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61. 发明授权

US08218334B2 Multi-chip module with multi-level interposer 有权
标题翻译：具有多级插入器的多芯片模块
公开(公告)号：US08218334B2
公开(公告)日：2012-07-10
申请号：US12719975
申请日：2010-03-09
申请人： Eugene M. Chow , John E. Cunningham , James G. Mitchell , Ivan Shubin
发明人： Eugene M. Chow , John E. Cunningham , James G. Mitchell , Ivan Shubin
IPC分类号： H05K1/14
CPC分类号： H01L23/49811 , H01L21/4853 , H01L21/6835 , H01L23/13 , H01L23/147 , H01L23/15 , H01L23/49827 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0652 , H01L2221/68309 , H01L2221/68345 , H01L2223/54426 , H01L2223/54473 , H01L2224/13 , H01L2224/13016 , H01L2224/131 , H01L2224/136 , H01L2224/16237 , H01L2224/81005 , H01L2224/81007 , H01L2224/81136 , H01L2224/81138 , H01L2224/81141 , H01L2224/81191 , H01L2224/81192 , H01L2224/81801 , H01L2224/81901 , H01L2924/0001 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01327 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15156 , H01L2924/15787 , Y10T29/49165 , Y10T29/49204 , Y10T29/49895 , Y10T29/49947 , H01L2924/00012 , H01L2224/13099 , H01L2924/00
摘要： A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors.
摘要翻译：描述了包括多层插入板的多层插入板和多芯片模块（MCM）。多层插入板的不同区域中的第一表面和第二表面具有相关联的不同厚度。此外，第一微弹簧连接器和第二微弹簧连接器分别设置在第一表面和第二表面上。在MCM中，多级插入板的给定的一个第一表面面向MCM中芯片阵列的第一层中的桥式芯片，使得设置在桥式芯片上的第一连接器机械地和电耦合到第一个微型弹簧连接器。类似地，多层插入板的给定的一个第二表面面向芯片阵列中的第二层中的岛状芯片，使得设置在岛状芯片上的第二连接器机械地和电耦合到第二微型弹簧连接器

62. 发明授权

US08039938B2 Airgap micro-spring interconnect with bonded underfill seal 有权
标题翻译：气隙微弹簧互连带粘合底部填充密封
公开(公告)号：US08039938B2
公开(公告)日：2011-10-18
申请号：US12471163
申请日：2009-05-22
申请人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
发明人： Christopher L. Chua , Bowen Cheng , Eugene M. Chow , Dirk De Bruyker
IPC分类号： H01L23/495 , H01L23/02 , H01L23/52 , H01L23/48 , H01L23/34
CPC分类号： H01L21/563 , H01L24/01 , H01L24/13 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L33/62 , H01L2224/13016 , H01L2224/1703 , H01L2224/17051 , H01L2224/17505 , H01L2224/17517 , H01L2224/73204 , H01L2224/81192 , H01L2224/81855 , H01L2224/81902 , H01L2224/83192 , H01L2225/06527 , H01L2225/06575 , H01L2225/06593 , H01L2924/01006 , H01L2924/01018 , H01L2924/01024 , H01L2924/01042 , H01L2924/01045 , H01L2924/014 , H01L2924/09701 , H01L2924/10329 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/00
摘要： A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, and an underfill material in a portion of the gap to form a mold from the pad chip and the spring chip. A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, an underfill material in the gap to form a mold from the pad chip and the spring chip, and at least one wall between the underfill material and the interconnect area. A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.
摘要翻译：封装包括具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，焊盘之间的组合材料芯片和布置成在垫片芯片和弹簧芯片之间形成间隙的弹簧芯片，以及在间隙的一部分中的底部填充材料，以从垫片芯片和弹簧芯片形成模具。封装包括具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，焊盘之间的组合材料芯片和弹簧芯片布置成在垫片芯片和弹簧芯片之间形成间隙，间隙中的底部填充材料从垫片芯片和弹簧芯片形成模具，以及底部填充材料和互连件之间的至少一个壁区。组装包装的方法包括将衬垫芯片与弹簧芯片对准以在互连区域中形成至少一个互连，将焊盘芯片粘附到弹簧芯片，使得在垫片芯片和弹簧芯片之间存在间隙，分配将填充材料填充到间隙中以将互连区域与包装外部的环境密封，并固化底部填充材料以形成固体模具。

