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1. 发明专利

DE19960458B4 未知
公开(公告)号：DE19960458B4
公开(公告)日：2006-05-24
申请号：DE19960458
申请日：1999-12-15
申请人： TOKYO SEIMITSU CO LTD
发明人： NUMOTO MINORU
IPC分类号： B24B29/02 , B24B37/005 , B24B37/04 , B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing wafers wherein a retainer ring 40 is held by a carrier 32 of a wafer-holding head 20 by using an O-ring 31. Further, a protection sheet 80 for a wafer 2 is held by the retainer ring so as to cover the surface of an air-blow member 34 of the carrier. While the wafer is being held and polished, therefore, the back surface of the wafer does not come into direct contact with the carrier, and the protection sheet is interposed between the back surface of the wafer and the carrier.

2. 发明专利

MY120754A WAFER POLISHING APPARATUS 未知
公开(公告)号：MY120754A
公开(公告)日：2005-11-30
申请号：MYPI9803608
申请日：1998-08-07
申请人： TOKYO SEIMITSU CO LTD
发明人： NUMOTO MINORU , INABA TAKAO , TERASHITA HISASHI
IPC分类号： B24B1/00 , B24B37/30 , B24B49/16 , H01L21/302
摘要： THE FIRST AIR GUIDE GROOVE (92) IS FORMED AT THE BOTTOM OF A CARRIER (24) ALONG THE INNER CIRCUMFERENCE OF A CIRCLE WHOSE RADIUS CORRESPONDS TO THE MAXIMUM RADIUS OF A WAFER (50). THE AIR IS SUPPLIED TO THE OUTER PERIPHERY OF THE WAFER (50) THROUGH THE FIRST AIR GUIDE GROOVE (92) TO FORM A PRESSURE AIR LAYER (51) BETWEEN THE CARRIER (24) AND THE WAFER (50). THE FORMATION OF THE PRESSURE AIR LAYER (51) MAKES THE AIR PRESSURE APPLIED TO THE WAFER (50) UNIFORM ON THE ENTIRE SURFACE OF THE WAFER (50), AND THUS, THE WAFER (50) CAN BE POLISHED UNDER A UNIFORM PRESSURE FORCE. THE SECOND AIR GUIDE GROOVE (94) I S FORMED ALONG THE INNER CIRCUMFERENCE OF A CIRCLE WHOSE RADIUS CORRESPONDS TO THE MINIMUM RADIUS OF THE WAFER (50), AND THEREFORE, THE WAFER (50) WITH AN ORIENTATION FLAT OR NOTCH CAN BE POLISHED UNDER A UNIFORM PRESSURE FORCE.

3. 发明专利

GB2380960A Wafer polishing apparatus 未知
公开(公告)号：GB2380960A
公开(公告)日：2003-04-23
申请号：GB0222815
申请日：1999-10-15
申请人： TOKYO SEIMITSU CO LTD
发明人： INABA TAKAO , NUMOTO MINORU , SAKAI KENJI
IPC分类号： B24B37/013 , B24B37/30 , B24B49/04 , B24B49/10 , B24B49/14 , B24B37/04 , H01L21/304
摘要： Wafer polishing apparatus comprises a control unit operated to polish a wafer by a quantity corresponding to designated polishing quantity data in accordance with a polishing model. The model is corrected according to the difference between a measured value of the polishing quantity and the polishing quantity data. The apparatus also comprises a displacement measuring tool for detecting the change in relative vertical positions between the surface of the polishing cloth and the back of the wafer or the wafer holding head. The polishing model is made based on the output of the displacement measuring tool and the measured value for correcting the output of the displacement measuring tool.

4. 发明专利

GB2345873B Wafer polishing machine 未知
公开(公告)号：GB2345873B
公开(公告)日：2003-01-08
申请号：GB0006163
申请日：1999-10-15
申请人： TOKYO SEIMITSU CO LTD
发明人： INABA TAKAO , NUMOTO MINORU , SAKAI KENJI
IPC分类号： B24B37/04 , B24B41/00 , H01L21/00 , H01L21/304
摘要： A CMP machine of the invention includes first and second polishing bases 14 and 15, first and second wafer holding heads 31 and 32, a wafer loading unit 41, a wafer unloading unit 42, first and second head rotating mechanism rotating the first and second wafer holding heads so as to position then above the first and second polishing bases, wafer loading unit, or wafer unloading unit, a first transportation mechanism transporting an unpolished wafer to the wafer loading unit, and a second transportation mechanism, transporting a polished wafer from the wafer unloading unit. The first and second polishing bases are located mutually adjacently, the wafer loading unit and wafer unloading unit are located mutually adjacently, the first polishing base and wafer loading unit are located diagonally, the second polishing base and wafer unloading unit are located diagonally. Owing to this structure, transportation of a wafer to the wafer loading unit and transportation of a wafer from the wafer unloading unit are achieved by the different transportation mechanisms. This leads to a minimized adhesion of dust to an unpolished wafer.

