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51. 发明授权

US11342550B2 Electrode body for lead-acid battery, lead-acid battery using the same, and method of manufacturing electrode body for lead-acid battery 有权
公开(公告)号：US11342550B2
公开(公告)日：2022-05-24
申请号：US16614137
申请日：2018-10-12
申请人： Hideaki Kato , TAKASAKI DENKA KOUGYOUSHO CO., LTD.
发明人： Hideaki Kato
IPC分类号： H01M4/20 , H01M4/46 , H01M4/68 , H01M10/06 , H01M4/02
摘要： The weight and size of a lead-acid battery is reduced and the energy density per mass by forming base members of components of the lead-acid battery is improved by using aluminum or aluminum alloy and forming multiple plating layers on a surface of each base member. In order to prevent formation of pinholes in the multiple plating layers, the surface of the base member 22 is subjected to flattening processing, a solder plating layer with a film thickness of 10 μm or more is formed, or many layers of group 4 metals with similar chemical properties are laminated. Moreover, in a positive electrode plate and a negative electrode plate, an active material layer 24 is formed on the outermost lead plating layer by an electrolytic formation treatment to improve the charging and discharging efficiencies of the lead-acid battery and to greatly reduce fall-off the active material layer 24.

52. 发明授权

US08685766B2 Solid element device and method for manufacturing the same 有权
标题翻译：固体元件装置及其制造方法
公开(公告)号：US08685766B2
公开(公告)日：2014-04-01
申请号：US13419093
申请日：2012-03-13
申请人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
发明人： Yoshinobu Suehiro , Mitsuhiro Inoue , Hideaki Kato , Kunihiro Hadame , Ryoichi Tohmon , Satoshi Wada , Koichi Ota , Kazuya Aida , Hiroki Watanabe , Yoshinori Yamamoto , Masaaki Ohtsuka , Naruhito Sawanobori
IPC分类号： H01L21/56
CPC分类号： H01L33/56 , C03B23/20 , C03C8/24 , C03C27/06 , H01L24/17 , H01L24/45 , H01L24/73 , H01L2224/14 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/92125 , H01L2224/97 , H01L2924/01057 , H01L2924/01322 , H01L2924/12035 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2924/3025 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method of making a solid element device that includes a solid element, an element mount part on which the solid element is mounted and which has a thermal conductivity of not less than 100 W/mK, an external terminal provided separately from the element mount part and electrically connected to the solid element, and a glass sealing part directly contacting and covering the solid element for sealing the solid element, includes pressing a glass material at a temperature higher than a yield point of the glass material for forming the glass sealing part.
摘要翻译：一种固体元件装置的制造方法，该固体元件装置包括固体元件，安装有固体元件的元件安装部件，其导热率不小于100W / mK，与元件安装部件分开设置的外部端子并且与固体元件电连接，并且直接接触和覆盖固体元件以密封固体元件的玻璃密封部件包括在玻璃材料的高于用于形成玻璃密封部分的玻璃材料的屈服点的温度下挤压玻璃材料。

53. 发明授权

US08525098B2 Solid-state image pickup device, method for manufacturing solid-state image pickup device, and camera 有权
标题翻译：固态图像拾取装置，固态图像拾取装置的制造方法和照相机
公开(公告)号：US08525098B2
公开(公告)日：2013-09-03
申请号：US13163129
申请日：2011-06-17
申请人： Yoshinori Toumiya , Keiji Tatani , Haruhiko Ajisawa , Yuji Inoue , Tetsuhiro Iwashita , Hideaki Kato
发明人： Yoshinori Toumiya , Keiji Tatani , Haruhiko Ajisawa , Yuji Inoue , Tetsuhiro Iwashita , Hideaki Kato
IPC分类号： H01J3/14 , H01L27/00
CPC分类号： H01L27/14687 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/14632 , H01L27/14643 , H01L27/14685 , H01L27/14689 , H01L27/148
摘要： A solid-state image pickup device including a plurality of pixels on a light-receiving surface, photodiodes disposed on the light-receiving surface of a semiconductor substrate while being partitioned on the pixel basis, signal transferring portions which are disposed on the semiconductor substrate and which read signal charges generated and stored in the photodiodes or voltages corresponding to the signal charges, insulating films disposed on the semiconductor substrate while covering the photodiodes, concave portions disposed in the insulating films, pad electrodes disposed on the insulating films, a passivation film which covers inner walls of the concave portions, which is disposed on the pad electrodes, and which has a refractive index higher than that of silicon oxide, and a core layer which is disposed on the passivation film while being filled in the concave portions and which has a refractive index higher than that of silicon oxide.
摘要翻译：一种固态图像拾取装置，包括在受光面上的多个像素，在半导体基板的受光面上配置的光电二极管，同时以像素为基准分割，设置在半导体基板上的信号传送部，其读取产生并存储在光电二极管中的信号电荷或对应于信号电荷的电压，设置在半导体衬底上的绝缘膜同时覆盖光电二极管，设置在绝缘膜中的凹部，设置在绝缘膜上的焊盘电极，钝化膜覆盖设置在焊盘电极上并且折射率高于氧化硅的折射率的凹部的内壁，以及设置在钝化膜上同时填充在凹部中的芯层，折射率高于氧化硅。