63. 发明授权

US07982290B2 Contact spring application to semiconductor devices 有权
标题翻译：接触弹簧应用于半导体器件
公开(公告)号：US07982290B2
公开(公告)日：2011-07-19
申请号：US11331656
申请日：2006-01-12
申请人： Eugene M. Chow , Christopher L. Chua , Eric Peeters
发明人： Eugene M. Chow , Christopher L. Chua , Eric Peeters
IPC分类号： H01L23/495 , H01L29/40 , H01L23/48
CPC分类号： H01L24/11 , G01R1/06727 , G01R1/06761 , G01R3/00 , H01L21/568 , H01L21/6835 , H01L23/49811 , H01L24/12 , H01L24/742 , H01L24/81 , H01L2221/68368 , H01L2224/05023 , H01L2224/0508 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/13099 , H01L2224/16 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01033 , H01L2924/01054 , H01L2924/01082 , H01L2924/14
摘要： A contact spring applicator is provided which includes an applicator substrate, a removable encapsulating layer and a plurality of contact springs embedded in the removable encapsulating layer. The contact springs are positioned such that a bond pad on each contact spring is adjacent to an upper surface of the removable encapsulating layer. The contact spring applicator may also include an applicator substrate, a release layer, a plurality of unreleased contact springs on the release layer and a bond pad at an anchor end of each contact spring. The contact spring applicators apply contact springs to an integrated circuit chip, die or package or to a probe card by aligning the bond pads with bond pad landings on the receiving device. The bond pads are adhered to the bond pad landings. The encapsulating or release layer is then removed to separate the contact springs from the contact spring applicator substrate.
摘要翻译：提供接触弹簧施加器，其包括施加器基板，可移除的封装层和嵌入在可移除封装层中的多个接触弹簧。接触弹簧被定位成使得每个接触弹簧上的接合焊盘与可移除的封装层的上表面相邻。接触弹簧施加器还可以包括施加器基板，释放层，释放层上的多个未释放的接触弹簧和每个接触弹簧的锚固端处的接合垫。接触弹簧施加器通过将接合垫与接收装置上的接合垫平台对准，将接触弹簧施加到集成电路芯片，管芯或封装或探针卡。接合焊盘粘附到接合焊盘平台上。然后去除包封或释放层以将接触弹簧与接触弹簧施加器基板分离。