5. 发明专利

DE10132368A1 未知
公开(公告)号：DE10132368A1
公开(公告)日：2002-01-17
申请号：DE10132368
申请日：2001-07-04
申请人： TOKYO SEIMITSU CO LTD
发明人： TOUZOV MIKHAIL , MICHIYA SATOMI , FUJITA TAKASHI , IZUMI HIROHIKO , NUMOTO MINORU
IPC分类号： B24B37/04 , B24B37/30 , B24B37/32 , B24B53/017 , H01L21/304
摘要： A step part is formed on a face of a retainer ring that contacts with a polishing pad so that a wavily deformed part of the polishing pad enters the step part. The step part is formed like a ring at the inside of the face which actually contacts with the polishing pad. Moreover, a height of the step part is smaller than a thickness of a wafer so that a top face of the step part does not contact with the polishing pad and the wafer does not enter the step part. Further, a width of the step part is set so that the wavily deformed part of the polishing pad can enter the step part.

6. 发明专利

DE19981622T1 未知
公开(公告)号：DE19981622T1
公开(公告)日：2000-10-12
申请号：DE19981622
申请日：1999-10-15
申请人： TOKYO SEIMITSU CO LTD
发明人： INABA TAKAO , NUMOTO MINORU , SAKAI KENJI
IPC分类号： B24B37/04 , B24B41/00 , H01L21/00 , H01L21/304 , H01L21/306
摘要： A CMP machine of the invention includes first and second polishing bases 14 and 15, first and second wafer holding heads 31 and 32, a wafer loading unit 41, a wafer unloading unit 42, first and second head rotating mechanism rotating the first and second wafer holding heads so as to position then above the first and second polishing bases, wafer loading unit, or wafer unloading unit, a first transportation mechanism transporting an unpolished wafer to the wafer loading unit, and a second transportation mechanism, transporting a polished wafer from the wafer unloading unit. The first and second polishing bases are located mutually adjacently, the wafer loading unit and wafer unloading unit are located mutually adjacently, the first polishing base and wafer loading unit are located diagonally, the second polishing base and wafer unloading unit are located diagonally. Owing to this structure, transportation of a wafer to the wafer loading unit and transportation of a wafer from the wafer unloading unit are achieved by the different transportation mechanisms. This leads to a minimized adhesion of dust to an unpolished wafer.

7. 发明专利

SG70632A1 Polishing apparatus 未知
公开(公告)号：SG70632A1
公开(公告)日：2000-02-22
申请号：SG1998000689
申请日：1998-04-03
申请人： TOKYO SEIMITSU CO LTD
发明人： NUMOTO MINORU , INABA TAKAO , SAKAI KENJI , TERASHITA HISASHI , SATOH MANABU
IPC分类号： B24B37/30 , B24B49/16 , B24B37/04
摘要： The polishing apparatus (100) comprises a turn table (10), which polishes a semiconductor wafer (2), and a holding and pressing part (20), which holds and presses the semiconductor wafer (2) against a polishing surface (12a) of the turn table (10). The holding and pressing part (20) transmits a force from an air bag (62) to the semiconductor wafer (2) via a pressurized fluid layer (L) to thereby press the semiconductor wafer (2) against the polishing surface (12a) via the pressurized fluid layer (L), so that the semiconductor wafer (2) can be polished. Thereby, it is possible to uniformly polish the semiconductor wafer (2).

