4985 , H01L24/32 , H01L24/83 , H01L24/97 , H01L2221/68377 , H01L2224/16237 , H01L2224/2919 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2224/83001 , H01L2224/83102 , H01L2224/8319 , H01L2224/83385 , H01L2224/8381 , H01L2224/8385 , H01L2224/85001 , H01L2224/92125 , H01L2224/97 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/07811 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15183 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2924/203 , H01L2924/351 , H05K3/20
摘要： A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.
摘要翻译： PCT No.PCT / JP95 / 00492 Sec。 371日期1996年9月18日 102（e）1996年9月18日PCT PCT 1995年3月17日PCT公布。公开号WO95 / 26047 日期1995年9月28日提供了半导体封装基板，可以满足半导体高集成化的趋势。将镍层电镀在电镀铜箔上以形成布线图案。将LSI芯片安装在铜箔上，通过引线接合连接LSI芯片和布线图案的端子，然后用半导体密封环氧树脂密封。只有铜箔用碱蚀刻剂溶解掉才能暴露镍。对于具有低铜溶力的镍剥离器，去除镍层以露出布线图案。涂覆阻焊剂，并且以使连接端子部分露出的方式形成图案。将焊球放置在布线图案的露出部分，然后熔合。布线图案通过焊球与外部印刷电路板连接。

67. 发明授权

US5776596A Magnetic recording medium having a magnetic layer and intermediate layer each containing a specified fatty acid and fatty acid ester 失效
标题翻译：具有磁性层和中间层的磁记录介质各自含有特定的脂肪酸和脂肪酸酯
公开(公告)号：US5776596A
公开(公告)日：1998-07-07
申请号：US754958
申请日：1996-11-22
申请人： Toshio Yamazaki , Shigeaki Wakana , Satoshi Nagai , Tetsutaro Inoue
发明人： Toshio Yamazaki , Shigeaki Wakana , Satoshi Nagai , Tetsutaro Inoue
IPC分类号： C08K5/09 , C08K5/10 , C08L5/10 , C09D5/23 , C09D7/12 , G11B5/71 , G11B5/73 , G11B5/735 , G11B5/738
CPC分类号： G11B5/71 , G11B5/738 , Y10S428/90 , Y10T428/24942 , Y10T428/24975 , Y10T428/256 , Y10T428/265
摘要： A magnetic recording medium comprising a nonmagnetic substrate, an intermediate layer provided on the nonmagnetic substrate, and a magnetic layer provided on the intermediate layer, wherein the magnetic layer contains, as a lubricant, (A) a fatty acid ester derived from a straight-chain or branched aliphatic alcohol having 3 to 7 carbon atoms and a straight-chain or branched fatty acid having 12 to 18 carbon atoms and (B) a fatty acid ester derived from a straight-chain or branched aliphatic alcohol having 8 to 14 carbon atoms and a straight-chain or branched fatty acid having 12 to 18 carbon atoms.
摘要翻译：一种磁记录介质，包括非磁性基板，设置在非磁性基板上的中间层和设置在中间层上的磁性层，其中磁性层含有：（A）由直链状的基材衍生的脂肪酸酯，具有3至7个碳原子的直链或支链脂族醇和具有12至18个碳原子的直链或支链脂肪酸和（B）衍生自具有8至14个碳原子的直链或支链脂族醇的脂肪酸酯和具有12至18个碳原子的直链或支链脂肪酸。

68. 发明授权

US5703143A Ocular lens material 失效
标题翻译：眼镜材料
公开(公告)号：US5703143A
公开(公告)日：1997-12-30
申请号：US590600
申请日：1996-01-24
申请人： Haruyuki Hiratani , Kazuhiko Nakada , Toshio Yamazaki , Shoji Ichinohe
发明人： Haruyuki Hiratani , Kazuhiko Nakada , Toshio Yamazaki , Shoji Ichinohe
IPC分类号： G02C7/04 , A61L27/00 , C08G65/48 , C08L71/12 , G02B1/04 , G02C7/02
CPC分类号： G02B1/043
摘要： A transparent ocular lens material comprising a silicon-containing polymer having a recurring unit represented by the general formula (I): ##STR1## wherein each of R.sup.1, R.sup.2, R.sup.3 and R.sup.4 is independently hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms or a group represented by the general formula (lI): ##STR2## in which each of R.sup.5, R.sup.6 and R.sup.7 is independently an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms or phenyl group. The ocular lens material has excellent transparency, high oxygen permeability and heat resistance, and excellent ultraviolet-ray absorbing properties and forming and processing properties, and has a relatively high refractive index.
摘要翻译：一种透明眼透镜材料，其包含具有由通式（I）表示的重复单元的含硅聚合物：其中R 1，R 2，R 3和R 4各自独立地为氢原子，具有1个具有1至5个碳原子的烷氧基或由通式（I）表示的基团：其中R 5，R 6和R 7各自独立地为具有1至5个碳原子的烷基碳原子，碳原子数1〜5的烷氧基或苯基。眼透镜材料具有优异的透明性，高透氧性和耐热性，并且具有优异的紫外线吸收特性和成形加工性能，并且具有较高的折射率。

