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61. 发明专利

JP2009111080A Electronic component mounting method, and electronic component substrate mounting structure 有权
标题翻译：电子元件安装方法和电子元件基板安装结构
公开(公告)号：JP2009111080A
公开(公告)日：2009-05-21
申请号：JP2007280678
申请日：2007-10-29
申请人： Hitachi Kyowa Engineering Co Ltd , 日立協和エンジニアリング株式会社
发明人： SAKAMOTO EIJI , HATA SHOHEI , TAKEMORI HIDEAKI , KOIZUMI TOSHIAKI , FUJINAGA TAKESHI
IPC分类号： H01L21/52 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To provide an electronic component mounting method for improving characteristics of an electronic component such as an optical element by securing the excellent wettability of solder at a solder joining portion, and preventing the deterioration of heat dissipation properties.
SOLUTION: The electronic component mounting method includes processes of: forming a first conductor layer 5 in at least part of a region where the electronic component is mounted on the principal surface side of a substrate 4 where the electronic component 1 is mounted; forming solder 6 at least part of the first conductor layer; forming a projection 7 on the first conductor layer other than the solder or the principal surface of the substrate in a region where the electronic component is mounted on the principal surface side of the substrate; and joining the electronic component to the first conductor layer on the principal surface side of the substrate and mounting it by fusing the solder in a state that the electronic component is supported by the projection.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过确保焊料在焊料接合部分的优异润湿性而提高电子部件如光学元件的特性的电子部件安装方法，并且防止散热性能的劣化。电子部件安装方法包括以下处理：在安装有电子部件1的基板4的主面侧的至少一部分中形成电子部件的区域的第一导体层5; 形成焊料6至少部分第一导体层; 在电子部件安装在基板的主面上的区域中，在焊料或基板的主面以外的第一导体层上形成突起7; 并将电子部件接合到基板的主表面侧的第一导体层，并通过在电子部件被突起支撑的状态下使焊料熔合来进行安装。版权所有（C）2009，JPO＆INPIT

62. 发明专利

JP2009107903A Method and device for cutting carbon nanotube 审中-公开
标题翻译：用于切割碳纳米管的方法和装置
公开(公告)号：JP2009107903A
公开(公告)日：2009-05-21
申请号：JP2007283769
申请日：2007-10-31
申请人： Hitachi Kenki Fine Tech Co Ltd , Hitachi Kyowa Engineering Co Ltd , 日立協和エンジニアリング株式会社 , 日立建機ファインテック株式会社
发明人： HIROOKA MASAYUKI , OKAI MAKOTO , MORIMOTO TAKASHI , SEKINO SATOSHI , TANAKA HIROKI , TAKASHINA MASATO , UOZUMI YUKI
IPC分类号： C01B31/02 , B82B3/00 , G01Q70/12
摘要： PROBLEM TO BE SOLVED: To provide a method and a device which are suitable for adjusting the length of a carbon nanotube in the order of several tens of nanometers and can cut the carbon nanotube in such a manner that the cylindrical form is kept to the tip part.
SOLUTION: One end of a carbon nanotube to be cut is fixed to a base material, and another carbon nanotube is loaded on an electrode. The other end of the carbon nanotube fixed to the base material and the end part of the carbon nanotube loaded on the electrode are brought into contact to each other, and then an electric current or a pulse electric current is applied between the base material and the electrode by the discharge of a capacitor. Thereby, the tip part of the carbon nanotube fixed to the base material is sublimated and cut by Joule heat generated at the contact part of two carbon nanotubes. The length of the carbon nanotube can be finely adjusted in the interval of several tens of nanometers by repeating the cutting. Further, the cylindrical form can be kept to the tip part.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种方法和装置，其适用于调整数十纳米级数量级的碳纳米管的长度，并且可以以保持圆柱形状的方式切割碳纳米管到尖端部分。解决方案：待切割的碳纳米管的一端固定在基材上，另一个碳纳米管装载在电极上。固定在基材上的碳纳米管的另一端和负载在电极上的碳纳米管的端部彼此接触，然后在基材和第二基板之间施加电流或脉冲电流电极通过放电电容器。由此，固定在基材上的碳纳米管的前端部通过在两个碳纳米管的接触部分产生的焦耳热升华并切割。通过重复切割可以在几十纳米的间隔内精细调节碳纳米管的长度。此外，圆柱形状可以保持在尖端部分。版权所有（C）2009，JPO＆INPIT