54. 发明授权

US08435366B2 Sheet peeling apparatus and sheet peeling method 有权
标题翻译：薄片剥离装置和薄片剥离方法
公开(公告)号：US08435366B2
公开(公告)日：2013-05-07
申请号：US12936850
申请日：2009-03-16
申请人： Hideaki Kato
发明人： Hideaki Kato
IPC分类号： B32B41/00
CPC分类号： B65H35/0013 , B65G2207/02 , B65H29/54 , B65H2301/44335 , H01L21/67132
摘要： A sheet peeling apparatus 10 includes: a sticking means 14 for sticking a peeling tape PT by pressing the peeling tape PT onto an adhesive sheet S; a moving means 15 for moving the peeling tape PT stuck to the adhesive sheet S and a holding means 11 for holding a wafer W relative to each other to peel the adhesive sheet S; a detecting means 17 for detecting the position of the outer periphery of the adhesive sheet S, and outputting a signal thereof; an input means 18 for inputting a correction value; a controlling means 19 for determining a pressing position of the peeling tape PT to the adhesive sheet S based on the output signal from the detecting means 17 and the correction value, and controlling the moving means 15 so as to stick the adhesive sheet S at the pressing position.
摘要翻译：片材剥离装置10包括：粘贴装置14，用于通过将剥离带PT压在粘合片S上来粘贴剥离带PT; 用于移动粘贴在粘合片S上的剥离带PT的移动装置15和用于保持晶片W相对于彼此剥离粘合片S的保持装置11; 检测装置17，用于检测粘合片S的外周的位置，并输出其信号; 用于输入校正值的输入装置18; 控制装置19，用于根据来自检测装置17的输出信号和修正值确定剥离带PT到粘合片S的按压位置，以及控制移动装置15以将粘合片S粘贴在按压位置。

55. 发明授权

US08328395B2 Light emitting apparatus, surface light source apparatus, display apparatus, and luminous flux control member 有权
标题翻译：发光装置，面光源装置，显示装置和光通量控制部件
公开(公告)号：US08328395B2
公开(公告)日：2012-12-11
申请号：US13165174
申请日：2011-06-21
申请人： Hideaki Kato , Yasuyuki Fukuda
发明人： Hideaki Kato , Yasuyuki Fukuda
IPC分类号： F21V5/04
CPC分类号： G02F1/133603 , G02B19/0014 , G02B19/0061 , G02F2001/133607
摘要： A light emitting apparatus emits light emitted from a light emitting element (200) mounted on a substrate (300) via a luminous flux control member (100). The luminous flux control member (100) has a bottom surface section (101) opposite to the substrate (300), an input surface section (106) for causing the light emitted from a light emitting element (200) to enter inside the input surface section (106), a light control output surface section (102) for refracting the light having entered from the input surface section (106) and outputting the light outside, and two or more leg sections (103) are formed to project outward from the bottom surface section (101) inside a circle with a circumference on which a position where the amount of light reflected by the light control output surface section (102) and yet reaching the bottom surface section (101) peaks is located, and attached to the substrate (300).
摘要翻译：发光装置经由光束控制构件（100）发射从安装在基板（300）上的发光元件（200）发射的光。光通量控制构件（100）具有与基板（300）相对的底面部（101），输入面部（106），其使从发光元件（200）射出的光进入输入面部分（106），用于折射从输入表面部分（106）输入的光并将光输出到外部的光控制输出表面部分（102），以及两个或更多个腿部部分（103）形成为从底面部分（101）在圆周内，圆周上由光控制输出表面部分（102）反射并且到达底表面部分（101）的光的量位于该圆周上，并且附接到基板（300）。

