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    • 61. 发明公开
    • CVD 챔버의 세정 장치 및 방법
    • 清洗化学气相沉积室的装置及其清洗方法
    • KR1020070119169A
    • 2007-12-20
    • KR1020060053424
    • 2006-06-14
    • 주식회사 원익홀딩스
    • 배근학김경수김호식한동훈채승기이상곤김종산김호왕남태영하상선이내응김덕진윤영배
    • H01L21/205
    • H01L21/67028C23C16/4405
    • An apparatus for cleaning a CVD(Chemical Vaporization Deposition) chamber and a method of cleaning the same are provided to enhance efficiency in a cleaning process by supplying directly excited oxygen and nitrogen components into the inside of the CVD chamber. An apparatus for cleaning a CVD chamber includes a first cleaning gas supply line(10) and a second cleaning gas supply line(20). A first cleaning gas having gas including a fluoric component is ionized by a remote plasma source. The first cleaning gas of an ionized state is supplied through the first cleaning gas supply line. A second cleaning gas including a nitrogen oxide-based gas which is nitrogen oxide is supplied through the second cleaning gas supply line. The first cleaning gas of the ionized state is transferred through the remote plasma source to the inside of the CVD chamber. The second cleaning gas is supplied directly to the inside of the CVD chamber.
    • 提供一种用于清洁CVD(化学气相沉积)室的设备及其清洁方法,以通过将直接激发的氧和氮组分供应到CVD室的内部来提高清洗过程中的效率。 一种用于清洁CVD室的设备包括第一清洁气体供应管线(10)和第二清洁气体供应管线(20)。 具有包含氟组分的气体的第一清洁气体被远程等离子体源离子化。 通过第一清洗气体供给管线供给离子化状态的第一清洗气体。 通过第二清洗气体供给管路供给包含氮氧化物的氮氧化物系气体的第二清洗气体。 离子化状态的第一清洗气体通过远程等离子体源传送到CVD室的内部。 第二清洁气体直接供应到CVD室的内部。
    • 62. 发明授权
    • 반도체 소자의 커패시터 형성 방법
    • 制造半导体器件电容器的方法
    • KR100765129B1
    • 2007-10-12
    • KR1020060064711
    • 2006-07-11
    • 주식회사 원익홀딩스
    • 김정우고성근배근학김호식
    • H01L27/108
    • H01L28/91H01L28/84
    • A method for forming a capacitor of a semiconductor device is provided to decrease the damage of a lower layer and to enlarge an effective area of the capacitor by using an O2-TEOS(Tetra-Ethyl-Ortho-Silicate) USG(Undoped Silicate Glass) deposition under a lower temperature condition and a CMP(Chemical Mechanical Polishing) process. A first polysilicon layer and an HSG(Hemi-Spherical Grain) layer are sequentially deposited on a predetermined pattern in order to form a first electrode of a capacitor(S110,S120). An O2-TEOS USG layer is deposited on the resultant structure(S130). A PEOX(Plasma Enhanced OXide) layer is exposed to the outside by polishing the first electrode using a CMP process(S140). At this time, the O2-TEOS USG layer is used as a buffer layer. The PEOX layer and the O2-TEOS USG layer are removed from the resultant structure by using an oxide wet etch process(S150). An AlO layer and a TiN layer are deposited on the PEOX removed portion(S160). A second electrode of the capacitor is formed by depositing a second polysilicon layer on the resultant structure(S170).
    • 提供一种用于形成半导体器件的电容器的方法,以通过使用O 2 -TEOS(四乙基 - 正硅酸盐)USG(未掺杂的硅酸盐玻璃)来降低下层的损伤并扩大电容器的有效面积, 在较低温度条件下沉积和CMP(化学机械抛光)工艺。 顺序地在预定图案上沉积第一多晶硅层和HSG(半球形晶粒)层,以便形成电容器的第一电极(S110,S120)。 在所得结构上沉积O2-TEOS USG层(S130)。 通过使用CMP工艺研磨第一电极,将PEOX(等离子体增强氧化物)层暴露于外部(S140)。 此时,O2-TEOS USG层用作缓冲层。 通过使用氧化物湿蚀刻工艺从所得结构中除去PEOX层和O 2 -TEOS USG层(S150)。 在PEOX去除部分上沉积AlO层和TiN层(S160)。 电容器的第二电极通过在所得结构上沉积第二多晶硅层而形成(S170)。
    • 63. 发明授权
    • CVD 챔버의 세정 장치 및 방법
    • 清洗化学气相沉积室的装置及其清洗方法
    • KR100765128B1
    • 2007-10-11
    • KR1020060048921
    • 2006-05-30
    • 주식회사 원익홀딩스
    • 배근학김경수김호식한동훈채승기이상곤김종산김호왕남태영하상선이내응김덕진윤영배
    • H01L21/304H01L21/205
    • A cleaning apparatus and method of a CVD(Chemical Vapor Deposition) chamber are provided to improve cleaning efficiency of the CVD chamber by agitating oxygen or nitrogen elements of a solid layer using a predetermined radical containing a fluorine element and supplying directly the agitated oxygen or nitrogen elements into the CVD chamber. A cleaning apparatus of a CVD chamber includes a first cleaning gas supply line and a second cleaning gas supply line. The first cleaning gas supply line(10) is used for receiving an ionized gas, wherein the ionized gas is obtained from a first cleaning gas containing a fluorine element by using an RPS(Remote Plasma Source). The second cleaning gas supply line(20) is used for receiving a second cleaning gas containing an NxOy gas. The second cleaning gas is directly supplied into a CVD chamber.
