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51. 发明授权

US10840536B2 Stretchable electronic systems with containment chambers 有权
公开(公告)号：US10840536B2
公开(公告)日：2020-11-17
申请号：US14766301
申请日：2014-02-05
申请人： THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS , NORTHWESTERN UNIVERSITY
发明人： John A. Rogers , Sheng Xu , Jonathan A. Fan , Yonggang Huang , Yihui Zhang , Lin Jia
IPC分类号： H05K1/00 , H01M10/02 , H01M2/02 , H01M2/20 , H01M10/0525 , H01L23/18 , H01L23/22 , H01L21/54 , H01M8/02 , H01G11/78 , H05K1/18 , H05K1/02 , H01G11/26
CPC分类号： H01M10/02 , H01G11/78 , H01L21/54 , H01L23/18 , H01L23/22 , H01M2/0202 , H01M2/0237 , H01M2/204 , H01M2/206 , H01M8/02 , H01M10/0525 , H05K1/0283 , H05K1/189 , H01G11/26 , H01L2224/16225 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H05K2201/0133 , H05K2201/09263 , H05K2201/10037 , Y10T29/49126 , H01L2924/12041 , H01L2924/00 , H01L2924/12032 , H01L2924/00 , H01L2924/12042 , H01L2924/00 , H01L2924/12043 , H01L2924/00
摘要： The present invention provides electronic systems, including device arrays, comprising functional device(s) and/or device component(s) at least partially enclosed via one or more containment chambers, such that the device(s) and/or device component(s) are at least partially, and optionally entirely, immersed in a containment fluid. Useful containment fluids for use in containment chambers of electronic devices of the invention include lubricants, electrolytes and/or electronically resistive fluids. In some embodiments, for example, electronic systems of the invention comprise one or more electronic devices and/or device components provided in free-standing and/or tethered configurations that decouple forces originating upon deformation, stretching or compression of a supporting substrate from the free standing or tethered device or device component.

52. 发明授权

US09099484B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US09099484B2
公开(公告)日：2015-08-04
申请号：US14634427
申请日：2015-02-27
申请人： Renesas Electronics Corporation
发明人： Hiroshi Fujii , Shigeki Tanaka , Kazuaki Yoshida
IPC分类号： H01L21/00 , H01L21/56 , H01L23/22 , H01L23/29 , H01L23/495
CPC分类号： H01L21/565 , H01L21/561 , H01L21/568 , H01L23/22 , H01L23/293 , H01L23/3107 , H01L23/495 , H01L23/49541 , H01L23/49548 , H01L23/49565 , H01L23/49582 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/2732 , H01L2224/27436 , H01L2224/29083 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48245 , H01L2224/48247 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/49173 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83862 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/92247 , H01L2224/97 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/0665 , H01L2924/013 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A method of manufacturing a semiconductor device, includes providing a lead frame including a frame portion, including a through hole penetrating the lead frame, a device forming portion surrounded by the frame portion in plan view, including a die pad, and a semiconductor chip mounted on the die pad; after the providing step, sealing the semiconductor chip with sealing resin by supplying the sealing resin to the device forming portion via a first region of the frame portion in which the through hole is formed in plan view, thereby forming a sealing body sealing the device forming portion and the first region of the frame portion; and after the sealing step, removing a first part of the sealing body located at the first region of the frame portion from the lead frame by inserting a pin into the through hole.
摘要翻译：一种制造半导体器件的方法，包括提供一种引线框架，该引线框架包括框架部分，该框架部分包括穿过引线框架的通孔，平面图中被框架部分包围的器件形成部分，包括管芯焊盘，以及安装在半导体芯片上的半导体芯片在芯片上在提供步骤之后，通过在平面图中形成通孔的框架部分的第一区域向装置形成部分提供密封树脂来密封半导体芯片，由此形成密封装置，密封装置形成部分和框架部分的第一区域; 并且在所述密封步骤之后，通过将销插入到所述通孔中，将位于所述框架部分的所述第一区域处的所述密封体的第一部分从所述引线框架移除。

