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    • 54. 发明授权
    • Photo-curable resin composition and process for preparing resin-basedmold
    • 光固化树脂组合物和树脂基模制品的制备方法
    • US5932625A
    • 1999-08-03
    • US865676
    • 1997-05-30
    • Tsuyoshi WatanabeAyao MatsumuraYuichi HarutaTakashi Ukachi
    • Tsuyoshi WatanabeAyao MatsumuraYuichi HarutaTakashi Ukachi
    • C08F2/44C08F2/46C08F2/48C08F222/10C08F226/06B27N3/08
    • C08F226/06C08F2/44C08F2/48C08F222/1006
    • A photo-curable resin composition suitable as a material for photo-fabricating and capable of producing cured products with excellent mechanical strength and high heat resistance. Further disclosed is a process for molding a resin-based mold which provides superior molding dimensional precision and superb repetition durability. The resin composition contains a monomer component containing (A) 30-70 wt % of a polyfunctional unsaturated monomer having a cyclic structure and (B) 70-30 wt % of a monofunctional unsaturated monomer having a cyclic structure of which the homopolymer has a glass transition temperature (Tg) of 70.degree. C. or higher; (C) a photo-initiator; and (D) an inorganic filler having an average particle diameter or an average fiber length of 1-50 .mu.m, wherein the ratio of the inorganic filler to 100 parts by volume of the monomer components and the photo-initiator is 100-160 parts by volume, and the heat distortion temperature of the cured resin produced from the photo-curable resin composition is 100.degree. C. or higher.
    • 适合作为光致制造材料的光固化性树脂组合物,能够制造具有优异的机械强度和高耐热性的固化物。 进一步公开了一种树脂基模具的成型方法,其提供优异的成型尺寸精度和极好的重复耐久性。 树脂组合物含有含有(A)30-70重量%的具有环状结构的多官能不饱和单体的单体成分,(B)70-30重量%具有均聚物具有玻璃的环状结构的单官能不饱和单体 转变温度(Tg)为70℃以上; (C)光引发剂; 和(D)平均粒径或平均纤维长度为1-50μm的无机填料,其中无机填料与100体积份单体组分和光引发剂的比例为100-160份 ,由光固化性树脂组合物制造的固化树脂的热变形温度为100℃以上。
    • 55. 发明授权
    • Photo-curable resin composition and process for preparing resin-based
mold
    • 光固化树脂组合物和树脂基模具的制备方法
    • US5874041A
    • 1999-02-23
    • US865781
    • 1997-05-30
    • Ayao MatsumuraYuichi HarutaTsuyoshi WatanabeTakashi Ukachi
    • Ayao MatsumuraYuichi HarutaTsuyoshi WatanabeTakashi Ukachi
    • G03F7/004B29C33/40B29K33/04C08F2/44C08F2/48C08F20/34C08F20/36C08F220/10C08F222/10C09D4/00C09D4/02G03F7/027B29C35/08B29C41/02
    • C08F222/1006
    • A photo-curable resin composition suitable as a material for optical molding. The composition can produce cured products with excellent mechanical strength and high heat resistance. Further disclosed is a process for molding a resin-based mold which provides superior molding dimensional precision and superb repetition durability. The composition contains a monomer component which contains (A) 20-80 wt % of a urethane-bond polyfunctional (meth)acrylate having a number average molecular weight of 1,000 or less and (B) 80-20 wt % of an ethylenically unsaturated monomer containing a cyclic structure and at least one ethylenically unsaturated bond in the molecule and of which the homopolymer has a glass transition temperature of 50.degree. C. or higher; (C) a photopolymerization initiator; and (D) an inorganic filler having an average particle diameter or an average fiber length of 1-50 .mu.m, wherein the ratio of the inorganic filler for 100 parts by volume of said monomer components and the photopolymerization initiator is 100-160 parts by volume, and the heat distortion temperature of the cured resin produced from the photo-curable resin composition is 80.degree. C. or higher.
    • 适合作为光学成型用材料的光固化性树脂组合物。 该组合物可以产生具有优异的机械强度和高耐热性的固化产物。 进一步公开了一种树脂基模具的成型方法,其提供优异的成型尺寸精度和极好的重复耐久性。 该组合物含有(A)20〜80重量%的数均分子量为1000以下的氨基甲酸酯键多官能(甲基)丙烯酸酯,(B)80〜20重量%的烯属不饱和单体 在分子中含有环状结构和至少一个烯属不饱和键,其均聚物的玻璃化转变温度为50℃以上; (C)光聚合引发剂; 和(D)平均粒径或平均纤维长度为1-50μm的无机填料,其中100体积份的所述单体成分和光聚合引发剂的无机填料的比例为100〜160份 由光固化型树脂组合物制造的固化树脂的体积,热变形温度为80℃以上。