64. 发明申请

US20110067589A1 ANILOX METERING SYSTEM FOR ELECTROGRAPHIC PRINTING 有权
标题翻译：用于电子印刷的ANILOX计量系统
公开(公告)号：US20110067589A1
公开(公告)日：2011-03-24
申请号：US12566518
申请日：2009-09-24
申请人： Eugene M. Chow , Jing Zhou , Gerald A. Domoto , Grace T. Brewington
发明人： Eugene M. Chow , Jing Zhou , Gerald A. Domoto , Grace T. Brewington
IPC分类号： B41K1/38
CPC分类号： G03G15/104
摘要： An embodiment is a method and apparatus to meter ink for electrographic printing. An ink loading mechanism having an anilox roller fills ink from an ink supply into cells in the anilox roller having a plurality of valleys and lands that form the cells. The ink loading mechanism causes the valleys to be full or nearly full with the ink. The anilox roller rotates in a first direction. A blanket roller rotationally engaged with the anilox roller pulls the ink out of the cells and causes the valleys to be partially filled. The blanket roller rotates in a second direction. A first cleaning blade cleans tops of the lands of the cells.Another embodiment is a method and apparatus to meter ink for electrographic printing. An ink loading mechanism having an anilox roller fills ink from an ink supply into cells in the anilox roller having a plurality of valleys and lands forming the cells. The ink loading mechanism causes the valleys to be full or nearly full with the ink. The anilox roller rotates in a first direction. A soft blade positioned slightly below surface of the lands removes ink from the cells and causes the valleys the partially filled as the anilox roller rotates. A hard blade positioned at the surface of the lands to clean residue of ink on the surface of the lands as the anilox roller rotates.
摘要翻译：一个实施例是一种用于电印印刷墨水的方法和装置。具有网纹辊的墨水装载机构将油墨从墨水供给装入具有形成该单元的多个谷和平台的网纹辊中的单元中。墨水装载机构使墨水充满或接近满。网纹辊沿第一方向旋转。与网纹辊旋转地接合的橡皮布辊将墨水从电池中拉出并导致谷部分地被填充。橡皮布滚筒沿第二个方向旋转。第一清洁刀片清洁细胞的脊部的顶部。另一个实施例是一种计量油墨用于电印印刷的方法和装置。具有网纹辊的墨水装载机构将油墨从墨水供给装入具有形成单元的多个谷底的网纹辊中的单元中。墨水装载机构使墨水充满或接近满。网纹辊沿第一方向旋转。稍微位于焊盘表面下方的软刀片从电池中取出墨水，并使网纹辊旋转时部分填充的谷物。位于平台表面的硬刀片，以在网纹辊旋转时清洁焊盘表面上的油墨残留物。

65. 发明申请

US20110012980A1 LATENT RESISTIVE IMAGE LAYER FOR HIGH SPEED THERMAL PRINTING APPLICATIONS 有权
标题翻译：用于高速热打印应用的专利影像层
公开(公告)号：US20110012980A1
公开(公告)日：2011-01-20
申请号：US12502949
申请日：2009-07-14
申请人： Timothy D. Stowe , Eugene M. Chow , Ashish V. Pattekar , Eric Peeters
发明人： Timothy D. Stowe , Eugene M. Chow , Ashish V. Pattekar , Eric Peeters
IPC分类号： G01D15/10 , B41J2/315
CPC分类号： B41J2/0057
摘要： An imaging system including an image receiving structure including a tunable-resistivity material; and an energy source to emit an energy beam at the image receiving structure to pattern-wise program the tunable-resistivity material. A resistivity can be pattern-wise changed. Marking material can be pattern-wise adhered in response to the pattern-wise changed resistivity.
摘要翻译：一种成像系统，包括包括可调谐电阻率材料的图像接收结构; 以及在所述图像接收结构处发射能量束以对所述可调谐电阻率材料进行图案化编程的能量源。电阻率可以以图案方式改变。响应于图案形式的电阻率，标记材料可以以图案方式粘附。

66. 发明申请

US20100290501A1 NANOCALORIMETER BASED ON THERMAL PROBES 有权
标题翻译：基于热探测器的南极运动
公开(公告)号：US20100290501A1
公开(公告)日：2010-11-18
申请号：US12467072
申请日：2009-05-15
申请人： Dirk De Bruyker , Francisco E. Torres , Michal V. Wolkin , Gregory B. Anderson , Eugene M. Chow
发明人： Dirk De Bruyker , Francisco E. Torres , Michal V. Wolkin , Gregory B. Anderson , Eugene M. Chow
IPC分类号： G01K17/00
CPC分类号： G01K17/006 , B82Y35/00 , G01K2211/00
摘要： A nanocalorimeter includes a merging layer having, a drop placement area for holding drops to be merged and a thermal equilibration area. A measurement layer includes a substrate, and a temperature probe on the substrate, wherein the temperature probe extends out of the surface of the substrate to come into operative contact with the thermal equilibration area when the measurement layer is placed in operative association with the merging layer. The nanocalorimeter is configured to have the merging layer and the measurement layer non-integrated, making the measurement layer reusable.
摘要翻译：纳米尺度计包括具有用于保持要合并的液滴的液滴放置区域和热平衡区域的合并层。测量层包括衬底和衬底上的温度探针，其中当测量层与合并层可操作地相关联时，温度探针从衬底的表面延伸出来以与热平衡区域操作接触。纳米尺度计被配置为具有合并层和测量层非集成，使得测量层可重复使用。