8. 发明专利

MY123230A WAFER GRINDER AND METHOD OF DETECTING GRINDING AMOUNT 未知
公开(公告)号：MY123230A
公开(公告)日：2006-05-31
申请号：MYPI9904477
申请日：1999-10-15
申请人： TOKYO SEIMITSU CO LTD
发明人： NUMOTO MINORU , SAKAI KENJI , INABA TAKAO
IPC分类号： B24B1/00 , B24B37/30 , B24B49/04 , B24B49/10 , B24B49/14 , B24B49/16
摘要： A WAFER POLISHING APPARATUS CAPABLE OF CONTROLLING THE POLISHING QUANTITY ACCURATELY IS DISCLOSED. A WAFER POLISHING APPARATUS ACCORDING TO A FIRST ASPECT COMPRISES A ROTATABLE POLISHING STOOL WITH A POLISHING CLOTH ARRANGED ON THE SURFACE THEREOF, A CARRIER ROTATED ABOUT A ROTATIONAL SHAFT PARALLEL TO BUT DIFFERENT FROM THE ROTATIONAL SHAFT OF THE POLISHING STOOL FOR BRINGING A WAFER INTO CONTACT WITH THE POLISHING CLOTH UNDER A PREDETERMINED PRESSURE, A PAD ARRANGED AROUND THE WAFER IN SUCH A MANNER AS TO CONTACT THE POLISHING CLOTH UNDER A PREDETERMINED PRESSURE, A DETECTOR FOR DETECTING THE CHANGE OF THE RELATIVE POSITIONS OF THE BACK OF THE WAFER OR THE CARRIER AND THE PAD, AN OPERATING UNIT FOR COMPUTING THE POLISHING QUANTITY BY PROCESSING THE DETECTION SIGNAL OF THE DETECTOR, AND A CONTROL UNIT FOR CONTROLLING THE POLISHING OPERATION IN ACCORDANCE WITH THE COMPUTED POLISHING QUANTITY, WHEREIN THE OPERATING UNIT INCLUDES A SAMPLING UNIT FOR SAMPLING THE DETECTION SIGNAL OF THE DETECTOR WITH SUCH A SAMPLING PERIOD THAT THE NUMBER OF TIMES SAMPLED PER ROTATION OF THE POLISHING STOOL IS PLURAL, A MOVING AVERAGE CALCULATING UNIT FOR CALCULATING THE MOVING AVERAGE DATA BY AVERAGING THE SAMPLING DATA IN THE NUMBER EQUAL TO AN INTEGER MULTIPLE OF THE NUMBER OF TIMES SAMPLED PER ROTATION, AND APOLISHING QUANTITY COMPUTING UNIT FOR COMPUTING THE POLISHING QUANTITY FROM THE MOVING AVERAFE DATA. A WAFER POLISHING APPARATUS ACCORDING TO A SECOND ASPECT MEASURES THE PRACTICAL POLISHING QUANTITY OF A NORMAL WAFER TO BE POLISHED AND, BY COMPARING THE PRACTICAL MEASURED VALUE THEREOF WITH A PREDETERMINED POLISHING QUANTITY, CORRECTS A MODEL BY THE DIFFERENCE WHENEVER REQUIRED.

9. 发明专利

MY122374A WAFER POLISHING APPARATUS 未知
公开(公告)号：MY122374A
公开(公告)日：2006-04-29
申请号：MYPI9904858
申请日：1999-11-09
申请人： TOKYO SEIMITSU CO LTD
发明人： NUMOTO MINORU
IPC分类号： B24B49/00 , B24B5/00 , B24B29/00 , B24B37/013 , B24B37/30 , B24B49/10 , B24B49/16 , B24B51/00 , H01L21/321
摘要： THE PRESENT INVENTION IS A WAFER POLISHING APPARATUS (10) WITH A DEVICE THAT DETECTS THE POLISHING END ACCORDING TO A CHANGE IN ROTATION RESISTANCE OF A WAFER DURING POLISHING. THE WAFER POLISHING APPARATUS (10) COMPRISES A HEAD BODY (22) AND A CARRIER (24) WHICH ARE CONNECTED WITH EACH OTHER BY A CONNECTING BAR (80) WHICH IS PROVIDED WITH A STRAIN GAGE (96), AND DETERMINES STRAIN IN A HORIZONTAL DIRECTION OF THE CONNECTING BAR (80) BY THE STRAIN GAGE (96) SO AS TO DETERMINE A ROTATION TORQUE OF THE CARRIER (24), WHEREBY ACCURATELY DETECTS THE POLISHING END. SINCE A RETAINER RING (28) IS MOUNTED TO THE OUTER PERIPHERY OF THE CARRIER (24) VIA AN 0 RING (74), THE IMPACT AT CONTACTING OF THE WAFER WITH THE RETAINER RING (28) CAN BE ABSORBED BY THE 0 RING (74), THUS THE WAFER IS PREVENTED FROM DAMAGE. BECAUSE THE RETAINER RING (28) IS MOUNTED TO THE CARRIER (24) WITHOUT A GAP, THE OUTER PERIPHERY OF THE WAFER IS ENCLOSED BY THE RETAINER RING (28), AND THE WAFER CAN BE POLISHED IN A STATE WHERE ITS CENTER IS HELD ON THE CENTRAL AXIS OF THE CARRIER (24). THEREFORE, THE POLISHING PRECISION OF THE WAFER CAN BE IMPROVED.

10. 发明专利

GB2380960B Wafer polishing apparatus 未知
公开(公告)号：GB2380960B
公开(公告)日：2003-06-04
申请号：GB0222815
申请日：1999-10-15
申请人： TOKYO SEIMITSU CO LTD
发明人： INABA TAKAO , NUMOTO MINORU , SAKAI KENJI
IPC分类号： B24B37/013 , B24B37/30 , B24B49/04 , B24B49/10 , B24B49/14 , B24B37/04 , H01L21/304

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