53. 发明申请

US20150179480A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20150179480A1
公开(公告)日：2015-06-25
申请号：US14634427
申请日：2015-02-27
申请人： Renesas Electronics Corporation
发明人： Hiroshi Fujii , Shigeki Tanaka , Kazuaki Yoshida
IPC分类号： H01L21/56 , H01L23/29 , H01L23/495 , H01L23/22
CPC分类号： H01L21/565 , H01L21/561 , H01L21/568 , H01L23/22 , H01L23/293 , H01L23/3107 , H01L23/495 , H01L23/49541 , H01L23/49548 , H01L23/49565 , H01L23/49582 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/2732 , H01L2224/27436 , H01L2224/29083 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48245 , H01L2224/48247 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/49173 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83862 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/92247 , H01L2224/97 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/0665 , H01L2924/013 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A method of manufacturing a semiconductor device, includes providing a lead frame including a frame portion, including a through hole penetrating the lead frame, a device forming portion surrounded by the frame portion in plan view, including a die pad, and a semiconductor chip mounted on the die pad; after the providing step, sealing the semiconductor chip with sealing resin by supplying the sealing resin to the device forming portion via a first region of the frame portion in which the through hole is formed in plan view, thereby forming a sealing body sealing the device forming portion and the first region of the frame portion; and after the sealing step, removing a first part of the sealing body located at the first region of the frame portion from the lead frame by inserting a pin into the through hole.
摘要翻译：一种制造半导体器件的方法，包括提供一种引线框架，该引线框架包括框架部分，该框架部分包括穿过引线框架的通孔，平面图中被框架部分包围的器件形成部分，包括管芯焊盘，以及安装在半导体芯片上的半导体芯片在芯片上在提供步骤之后，通过在平面图中形成通孔的框架部分的第一区域向装置形成部分提供密封树脂来密封半导体芯片，由此形成密封装置，密封装置形成部分和框架部分的第一区域; 并且在所述密封步骤之后，通过将销插入到所述通孔中，将位于所述框架部分的所述第一区域处的所述密封体的第一部分从所述引线框架移除。

54. 发明授权

US08999761B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08999761B2
公开(公告)日：2015-04-07
申请号：US14282895
申请日：2014-05-20
申请人： Renesas Electronics Corporation
发明人： Hiroshi Fujii , Shigeki Tanaka , Kazuaki Yoshida
IPC分类号： H01L21/00 , H01L23/00 , H01L23/495
CPC分类号： H01L21/565 , H01L21/561 , H01L21/568 , H01L23/22 , H01L23/293 , H01L23/3107 , H01L23/495 , H01L23/49541 , H01L23/49548 , H01L23/49565 , H01L23/49582 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/04042 , H01L2224/05554 , H01L2224/05624 , H01L2224/2732 , H01L2224/27436 , H01L2224/29083 , H01L2224/2919 , H01L2224/32245 , H01L2224/45144 , H01L2224/48245 , H01L2224/48247 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/49173 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83862 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/92247 , H01L2224/97 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/0665 , H01L2924/013 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： To stably remove a resin body formed in a supply route of a resin in a sealing step. A leadframe has, in a sub-runner portion thereof, a sub-through-hole. The sub-through-hole has, along a first direction along which the sub-runner portion extends, a first portion located on the side of a main-runner portion and a second portion located on the side of a gate portion relative to the first portion. In a plan view, an opening width of the sub-through-hole in the first direction is greater than that of the sub-through-hole in a second direction perpendicular to the first direction. In a plan view, an opening width of the sub-through-hole in the second direction gradually decreases from the first portion to an end portion of the second portion on the side of the gate portion.
摘要翻译：在密封步骤中稳定地除去在树脂的供给路径中形成的树脂体。引线框在其子流道部分中具有副通孔。子通孔沿着副流道部分延伸的第一方向具有位于主流道部分侧的第一部分和位于相对于第一部分的第一部分的浇口部分侧的第二部分一部分。在平面图中，副通孔在第一方向上的开口宽度大于垂直于第一方向的第二方向上的副通孔的开口宽度。在平面图中，副通孔在第二方向上的开口宽度从栅极部分侧的第二部分的第一部分到端部逐渐减小。