67. 发明授权

US07800388B2 Curved spring structure with elongated section located under cantilevered section 有权
标题翻译：弯曲弹簧结构，细长部分位于悬臂部分下方
公开(公告)号：US07800388B2
公开(公告)日：2010-09-21
申请号：US11549066
申请日：2006-10-12
申请人： Thomas Hantschel , Eugene M. Chow
发明人： Thomas Hantschel , Eugene M. Chow
IPC分类号： G01R31/02
CPC分类号： H01G5/18 , G01R1/06738
摘要： A curved spring structure includes a base section extending parallel to the substrate surface, a curved cantilever section bent away from the substrate surface, and an elongated section extending from the base section along the substrate surface under the cantilevered section. The spring structure includes a spring finger formed from a self-bending material film (e.g., stress-engineered metal, bimorph/bimetallic) that is patterned and released. A cladding layer is then electroplated and/or electroless plated onto the spring finger for strength. The elongated section is formed from plating material deposited simultaneously with cladding layers. To promote the formation of the elongated section, a cementation layer is provided under the spring finger to facilitate electroplating, or the substrate surface is pre-treated to facilitate electroless plating.
摘要翻译：弯曲弹簧结构包括平行于基板表面延伸的基部部分，弯曲的远离基板表面的弯曲悬臂部分，以及从基部沿着悬臂部分下方的基板表面延伸的细长部分。弹簧结构包括由图案化和释放的自弯曲材料膜（例如，应力工程金属，双晶型/双金属）形成的弹簧指状物。然后将包覆层电镀和/或无电镀在弹簧手指上用于强度。细长部分由与包覆层同时沉积的电镀材料形成。为了促进细长部分的形成，在弹簧指状物下方设置有胶结层以促进电镀，或者基板表面被预处理以便于化学镀。

68. 发明申请

US20090233815A1 Capillary-Channel Probes For Liquid Pickup, Transportation And Dispense Using Stressy Metal 有权
标题翻译：用于液体拾取，运输和分配使用应力金属的毛细管通道探针
公开(公告)号：US20090233815A1
公开(公告)日：2009-09-17
申请号：US12428397
申请日：2009-04-22
申请人： Thomas Hantschel , David K. Fork , Eugene M. Chow , Dirk De Bruyker , Michel A. Rosa
发明人： Thomas Hantschel , David K. Fork , Eugene M. Chow , Dirk De Bruyker , Michel A. Rosa
IPC分类号： C40B50/18
CPC分类号： G01N35/1074 , B01J2219/00387 , B01L3/0244 , B01L3/0255 , B01L3/502715 , B01L2300/0819 , B01L2400/025 , B01L2400/0406 , B41J2/14314 , B41J2/16 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1643 , C40B60/14 , G01N35/1009 , G01N2035/00237 , G01N2035/1037 , G03F7/0002 , Y10T436/2575
摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.
摘要翻译：公开了可用于微阵列系统，浸笔纳米光刻系统，流体回路和微流体系统的流体导管，其使用包括至少一个毛细通道的通道弹簧探针。由释放时从基板弯曲的弹簧梁（例如，应力金属梁）形成，通道可以集成到弹簧梁中或形成在弹簧梁上。由窄通道产生的毛细管力允许液体被通道弹簧探针收集，保持和分配。由于可以使用传统的半导体工艺制造通道弹簧梁，所以可以实现显着的设计灵活性和成本效率。