69. 发明授权

US5543442A Ocular lens material 失效
标题翻译：眼镜材料
公开(公告)号：US5543442A
公开(公告)日：1996-08-06
申请号：US274293
申请日：1994-07-12
申请人： Haruyuki Hiratani , Kazuhiko Nakata , Shoji Ichinohe , Toshio Yamazaki , Hideto Kato
发明人： Haruyuki Hiratani , Kazuhiko Nakata , Shoji Ichinohe , Toshio Yamazaki , Hideto Kato
IPC分类号： C08G73/10 , G02B1/04 , H01H9/00
CPC分类号： C08G73/106 , C08G73/1039 , G02B1/043
摘要： A transparent ocular lens material comprising a condensation polymer prepared by the condensation polymerization of a monomer mixture comprising (A) an aromatic tetracarboxylic acid dianhydride and (B) at least one diamino compound selected from (a) a silicon-containing diamine, (b) a diamino-substituted benzene and (c) a diamino-substituted diphenyl. The ocular lens material is excellent in transparency, having high oxygen permeability and moreover, excellent in heat resistance, ultraviolet-ray absorbing property and forming and processing property. Therefore, the ocular lens material can be suitably used in contact lenses, intraocular lenses, and the like.
摘要翻译：一种透明眼用透镜材料，其包含通过包含（A）芳族四羧酸二酐和（B）至少一种选自（a）含硅二胺，（b）二氨取代的苯和（c）二氨基取代的二苯基。眼透镜材料的透明度优异，透氧性高，耐热性，紫外线吸收性，成型加工性优异。因此，眼透镜材料可以适用于隐形眼镜，人工晶状体等。

70. 发明授权

US5516868A Vinyl copolymer, method for making, and room temperature curing resin composition 失效
标题翻译：乙烯基共聚物，制备方法和室温固化树脂组合物
公开(公告)号：US5516868A
公开(公告)日：1996-05-14
申请号：US497052
申请日：1995-06-30
申请人： Toshio Yamazaki , Shinichi Morioka , Nobuyuki Syzuki , Ichinobe Shoji
发明人： Toshio Yamazaki , Shinichi Morioka , Nobuyuki Syzuki , Ichinobe Shoji
IPC分类号： C08F230/08 , C08G77/08
CPC分类号： C08F230/08
摘要： A vinyl copolymer is provided comprising a silanol group-containing (meth)acryl siloxane unit of formula (1): ##STR1## wherein R.sup.1 is hydrogen or methyl, R.sup.2, R.sup.3, and R.sup.4 are independently a monovalent C.sub.1 -C.sub.8 hydrocarbon group or a siloxy group, R.sup.5 is a monovalent C.sub.1 -C.sub.8 hydrocarbon group, n=1 to 12, and a=0 or 1. The vinyl copolymer is prepared by copolymerizing a polymerizable vinyl monomer with a silanol group-containing (meth)acryl siloxane in the presence of a radical initiator or by emulsion polymerizing a polymerizable vinyl monomer with a silanol group-containing (meth)acryl siloxane in an aqueous medium in the presence of a surfactant and a polymerization initiator. The copolymer is blended with a condensation catalyst to form a room temperature curable resin composition which crosslinks in the presence of moisture into a cured coating having weatherability, flexibility, and adherence.
摘要翻译：提供了包含式（1）的含硅烷醇基的（甲基）丙烯酸硅氧烷单元的乙烯基共聚物：其中R1是氢或甲基，R2，R3和R4独立地是一价C1-C8烃基团或甲硅烷氧基，R5是单价C1-C8烃基，n = 1〜12，a = 0或1.乙烯基共聚物通过将可聚合乙烯基单体与含硅烷醇基的（甲基）丙烯酸在自由基引发剂的存在下，通过在水性介质中，在表面活性剂和聚合引发剂的存在下，使可聚合的乙烯基单体与含硅烷醇基的（甲基）丙烯酸硅氧烷乳液聚合。将共聚物与缩合催化剂混合以形成室温可固化树脂组合物，其在水分存在下交联成具有耐候性，柔韧性和粘附性的固化涂层。

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