63. 发明专利

JP2008276986A Microwave irradiating device 有权
标题翻译：微波辐射器件
公开(公告)号：JP2008276986A
公开(公告)日：2008-11-13
申请号：JP2007116141
申请日：2007-04-25
申请人： Hitachi Kyowa Engineering Co Ltd , Hitachi Ltd , 日立協和エンジニアリング株式会社 , 株式会社日立製作所
发明人： TAGUCHI MASAMITSU , BABA NOBORU , OGURO TOMOKATSU , OGURA TOSHIO , KUGA MASUMI
IPC分类号： H05B6/74 , H05B6/70
CPC分类号： H05B6/701 , H05B6/688 , H05B6/704 , H05B6/705 , H05B6/707 , H05B6/806 , H05B2206/044 , Y02B40/143
摘要： PROBLEM TO BE SOLVED: To provide a microwave irradiating device capable of controlling and simultaneously irradiating an electric field and a magnetic field of the microwave to be irradiated respectively and independently. SOLUTION: The microwave irradiating device 101 is equipped with an applicator part 1 having the inner space 19 capable of housing an irradiated object 12, a second microwave generating part 3 to output a first microwave into the inner space 19 in a first mode, and to generate a large electric field and a small magnetic field in a prescribed place (place where irradiated object 12 is) of the inner space 19, and a first microwave generating part 2 to output a second microwave into the inner space 19 in a second mode in which a polarization plane crosses that of the first microwave, and to form a large magnetic field and a small electric field in a prescribed place. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供能够分别并且独立地控制并同时照射要照射的微波的电场和磁场的微波照射装置。解决方案：微波照射装置101装备有具有能够容纳照射物体12的内部空间19的施加器部分1，第二微波产生部分3，以第一模式将第一微波输出到内部空间19中并且在内部空间19的规定位置（被照射物体12的位置）产生大的电场和小的磁场，以及第一微波产生部2，以将第二微波输出到内部空间19中偏振面与第一微波相交的第二模式，并且在规定的地方形成大的磁场和小的电场。版权所有（C）2009，JPO＆INPIT

64. 发明专利

JP2008203124A Apparatus and method for monitoring carbon dioxide leakage and method for fixing carbon dioxide in ground 有权
标题翻译：用于监测二氧化碳泄漏的方法和方法，用于在地下固定二氧化碳
公开(公告)号：JP2008203124A
公开(公告)日：2008-09-04
申请号：JP2007040415
申请日：2007-02-21
申请人： General Environmental Technos Co Ltd , Hitachi Kyowa Engineering Co Ltd , 日立協和エンジニアリング株式会社 , 株式会社環境総合テクノス
发明人： KONASE ATSUSHI , NAGAOKA HIDEYUKI , NAKO MASAO , KOMAKI HIRONOBU , FUJITA MASAHITO
IPC分类号： G01N1/22 , C12M1/34 , C12Q1/02 , C12Q1/64
CPC分类号： E21B41/0064 , Y02C10/14
摘要： PROBLEM TO BE SOLVED: To distinguish between the concentration of carbon dioxide generated by metabolism of organisms and the amount of leakage of the concentration of carbon dioxide forced in the ground and force an appropriate amount of carbon dioxide in the ground.
SOLUTION: The presence or absence of leakage of carbon dioxide is evaluated by measuring apparent oxygen utilization by metabolism of organisms in a chamber 2, measuring the concentration of carbon dioxide in the chamber, and computing the balance between the apparent oxygen utilization by metabolism of organisms and the concentration of carbon dioxide.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：区分生物体代谢产生的二氧化碳的浓度和被迫在地下的二氧化碳浓度的泄漏量，并强制在地下施加适量的二氧化碳。解决方案：通过测量室2中生物体的代谢来测量表观氧利用率，测量室中二氧化碳的浓度，并计算表观氧利用率之间的平衡来评估二氧化碳泄漏的存在或不存在生物体的代谢和二氧化碳的浓度。版权所有（C）2008，JPO＆INPIT

