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61. 发明专利

DE69328590T2 未知
公开(公告)号：DE69328590T2
公开(公告)日：2000-08-24
申请号：DE69328590
申请日：1993-07-15
申请人： TOKYO SEIMITSU CO LTD
发明人： HONDA KATSUO
IPC分类号： H01L21/304 , B28D5/00 , B28D5/02 , B28D7/04
摘要： An inner peripheral cutting edge (10) is made of a doughnut-shaped blade (12) deposited diamond grains, arranged rotatably in the directionof an arrow and held in a moving trestle (16). The moving trestle (16) is mounted movable in the direction of an arrow B along rails (18 and 18) located in sides of the inner peripheral cutting edge (10), and driven by instruction signals from a control section (20). A workpiece (22) is placed at the inner peripheral position of the inner peripheral cutting edge (10) and rocked about the axis thereof by a motor (25). The motor (25) is fitted on a beam member and driven by instruction signals from the control section (20). With this arrangement, the inner peripheral cutting edge (10) is rotated in the direction of the arrow A, and then the moving trestle (16) is fed in the direction of the arrow B by the control section (20) and the workpiece (22) is pressed against a grindstone (14) of the inner peripheral cutting edge (10), sthat the workpiece (22) is cut by a predetermined value, thereafter, the moving trestle (16) is stopped by the control section (20) and the workpiece (22) is rocked about the axis thereof by driving the motor (25), so that a reminder part can be cut.

62. 发明专利

DE10003240A1 Control procedure for wire saw involves controlling feed rate of workpiece based on comparison between calculated cutting load and predetermined reference value 未知
公开(公告)号：DE10003240A1
公开(公告)日：2000-08-17
申请号：DE10003240
申请日：2000-01-26
申请人： TOKYO SEIMITSU CO LTD , SUPER SILICON CRYSTAL RES INST
发明人： NAGATSUKA SHINJI , OKUBO SHIGERU , KAWARAI HIROSHI , OISHI HIROSHI , ASAKAWA KEIICHIRO , MATSUZAKI JUNICHI
IPC分类号： B24B27/06 , B23D57/00 , B23D59/00 , B28D5/00 , H01L21/304 , B28D1/08 , H01L21/302
摘要： The cutting load in cutting a workpiece is calculated. The calculated cutting load is compared with a predetermined reference value. The feed rate of the workpiece is controlled based on the comparison result. The amount of displacement of a wire in a wire row is measured during the cutting of the workpiece. The cutting load in the wire row is computed based on the first stage tension of the wire and the measured displacement quantity. An Independent claim is also included for a wire saw.

63. 发明专利

DE19955387A1 Polishing agent feed to semiconductor disc polisher based on chemical-mechanical polishing (CMP) for flattening intermediate insulation foil 未知
公开(公告)号：DE19955387A1
公开(公告)日：2000-07-27
申请号：DE19955387
申请日：1999-11-18
申请人： TOKYO SEIMITSU CO LTD
发明人： SAKAI KENJI , SATO MANABU
IPC分类号： B24B7/24 , B24B37/00 , B24B57/00 , B24B57/02 , H01L21/304 , H01L21/321
摘要： The semiconductor discs are polished by a CMP process, which provides several systems for feeding of different polishing sludges for the polishing of a metal layer and a block metal layer on a semiconductor disc. After finishing the polishing of one such layer, the feeding system of the polishing sludge is changed-over to a system suitable for the next layer for polishing on the same table. There is also a system for pure water feed for table washing during the change-over.

64. 发明专利

SG70632A1 Polishing apparatus 未知
公开(公告)号：SG70632A1
公开(公告)日：2000-02-22
申请号：SG1998000689
申请日：1998-04-03
申请人： TOKYO SEIMITSU CO LTD
发明人： NUMOTO MINORU , INABA TAKAO , SAKAI KENJI , TERASHITA HISASHI , SATOH MANABU
IPC分类号： B24B37/30 , B24B49/16 , B24B37/04
摘要： The polishing apparatus (100) comprises a turn table (10), which polishes a semiconductor wafer (2), and a holding and pressing part (20), which holds and presses the semiconductor wafer (2) against a polishing surface (12a) of the turn table (10). The holding and pressing part (20) transmits a force from an air bag (62) to the semiconductor wafer (2) via a pressurized fluid layer (L) to thereby press the semiconductor wafer (2) against the polishing surface (12a) via the pressurized fluid layer (L), so that the semiconductor wafer (2) can be polished. Thereby, it is possible to uniformly polish the semiconductor wafer (2).