56. 发明申请

US20120155086A1 LED MODULE FOR LIGHTING 有权
标题翻译： LED模组照明
公开(公告)号：US20120155086A1
公开(公告)日：2012-06-21
申请号：US13330892
申请日：2011-12-20
申请人： Syota SHIMONISHI , Hiroyuki Tajima , Yosuke Tsuchiya , Hideaki Kato
发明人： Syota SHIMONISHI , Hiroyuki Tajima , Yosuke Tsuchiya , Hideaki Kato
IPC分类号： F21V21/00
CPC分类号： H05K1/026 , F21K9/00 , F21V25/10 , F21Y2105/10 , F21Y2115/10 , H05B33/0821 , H05K1/0269 , H05K2201/09381 , H05K2201/10106 , H05K2201/2054 , H05K2203/162 , Y02B20/341
摘要： An object of the present invention is to provide a LED module, capable of protecting LED chips from an excessive voltage, at low cost.An LED module for lighting includes a wiring substrate having a plurality of wiring patterns formed thereon, and a plurality of LED chips connected to the wiring patterns so as to constitute a series circuit or a series-parallel circuit. In the LED module, the wiring patterns comprises an anode side wiring pattern constituting an anode side electrode of the circuit, and a cathode side wiring pattern constituting a cathode side electrode of the circuit, the anode side wiring pattern and the cathode side wiring pattern are disposed to surround connection regions of the wiring patterns with the LED chips, and forms guard electrodes, and both edge portions of the anode side wiring pattern face both edge portions of the cathode side wiring pattern with gaps, respectively.
摘要翻译：本发明的目的是提供一种能够以低成本保护LED芯片免受过电压的LED模块。用于照明的LED模块包括其上形成有多个布线图案的布线基板和连接到布线图案的多个LED芯片，以构成串联电路或串联并联电路。在LED模块中，布线图案包括构成电路的阳极侧电极的阳极侧布线图案和构成电路的阴极侧电极的阴极侧布线图案，阳极侧布线图案和阴极侧布线图案设置成围绕LED芯片的布线图案的连接区域形成保护电极，并且阳极侧布线图案的两个边缘部分分别面对具有间隙的阴极侧布线图案的两个边缘部分。

57. 发明申请

US20110267512A1 SOLID-STATE IMAGE PICKUP DEVICE, METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE, AND CAMERA 审中-公开
标题翻译：固态图像拾取装置，制造固态图像拾取装置的方法和相机
公开(公告)号：US20110267512A1
公开(公告)日：2011-11-03
申请号：US13181626
申请日：2011-07-13
申请人： Yoshinori Toumiya , Keiji Tatani , Haruhiko Ajisawa , Yuji Inoue , Tetsuhiro Iwashita , Hideaki Kato
发明人： Yoshinori Toumiya , Keiji Tatani , Haruhiko Ajisawa , Yuji Inoue , Tetsuhiro Iwashita , Hideaki Kato
IPC分类号： H04N5/335 , H01L31/18 , H01L31/0232
CPC分类号： H01L27/14687 , H01L27/14625 , H01L27/14627 , H01L27/14629 , H01L27/14632 , H01L27/14643 , H01L27/14685 , H01L27/14689 , H01L27/148
摘要： A solid-state image pickup device includes a plurality of pixels on a light-receiving surface, photodiodes disposed on the light-receiving surface of a semiconductor substrate while being partitioned on the pixel basis, signal transferring portions which are disposed on the semiconductor substrate and which read signal charges generated and stored in the photodiodes or voltages corresponding to the signal charges, insulating films disposed on the semiconductor substrate while covering the photodiodes, concave portions disposed in the insulating films, pad electrodes disposed on the insulating films, a passivation film which covers inner walls of the concave portions, which is disposed on the pad electrodes, and which has a refractive index higher than that of silicon oxide, and a core layer which is disposed on the passivation film while being filled in the concave portions and which has a refractive index higher than that of silicon oxide.
摘要翻译：固态图像拾取装置包括：光接收表面上的多个像素，设置在半导体衬底的光接收表面上的光电二极管，同时基于像素分隔，设置在半导体衬底上的信号传输部分，其读取产生并存储在光电二极管中的信号电荷或对应于信号电荷的电压，设置在半导体衬底上的绝缘膜同时覆盖光电二极管，设置在绝缘膜中的凹部，设置在绝缘膜上的焊盘电极，钝化膜覆盖设置在焊盘电极上并且折射率高于氧化硅的折射率的凹部的内壁，以及设置在钝化膜上同时填充在凹部中的芯层，折射率高于氧化硅。