65. 发明专利

JP2007256045A Cantilever, its using method, lsi inspecting apparatus, and lithography device 审中-公开
标题翻译： CANTILEVER，其使用方法，LSI检测设备和LITHOGRAPHY设备
公开(公告)号：JP2007256045A
公开(公告)日：2007-10-04
申请号：JP2006080267
申请日：2006-03-23
申请人： Hitachi Kenki Fine Tech Co Ltd , Hitachi Kyowa Engineering Co Ltd , 日立協和エンジニアリング株式会社 , 日立建機ファインテック株式会社
发明人： HIDAKA KISHIFU , HIROOKA MASAYUKI , HAYASHIBARA MITSUO , FUJIEDA TADASHI , TANAKA HIROKI , TAKASHINA MASATO , UOZUMI YUKI , MORIMOTO TAKASHI , SEKINO SATOSHI
IPC分类号： B82B3/00 , G01Q30/02 , G01Q60/24 , G01Q60/36 , G01Q60/38 , G01Q70/00 , G01Q70/12 , G01Q80/00 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a contact type cantilever of high rigidity, its using method, and an LSI inspecting apparatus and lithography device having the cantilever.
SOLUTION: A probe of the cantilever is constituted by a heterocarbon nanotube. The heterocarbon nanotube obtained by doping nitrogen, boron or the like has high hardness and high rigidity. By using the heterocarbon nanotube for the probe of the cantilever, the deformation of the short probe can be prevented to suppress image obstruction.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供高刚性的接触式悬臂，其使用方法，以及具有悬臂的LSI检查装置和光刻装置。
解决方案：悬臂的探针由杂碳纳米管构成。通过掺杂氮，硼等获得的杂碳纳米管具有高硬度和高刚性。通过使用杂多碳纳米管作为悬臂的探针，可以防止短探头的变形以抑制图像阻塞。版权所有（C）2008，JPO＆INPIT

66. 发明专利

JP2005206858A Plating equipment and method therefor 审中-公开
标题翻译：涂装设备及其方法
公开(公告)号：JP2005206858A
公开(公告)日：2005-08-04
申请号：JP2004012586
申请日：2004-01-21
申请人： Hitachi Kyowa Engineering Co Ltd , 日立協和エンジニアリング株式会社
发明人： KATSUYAMA KUNIO , KADOTA HIROYUKI
IPC分类号： C25D7/12 , C25D17/06 , C25D21/10
摘要： PROBLEM TO BE SOLVED: To provide plating equipment and a method therefor which facilitate supply of new plating liquid to the surface to be plated having a deep hole or a deep groove, or a hole or a groove having a high aspect ratio, and enable plating to be performed in a short period of time.
SOLUTION: The plating equipment is provided with: a plating tank; an anode plate suspended from above inside the plating tank; a stage for holding under vacuum an object to be plated suspended from above and opposite to the anode plate; and a pressing apparatus pressing the stage against the opening part provided at the side part of the plating tank, wherein stirring members stirring plating liquid in the plating tank in one direction with respect to the plating face in the object to be plated simultaneously at the upper and lower parts of the plating face and a driving apparatus driving the stirring members are equipped.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供便于向具有深孔或深槽的被镀表面或具有高纵横比的孔或槽提供新的电镀液的电镀设备及其方法，并且能够在短时间内进行电镀。
解决方案：电镀设备配有：镀槽; 阳极板从镀槽上方悬挂; 用于在真空下保持从阳极板的上方和对面悬挂的被镀物体的阶段; 以及将台架压靠在设置在电镀槽侧部的开口部的按压装置，其中搅拌部件将电镀槽中的电镀液体相对于被镀物体中的电镀面向同一方向在上方配置电镀面的下部和驱动搅拌部件的驱动装置。版权所有（C）2005，JPO＆NCIPI

