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1. 发明申请

US20080093732A1 Packaging For High Power Integrated Circuits Using Supercritical Fluid 有权
标题翻译：使用超临界流体的大功率集成电路封装
公开(公告)号：US20080093732A1
公开(公告)日：2008-04-24
申请号：US11720383
申请日：2005-11-30
申请人： Wendy Wilkins , Barry Gilbert , Bruce Kline
发明人： Wendy Wilkins , Barry Gilbert , Bruce Kline
IPC分类号： H01L23/46
CPC分类号： H01L23/427 , H01L23/22 , H01L23/3677 , H01L24/48 , H01L2224/16225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H01L2924/12041 , H01L2924/1305 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2224/0401 , H01L2224/45015 , H01L2924/207
摘要： A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a supercritical fluid that transports heat from the devices to a heat sink in thermal contact with the enclosure.
摘要翻译：用于半导体芯片或其他制热装置的封装具有器件安装和电连接到的支撑衬底。在发热装置上方形成一个外壳，并填充有超临界流体，该超临界流体将热量从装置传送到与外壳热接触的散热器。

2. 发明申请

US20050115065A1 Die-first multi-chip modules and methods of manufacture 失效
标题翻译：首款多芯片模块及制造方法
公开(公告)号：US20050115065A1
公开(公告)日：2005-06-02
申请号：US10724981
申请日：2003-11-30
申请人： Wendy Wilkins
发明人： Wendy Wilkins
IPC分类号： C09J5/00 , H01L21/68 , H05K3/20 , C09J1/00
CPC分类号： H01L21/6835 , C09J5/00 , H01L2223/54473 , H01L2924/30105 , Y10T29/49128
摘要： Methods of making a multi component module (130) utilize a reusable carrier substrate (111) where the reusable carrier substrate (111) is light transmissive in a frequency range of an adhesive (112) that is ablated by light of a certain frequency such as light from an excimer laser (122). An electronic component (118), such as a chip, die, or passive or active component, is adhered to the reusable carrier substrate (111) with the adhesive (112). An interconnect structure (117) is fabricated on the electronic component (118) to form a multi component module (130). The excimer laser (122) illuminates the reusable carrier substrate (111) with light in the frequency range after fabricating the interconnect structure (117) to ablate the adhesive (112) to remove the multi component module (130) from the reusable carrier substrate (111).
摘要翻译：制造多组分模块（130）的方法利用可重复使用的载体衬底（111），其中可重复使用的载体衬底（111）在由特定频率的光消除的粘合剂（112）的频率范围内是透光的，来自准分子激光器（122）的光。使用粘合剂（112）将诸如芯片，管芯或无源或有源部件的电子部件（118）粘附到可重复使用的载体基板（111）上。在电子部件（118）上制造互连结构（117）以形成多部件模块（130）。准分子激光器（122）在制造互连结构（117）之后在频率范围内用光照射可重复使用的载体衬底（111）以消除粘合剂（112）以从可再使用的载体衬底（112）去除多组分模块（130） 111）。

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