55. 发明授权

US08698262B2 Wireless chip and manufacturing method of the same 失效
标题翻译：无线芯片和制造方法相同
公开(公告)号：US08698262B2
公开(公告)日：2014-04-15
申请号：US11213997
申请日：2005-08-30
申请人： Takuya Tsurume , Koji Dairiki , Naoto Kusumoto
发明人： Takuya Tsurume , Koji Dairiki , Naoto Kusumoto
IPC分类号： H01L21/14
CPC分类号： H01L21/6835 , H01L23/20 , H01L23/22 , H01L23/58 , H01L24/83 , H01L2221/6834 , H01L2221/68363 , H01L2221/68368 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H01L2924/00011 , H01L2924/01019 , H01L2924/01079 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H01L2224/29075 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides a new type wireless chip that can be used without being fixed on a product. Specifically, a wireless chip can have a new function by a sealing step. One feature of a wireless chip according to the present invention is to have a structure in which an integrated circuit is sealed by films. In particular, the films sealing the integrated circuit have a hollow structure; therefore the wireless chip can have a new function.
摘要翻译：本发明提供了一种新型无线芯片，可以在不固定在产品上的情况下使用。具体地说，无线芯片可以通过密封步骤具有新的功能。根据本发明的无线芯片的一个特征是具有其中集成电路被膜密封的结构。特别地，密封集成电路的膜具有中空结构; 因此无线芯片可以具有新功能。

56. 发明申请

US20100084162A1 ELECTRONIC PACKAGE DEVICE 审中-公开
标题翻译：电子封装器件
公开(公告)号：US20100084162A1
公开(公告)日：2010-04-08
申请号：US12570862
申请日：2009-09-30
申请人： Chung-Jyh LIN
发明人： Chung-Jyh LIN
IPC分类号： H01B3/00
CPC分类号： H01L23/22 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/1433 , H05K5/068 , H01L2924/00
摘要： An electronic package device has an accommodation space being substantially sealed. The electronic package device includes a fluid, an electronic element and a space buffer mechanism. The fluid is located in the accommodation space. The electronic element is also disposed in the accommodation space, and at least a part thereof contacts with the fluid. The space buffer mechanism at least partially contacts with the fluid and provides the displacement or deformation to buffer the volume variation of the fluid.
摘要翻译：电子封装装置具有基本密封的容纳空间。电子封装装置包括流体，电子元件和空间缓冲机构。流体位于容纳空间中。电子元件也设置在容纳空间中，并且其至少一部分与流体接触。空间缓冲机构至少部分地与流体接触并提供位移或变形以缓冲流体的体积变化。

57. 发明申请

US20100078829A1 STACKED DEVICE CONDUCTIVE PATH CONNECTIVITY 有权
标题翻译：堆叠式设备导电路径连接
公开(公告)号：US20100078829A1
公开(公告)日：2010-04-01
申请号：US12242325
申请日：2008-09-30
申请人： Ebrahim H. Hargan
发明人： Ebrahim H. Hargan
IPC分类号： H01L23/52 , H01L21/00
CPC分类号： H01L25/0657 , G11C5/02 , G11C29/02 , G11C29/025 , H01L23/20 , H01L23/22 , H01L23/481 , H01L25/18 , H01L2224/0554 , H01L2224/05573 , H01L2224/13025 , H01L2224/16145 , H01L2225/06513 , H01L2225/06541 , H01L2225/06596 , H01L2924/00014 , H01L2924/1433 , Y10T29/49004 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155 , Y10T29/49162 , Y10T29/49169 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Various embodiments include apparatus and methods having circuitry to test continuity of conductive paths coupled to dice arranged in a stack.
摘要翻译：各种实施例包括具有电路的装置和方法，该电路用于测试与布置在堆叠中的管芯耦合的导电路径的连续性。