58. 发明申请

US20110267099A1 Semiconductor device generating complementary output signals 有权
标题翻译：产生互补输出信号的半导体器件
公开(公告)号：US20110267099A1
公开(公告)日：2011-11-03
申请号：US13064718
申请日：2011-04-11
申请人： Takenori Sato , Hideaki Kato
发明人： Takenori Sato , Hideaki Kato
IPC分类号： H03K19/003 , H03K19/20 , H03K19/0948 , H03K19/096
CPC分类号： H03K5/15 , G11C7/1048 , G11C11/4096
摘要： To include a first inverter that receives an input signal to output an inverted signal, a second inverter that receives the inverted signal to output a first internal signal, and a third inverter that receives the input signal and outputs a second internal signal by using the inverted signal as a power supply. According to the present invention, because a signal on one signal path is used as a power supply of an inverter included in the other signal path, phases of a pair of output signals based on the input signal can be exactly matched without adding a capacitor or a resistor for adjustment.
摘要翻译：为了包括接收输入信号以输出反相信号的第一反相器，接收反相信号以输出第一内部信号的第二反相器，以及接收输入信号并通过使用反相器输出第二内部信号的第三反相器信号作为电源。根据本发明，由于使用一个信号路径上的信号作为包含在另一个信号路径中的反相器的电源，所以可以在不添加电容器的情况下，基于输入信号的一对输出信号的相位精确匹配，调节电阻。

59. 发明授权

US07304326B2 Light emitting device and sealing material 有权
标题翻译：发光装置和密封材料
公开(公告)号：US07304326B2
公开(公告)日：2007-12-04
申请号：US11050432
申请日：2005-02-04
申请人： Yoshinobu Suehiro , Hideaki Kato , Seiji Takano
发明人： Yoshinobu Suehiro , Hideaki Kato , Seiji Takano
IPC分类号： H01L27/15 , H01L29/24
CPC分类号： H01L33/56 , H01L2224/32245 , H01L2224/45144 , H01L2224/48247 , H01L2224/73265 , H01L2924/181 , H01L2924/00 , H01L2924/00012
摘要： A light emitting device has: a light emitting element; a conducting portion to supply power to the light emitting element; an element housing portion that houses the light emitting element therein; and a sealing material that seals the light emitting element housed in the element housing portion. The sealing material contains a transparent resin material and a transparent filler with a thermal expansion coefficient smaller than the transparent resin material, and the transparent filler has a refractive index nearly equal to the transparent resin material.
摘要翻译：发光器件具有：发光元件; 用于向发光元件供电的导电部分; 容纳发光元件的元件容纳部分; 以及密封容纳在元件容纳部分中的发光元件的密封材料。密封材料含有透明树脂材料和热膨胀系数小于透明树脂材料的透明填料，透明填料的折射率几乎等于透明树脂材料。

60. 发明授权

US07161187B2 Light emitting diode and manufacturing method thereof 有权
标题翻译：发光二极管及其制造方法
公开(公告)号：US07161187B2
公开(公告)日：2007-01-09
申请号：US10972534
申请日：2004-10-26
申请人： Yoshinobu Suehiro , Hideaki Kato , Kunihiro Hadame
发明人： Yoshinobu Suehiro , Hideaki Kato , Kunihiro Hadame
IPC分类号： H01L29/22 , H01L29/227 , H01L33/00
CPC分类号： F21V29/83 , F21S43/14 , F21V11/12 , F21V13/10 , F21V29/74 , F21Y2115/10 , H01L33/54 , H01L33/60 , H01L33/647 , H01L2224/13 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014 , H01L2924/3025 , H01L2924/00 , H01L2224/0401
摘要： A light emitting diode has a substrate having a heat radiation conductive member therein, and a light emitting element mounted on the substrate. At least a part of the light emitting element is directly brought into contact and electrically connected with the heat radiation conductive member.
摘要翻译：发光二极管具有其中具有散热导电构件的基板和安装在基板上的发光元件。发光元件的至少一部分直接与放热导电部件接触并电连接。

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