69. 发明授权

US07524768B2 Method using monolayer etch masks in combination with printed masks 失效
标题翻译：使用单层蚀刻掩模与印刷掩模组合的方法
公开(公告)号：US07524768B2
公开(公告)日：2009-04-28
申请号：US11388718
申请日：2006-03-24
申请人： Eugene M. Chow , William S. Wong , Michael Chabinyc , Jeng Ping Lu , Ana Claudia Arias
发明人： Eugene M. Chow , William S. Wong , Michael Chabinyc , Jeng Ping Lu , Ana Claudia Arias
IPC分类号： H01L21/302
CPC分类号： H01L21/302 , H01L21/0271 , H01L21/0273 , H01L27/124 , H01L27/1288 , H01L27/1292 , H01L29/66765
摘要： A method to pattern films into dimensions smaller than the printed pixel mask size. A printed mask is deposited on a thin film on a substrate. The second mask layer is selectively deposited onto the film, but not to the printed mask. A third mask is then printed onto the substrate to pattern a portion of the second mask. Certain solvents are then used to remove the printed mask but not the mask layer on the thin film. The mask layer is then used to form a pattern on the thin film in combination with etching. The features formed in the thin film are smaller than the smallest dimension of the printed mask. The coated mask layer can be a self-assembled mono-layer or other material that selectively binds to the thin film.
摘要翻译：将薄膜图案尺寸小于印刷像素掩模尺寸的方法。印刷的掩模沉积在基底上的薄膜上。第二掩模层选择性地沉积在膜上，而不是印刷在掩模上。然后将第三掩模印刷到基底上以对第二掩模的一部分进行图案化。然后使用某些溶剂去除印刷的掩模，而不是薄膜上的掩模层。然后将掩模层与蚀刻结合在薄膜上形成图案。形成在薄膜中的特征小于印刷掩模的最小尺寸。涂覆的掩模层可以是选择性地结合薄膜的自组装单层或其它材料。

70. 发明授权

US07517769B2 Integrateable capacitors and microcoils and methods of making thereof 有权
标题翻译：可集成电容器和微型线圈及其制造方法
公开(公告)号：US07517769B2
公开(公告)日：2009-04-14
申请号：US11319075
申请日：2005-12-28
申请人： Koenraad Van Schuylenbergh , Eugene M. Chow , JengPing Lu
发明人： Koenraad Van Schuylenbergh , Eugene M. Chow , JengPing Lu
IPC分类号： H01L21/20
CPC分类号： H01G5/18 , H01F17/0006 , H01F17/02 , H01F21/04 , H01F27/40 , H01F41/041 , H01L28/10 , H01L28/40
摘要： Methods for integrally forming high Q tunable capacitors and high Q inductors on a substrate are described. A method for integrally forming a capacitor and a microcoil on a substrate may involve depositing and patterning a dielectric layer on the substrate, depositing and patterning a sacrificial layer on the substrate, depositing and patterning conductive material on the semiconductor substrate, depositing and patterning a polymer layer on the semiconductor substrate, removing an exposed portion of the conductive material exposed by the patterned polymer layer to release a portion of the conductive pattern from the semiconductor substrate to form out-of-plane windings of the microcoil, depositing second conductive material on exposed portions of the conductive material, and removing the sacrificial layer. The patterned conductive material may include a windings portion of the microcoil, an overlapping electrode portion of the capacitor and a support portion for the electrode of the capacitor.
摘要翻译：描述了在衬底上整体形成高Q可调谐电容器和高Q电感器的方法。用于在基板上一体地形成电容器和微线圈的方法可以包括在基板上沉积和图案化电介质层，在衬底上沉积和图案化牺牲层，在半导体衬底上沉积和图案化导电材料，沉积和图案化聚合物去除由所述图案化聚合物层暴露的所述导电材料的暴露部分，以从所述半导体衬底释放所述导电图案的一部分，以形成所述微线圈的面外绕组，将第二导电材料沉积在暴露的部分导电材料，并去除牺牲层。图案化导电材料可以包括微线圈的绕组部分，电容器的重叠电极部分和用于电容器电极的支撑部分。

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