67. 发明专利

JP2004347326A Nondestructive diagnostic device 审中-公开
公开(公告)号：JP2004347326A
公开(公告)日：2004-12-09
申请号：JP2003141266
申请日：2003-05-20
申请人： Hitachi Kyowa Engineering Co Ltd , Hitachi Ltd , 日立協和エンジニアリング株式会社 , 株式会社日立製作所
发明人： YAMAMOTO YUSUKE , KATAGIRI JUNICHI , MOGI MANABU , SHOJI HIROSHI , OTAKA KENICHI
IPC分类号： G01N21/27 , G01N21/01
摘要： PROBLEM TO BE SOLVED: To allow nondestructive diagnosis even under a radiation environment, and to enhance measuring precision, operability, safety and workability, in an optical fiber probe device.
SOLUTION: In this nondestructive diagnostic device provided with an optical fiber probe, and using a reflection absorbance difference of light on a sample surface, a tip portion of the optical fiber probe is made removable, the tip portion of the optical fiber probe is recessed, the tip portion is thereby removed to be carried to an outside of a radiation control area, in the case where a contaminant deposited on the measuring object surface is deposited on the probe tip portion, when used in the control area, and the diagnostic precision is enhanced in the measuring object having a round surface such as a cable.
COPYRIGHT: (C)2005,JPO&NCIPI

68. 发明专利

JP2004209485A Welding method and welding device 有权
公开(公告)号：JP2004209485A
公开(公告)日：2004-07-29
申请号：JP2002378872
申请日：2002-12-27
申请人： Hitachi Kyowa Engineering Co Ltd , Hitachi Ltd , 日立協和エンジニアリング株式会社 , 株式会社日立製作所
发明人： IMANAGA AKIYOSHI , HANEDA MITSUAKI , SEKI TATSURO , TOYODA SEIICHI , SATO TOSHIMI
IPC分类号： B23K9/09 , B23K9/095 , B23K9/127
摘要： PROBLEM TO BE SOLVED: To provide a welding method suitable for changes of the length of a feeding cable to be used for arc welding in which a welding wire is used as an electrode, and a device.
SOLUTION: Average welding voltage E is obtained by previously adding average arc voltage Va corresponding to the magnitude of a desired average welding current Ia, an estimated value of first cable voltage Vk1 to be consumed by the average welding current Ia to flow in the reciprocating length (the shortest is 30 m and the longest is 150 m) of the changed feeding cable, and first reactor voltage VL1 to be consumed by a reactor in a welding circuit. It is set to a welding power source 10. The desired average arc voltage Va is outputted at an arc welding part. Also, pulse voltage Vp or a pulse current Ip, which can supplement second cable voltage Vk2 to be consumed by a pulse current Ip to flow in the reciprocating length of the changed feeding cable and second reactor voltage VL2 to be consumed by the reactor in the welding circuit, are set. The welding is executed by outputting the desired pulse current Ia and the pulse arc voltage Va.
COPYRIGHT: (C)2004,JPO&NCIPI