58. 发明授权

US07642644B2 Packaging for high power integrated circuits 有权
标题翻译：大功率集成电路封装
公开(公告)号：US07642644B2
公开(公告)日：2010-01-05
申请号：US11720383
申请日：2005-11-30
申请人： Wendy L. Wilkins , Barry K. Gilbert , Bruce R. Kline
发明人： Wendy L. Wilkins , Barry K. Gilbert , Bruce R. Kline
IPC分类号： H01L23/46 , H01L21/44
CPC分类号： H01L23/427 , H01L23/22 , H01L23/3677 , H01L24/48 , H01L2224/16225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H01L2924/12041 , H01L2924/1305 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2224/0401 , H01L2224/45015 , H01L2924/207
摘要： A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a supercritical fluid that transports heat from the devices to a heat sink in thermal contact with the enclosure.
摘要翻译：用于半导体芯片或其他制热装置的封装具有器件安装和电连接到的支撑衬底。在发热装置上方形成一个外壳，并填充有超临界流体，该超临界流体将热量从装置传送到与外壳热接触的散热器。

59. 发明授权

US07554192B2 Semiconductor device having filler with thermal conductive particles 有权
标题翻译：具有带有导热颗粒的填料的半导体器件
公开(公告)号：US07554192B2
公开(公告)日：2009-06-30
申请号：US11553235
申请日：2006-10-26
申请人： Masuo Koga , Tetsuo Mizoshiri , Yukimasa Hayashida
发明人： Masuo Koga , Tetsuo Mizoshiri , Yukimasa Hayashida
IPC分类号： H01L23/34
CPC分类号： H01L23/22 , H01L23/053 , H01L23/24 , H01L23/3735 , H01L2224/32225
摘要： A semiconductor device that includes an insulating substrate having an upper conductor formed on an upper surface thereof and a lower conductor formed on a lower surface of the insulating substrate. The device also includes a semiconductor element mounted on the upper surface of the insulating substrate with an under-element solder therebetween. The device further includes a heat sink whereon the insulating substrate is mounted with an under-substrate solder therebetween. The device additionally includes a silicone gel covering the semiconductor element, the under-element solder, and the upper conductor. In addition, the device includes a filler covering the lower conductor and the under-substrate solder, without covering the semiconductor element, the under-element solder, and the upper conductor, and having a thermal conductivity larger than a thermal conductivity of air and a fluidity higher than a fluidity of the silicone gel.
摘要翻译：一种半导体器件，包括在其上表面上形成有上导体的绝缘基板和形成在所述绝缘基板的下表面上的下导体。该装置还包括半导体元件，其安装在绝缘基板的上表面上，其间具有下部元件焊料。该装置还包括散热器，绝缘基板上安装有底板下焊料。该装置还包括覆盖半导体元件，下部元件焊料和上导体的硅凝胶。此外，该器件包括覆盖下导体和底基底焊料的填充物，而不覆盖半导体元件，下元件焊料和上导体，并且具有大于空气的热导率的热导率和流动性高于硅胶的流动性。

60. 发明申请

US20080093732A1 Packaging For High Power Integrated Circuits Using Supercritical Fluid 有权
标题翻译：使用超临界流体的大功率集成电路封装
公开(公告)号：US20080093732A1
公开(公告)日：2008-04-24
申请号：US11720383
申请日：2005-11-30
申请人： Wendy Wilkins , Barry Gilbert , Bruce Kline
发明人： Wendy Wilkins , Barry Gilbert , Bruce Kline
IPC分类号： H01L23/46
CPC分类号： H01L23/427 , H01L23/22 , H01L23/3677 , H01L24/48 , H01L2224/16225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H01L2924/12041 , H01L2924/1305 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2224/0401 , H01L2224/45015 , H01L2924/207
摘要： A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a supercritical fluid that transports heat from the devices to a heat sink in thermal contact with the enclosure.
摘要翻译：用于半导体芯片或其他制热装置的封装具有器件安装和电连接到的支撑衬底。在发热装置上方形成一个外壳，并填充有超临界流体，该超临界流体将热量从装置传送到与外壳热接触的散热器。

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