65. 发明专利

GB9927459D0 Feeding polishing agents into a wafer-polishing apparatus 未知
公开(公告)号：GB9927459D0
公开(公告)日：2000-01-19
申请号：GB9927459
申请日：1999-11-19
申请人： TOKYO SEIMITSU CO LTD
IPC分类号： B24B7/24 , B24B37/00 , B24B57/00 , B24B57/02 , H01L21/304 , H01L21/321

66. 发明专利

DE69415839D1 未知
公开(公告)号：DE69415839D1
公开(公告)日：1999-02-25
申请号：DE69415839
申请日：1994-03-07
申请人： TOKYO SEIMITSU CO LTD
发明人： TSUCHISHIMA JIRO , CHIBA KIYOTAKA
IPC分类号： B23D61/10 , B24B45/00 , B24D5/16 , B26D7/26 , H01L21/301 , B27B5/32
摘要： A mounting structure for a cutting blade in a dicing apparatus in which a mounted blade is rotated in a well-balanced condition and further the blade can be easily attached to and detached from the apparatus. The mounting structure of the invention comprises a mount (3) including a first cylindrical engagement portion (31), and a first screw portion (33); a cutting blade (4) including a second engagement portion (43) engaging with a first engagement portion (31); and a screw member (5) including a second screw portion (51) being screwed into the first screw portion (33) so that the screw member (5) presses the cutting blade (4) against the flange surface (32) for fixation, the mount (3) further including a third cylindrical engagement portion (36), and the screw member (5) including a fourth engagement portion (52) engaging with the third engagement portion (36).

67. 发明专利

GB2316742B Precision indexing angle measuring method and system for machine tools 未知
公开(公告)号：GB2316742B
公开(公告)日：1998-07-29
申请号：GB9716889
申请日：1997-08-08
申请人： TOKYO SEIMITSU CO LTD
发明人： OHSAWA NOBUYUKI
IPC分类号： B23Q16/02 , B23Q16/12 , B23Q17/00 , G01B11/26 , G01B21/22 , G01D5/26 , G01D18/00 , G01B9/02
摘要： Disclosed is an angle indexing precision measuring method and system capable of continuously measuring the precision in indexing the angle of a rotary table of a machine tool over 360 DEG . One of a laser interference unit and dual corner cube unit which constitute a laser interferometer is fixed to a table, and the other one thereof is attached to a rotating mechanism which is fixed to a portion other than the table and whose axis of rotation is aligned with the axis of rotation of the table. Within a range of angles within which the relative angle reaches one limit of a range of set angles equal to or smaller than a range of measurable angles, a step of rotating the table by a unit angle and a step of measuring the relative angle are repeated. After the relative angle reaches one limit of the range of set angles, a step of rotating the rotating mechanism is carried out until the relative angle between the two parts reaches the other limit of the range of set angles. These steps are carried out over a whole range of angles.

68. 发明专利

DE19543867C2 未知
公开(公告)号：DE19543867C2
公开(公告)日：1998-07-02
申请号：DE19543867
申请日：1995-11-24
申请人： TOKYO SEIMITSU CO LTD
发明人： KATAYAMA ICHIRO
IPC分类号： B24B9/00 , B24B9/06 , B24B37/34 , B24B41/00 , B24B51/00 , H01L21/00 , B24B9/02 , B23Q7/00 , H01L21/304
摘要： Picking up means pick up a wafer from a first cassette one by one and carry the wafer to a pre-processing means. The wafer is picked up from the pre-processing means after the measuring and deciding the position has been completed in the pre-processing means. First carrying means receives the wafer from the picking up means and resets the position of the wafer. The first carrying means mounts the wafer on the wafer table of the first chamfering means in the case that the first chamfering part is not chamfering the wafer. The first carrying means carries the wafer and mounts it on the second wafer table of the second chamfering means in the case that the first chamfering part is chamfering the wafer.

69. 发明专利

DE69406154T2 未知
公开(公告)号：DE69406154T2
公开(公告)日：1998-04-23
申请号：DE69406154
申请日：1994-02-14
申请人： TOKYO SEIMITSU CO LTD
发明人： IKEDA HOTAKA , NAKAMURA MASAHARU
IPC分类号： G01S15/88 , G01B17/00 , H01L21/301

70. 发明专利

GB9802137D0 Cleasing apparatus and method 未知
公开(公告)号：GB9802137D0
公开(公告)日：1998-04-01
申请号：GB9802137
申请日：1998-01-30
申请人： TOKYO SEIMITSU CO LTD
IPC分类号： B08B17/02 , B08B3/08 , B08B3/10 , B08B3/12 , H01L21/00 , H01L21/304 , H01L21/306

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