69. 发明专利

JP2004149924A Corrosion-resistant/wear-resistant alloy, and equipment using the same 审中-公开
公开(公告)号：JP2004149924A
公开(公告)日：2004-05-27
申请号：JP2003365410
申请日：2003-10-27
申请人： Hitachi Kyowa Engineering Co Ltd , Hitachi Ltd , 日立協和エンジニアリング株式会社 , 株式会社日立製作所
发明人： KIYOTOKI YOSHIHISA , CHIBA YOSHITERU , KUMAGAI MAKOTO , OGAWA SUKEHIRO , SAKAMOTO AKIRA , SHINOHARA HIROYUKI
IPC分类号： G21D1/00 , B21K1/20 , B23K20/00 , B23K103/08 , C21D8/00 , C21D9/00 , C22C19/00 , C22C19/03 , C22C38/00 , C22C38/58 , C22F1/00 , C22F1/10
CPC分类号： Y02E30/40
摘要： PROBLEM TO BE SOLVED: To provide corrosion-resistant/wear-resistant alloy for suppressing corrosion linkage of eutectic carbide to constitute the alloy under a dissolved oxygen atmosphere of cobalt-base, nickel-base or iron-base alloy used for sliding portions of equipment and valve seats.
SOLUTION: A material selected from the cobalt base with Cr and/or W added thereto, the nickel base with Fe and/or Cr added thereto, or the iron base with Cr and/or Ni added thereto is molded into an intermediate material of ingot or slab. The intermediate material is subjected to the hot plastic working at the temperature of ≥ 650°C to the solidus temperature or below. The eutectic carbide out of the structure consisting of the mesh-like eutectic carbide in the intermediate material and a base portion surrounded thereby of the intermediate material is formed into a plurality of granules or lumps in a non-continuous distribution. The friction coefficient is 0.1 to 0.5, and the Vickers hardness without aging effect is 300-600 Hv.
COPYRIGHT: (C)2004,JPO

70. 发明专利

JP2011249729A Optical element mounting substrate and optical element mounting package 审中-公开
标题翻译：光学元件安装基板和光学元件安装包
公开(公告)号：JP2011249729A
公开(公告)日：2011-12-08
申请号：JP2010124298
申请日：2010-05-31
申请人： Hitachi Kyowa Engineering Co Ltd , 日立協和エンジニアリング株式会社
发明人： SAKAMOTO EIJI , TAKEMORI HIDEAKI , HIGASHIYAMA MASASHI
IPC分类号： H01L33/48
摘要： PROBLEM TO BE SOLVED: To provide an optical element package with high airtightness and an optical element mounting substrate realizing the optical element package.SOLUTION: A second substrate 2 is arranged on a first substrate 1 having solder 6 connecting an optical element so that the solder 6 is surrounded. The first substrate 1 and the second substrate 2 are formed of ceramic. A first conductor layer 3 is formed on the first substrate 1 and a second conductor layer 5 is formed at a rear face of the first substrate 1. The first conductor layer 3 and the second conductor layer 5 are conducted, and the solder 6 is formed on the first conductor layer 3. A third conductor layer 9 which can be bonded to a glass 4 is laminated and formed with the first conductor layer 3. The first substrate 1 and the second substrate 2 are bonded by the glass 4 via the third conductor layer 9. Since the first substrate 1 and the second substrate 2 are bonded by the glass 4, infiltration of a moisture content from an interface is inhibited.
摘要翻译：要解决的问题：提供具有高气密性的光学元件封装和实现光学元件封装的光学元件安装基板。解决方案：第二基板2布置在具有连接光学元件的焊料6的第一基板1上，使得焊料6被包围。第一基板1和第二基板2由陶瓷形成。第一导体层3形成在第一基板1上，第二导体层5形成在第一基板1的背面。第一导体层3和第二导体层5被导通，形成焊料6 在第一导体层3上。可以与玻璃4接合的第三导体层9层叠并形成有第一导体层3.第一基板1和第二基板2经玻璃4经由第三导体由于第一基板1和第二基板2被玻璃4接合，所以抑制了从界面渗入含水量。版权所有（C）2012，JPO＆INPIT

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