    • 提供了一种清洁装置和CVD(化学气相沉积)室的方法,以通过使用含氟元素的预定基团搅拌固体层的氧或氮元素并直接供应搅拌的氧气或氮气来提高CVD室的清洁效率 元素进入CVD室。 CVD室的清洁装置包括第一清洁气体供应管线和第二清洁气体供应管线。 第一清洁气体供给管线(10)用于接收离子化气体,其中通过使用RPS(远程等离子体源)从含有氟元素的第一清洁气体获得电离气体。 第二清洁气体供给管线(20)用于接收含有N x Oy气体的第二清洗气体。 将第二清洁气体直接供应到CVD室中。
    • 64. 发明授权
    • 알에프 파워가 인가되는 가스 분리형 샤워헤드를 이용한플라즈마 원자층 증착장치 및 방법
    • 알에파워가인가되는가스분리형샤워헤드를이용한플라즈마원자층장장치및방알
    • KR100744528B1
    • 2007-08-01
    • KR1020060034183
    • 2006-04-14
    • 주식회사 원익홀딩스
    • 배근학김경수김호식
    • H01L21/205
    • A plasma atomic layer deposition apparatus using a shower head of a gas separative type and a method thereof are provided to minimize loss of plasma by directly applying an RF power to the shower head. A gas supply unit(100) has first and second precursor supply sources(110,120), a purge gas supply source(130), an inert gas supply source(140), and plural valves for adjusting flow rate of each gas. A shower head(200) has first and second precursor supply pipes, and mixture spraying holes for spraying first and second precursors, a purge gas and an inert gas into a reaction chamber(1). A power applying unit is positioned at an outside of the shower head. An exhaust unit(400) has an exhaust pump.
    • 提供一种使用气体分离型喷头的等离子体原子层沉积装置及其方法,以通过直接向喷头施加RF功率来最小化等离子体的损失。 气体供给单元(100)具有第一和第二前体供给源(110,120),净化气体供给源(130),惰性气体供给源(140)以及用于调整各气体的流量的多个阀。 喷头(200)具有第一和第二前体供应管,以及用于将第一和第二前体,净化气体和惰性气体喷射到反应室(1)中的混合物喷射孔。 电力施加单元位于淋浴头的外部。 排气单元(400)具有排气泵。
    • 65. 发明公开
    • 대기압 화학기상증착 장치를 이용하여 나노 갭을 채우는이산화규소 절연막 증착 방법
    • 使用APCVD装置沉积NIOO GAP2绝缘膜的方法
    • KR1020070067913A
    • 2007-06-29
    • KR1020050129436
    • 2005-12-26
    • 주식회사 원익홀딩스
    • 김호식장요철배근학주광술김종호고동선
    • H01L21/762H01L21/316B82Y40/00
    • A method for depositing a silicon dioxide insulation layer for filling a nano gap using an APCVD apparatus is provided to form a silicon dioxide insulation layer having excellent step coverage and low dependency upon an underlying layer by uniformly filling a nano gap in an STI region of a semiconductor device such that the nano gap has a size not greater than 100 nm and a high aspect ration not lower than 6:1. A wafer is preheated to be placed on an elevator susceptor by vacuum. An SiO2 layer is formed as an underlying layer in a gap in an STI region between shallow transistors of the wafer. Process gas including nitrogen gas heated to a predetermined temperature, TEOS gas mixed with the nitrogen gas and ozone gas mixed with oxygen gas is distributed from n(n>=1) distribution heads among N(N>=2) distribution heads to fill a gap of the STI region at a predetermined speed and at a process pressure of 600~800 torr(S420). The process gas is distributed from the residual m(m>=1,m=N-n) heads among the N distribution heads to deposit an SiO2 insulation layer in the STI region at a more rapid speed than that of the SiO2 insulation layer and at a process pressure of 600~800 torr(S430).
    • 提供了一种使用APCVD装置沉积用于填充纳米间隙的二氧化硅绝缘层的方法,以通过均匀填充纳米间隙中的纳米间隙来形成二氧化硅绝缘层,其具有优异的阶梯覆盖和对下层的依赖性低 半导体器件,使得纳米间隙具有不大于100nm的尺寸和不高于6:1的高纵横比。 预热晶片以通过真空放置在电梯座上。 在晶片的浅晶体管之间的STI区域的间隙中形成SiO 2层作为下层。 包括加热至预定温度的氮气的工艺气体,与氮气混合的TEOS气体和与氧气混合的臭氧气体从N(N> = 1)个分配头分配在N(N> = 2)个分配头中,以填充 STI区域以预定速度和处理压力为600〜800托(S420)的间隙。 处理气体从N个分配头中的残留m(m> = 1,m = Nn)头分布,以比SiO 2绝缘层更快的速度在STI区域中沉积SiO 2绝缘层, 工艺压力600〜800乇(S430)。
    • 66. 发明授权
    • 절연막 형성 방법
    • 形成绝缘膜的方法
    • KR100712729B1
    • 2007-05-04
    • KR1020070013944
    • 2007-02-09
    • 주식회사 원익홀딩스
    • 이도형윤진주김호식주광술우정식
    • H01L21/205H01L21/31
    • 증착 속도 향상이 가능한 절연막 형성 방법에 관하여 개시한다.
      본 발명에 따른 절연막 형성 방법은 가스 플라즈마 분위기 형성 단계, 절연막 증착 단계 및 퍼지 단계를 구비하고, 상기 절연막 증착 단계 진행 중에 분위기 형성용 가스 플라즈마를 챔버 내부로 다시 유입하는 것으로 이루어진다. 상기 가스 플라즈마 분위기 형성 단계에서는 주반응가스들과는 반응하지 않는 분위기 형성용 가스 플라즈마를 챔버 내부로 유입하여, 상기 챔버 내부를 미리 가스 플라즈마 분위기로 형성한다. 상기 절연막 증착 단계에서는 상기 가스 플라즈마 분위기에서 주반응가스들을 상기 챔버 내부로 유입하여 절연막을 증착한다. 상기 퍼지 단계에서는 퍼지를 실시하여 상기 챔버 내부에 잔류하는 가스를 제거한다.
      BPSG, Gap Fill, 플라즈마, 절연막
    • 将描述能够提高沉积速率的形成绝缘膜的方法。
    • 70. 发明公开
    • 질소 정제 방법 및 정제 장치
    • 硝化物及其设备的净化方法
    • KR1020020013059A
    • 2002-02-20
    • KR1020000046417
    • 2000-08-10
    • 주식회사 원익홀딩스이택홍
    • 이택홍
    • C01B21/04
    • B01J23/44B01D53/02C01B21/0494C01B2210/0006C01B2210/0023Y02C20/20Y02P20/152
    • PURPOSE: A purifying method of nitrogen is provided, which produce a getter alloy that has an excellent purifying capacity of nitrogen, so that can remove carbon monoxide, carbon dioxide and methane gas completely from nitrogen stream. CONSTITUTION: The purifying method of nitrogen comprises the following steps: (i) react getter alloy having as a main component Zr-V-Fe, Zr-Fe, Zr at 200-450 deg.C with ambient air blocked or at high vacuum with nitrogen; (ii) fill the reaction product to the bottom of rectifying column, in case of two column to the bottom column; (iii) fill Pd/Al2O3 catalyst at the top column, in case of two column to top column; (iv) by adding small amount of oxygen, oxidize methane composition in nitrogen stream, that is to purify, at 200-450 deg.C; and (v) remove from the getter impurities such as water, carbon dioxide, carbon monoxide and oxygen.
    • 目的:提供一种氮气净化方法,其产生具有优异氮气净化能力的吸气剂合金,从而可以从氮气流中完全除去一氧化碳,二氧化碳和甲烷气体。 构成:氮气的净化方法包括以下步骤:(i)以200-450℃的主要成分Zr-V-Fe,Zr-Fe,Zr与环境空气封闭或高真空反应吸气剂合金, 氮; (ii)将反应产物填充到精馏塔的底部,以便在两塔至底塔的情况下; (iii)在两个塔顶塔的情况下在顶塔填充Pd / Al2O3催化剂; (iv)通过加入少量氧气,在200-450℃氧化氮气流中的甲烷组成,即净化; 和(v)从吸气剂中除去水,二氧化碳,一氧化碳和氧气等杂质。