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    • 51. 发明授权
    • Method for bonding members, composite film and use thereof
    • 粘合部件,复合膜及其用途的方法
    • US08216684B2
    • 2012-07-10
    • US11883525
    • 2006-01-30
    • Yuichi ItoYugo YamamotoKimihiko Saito
    • Yuichi ItoYugo YamamotoKimihiko Saito
    • B32B27/00C09J163/00
    • C23C16/345B32B37/12B32B38/0008B32B2307/412B32B2310/14B32B2457/00Y10T156/1089Y10T428/31511Y10T428/31598Y10T428/31667
    • The bonding method of the present invention is a method of bonding a member (a) having a layer (a1) comprising an organic polymer (A), and a member (b) containing a compound (B) having specific functional groups, wherein the bonding method comprises bonding the member (a) and the member (b) via a layer comprising an inorganic compound (C) having a nitrogen atom and a hydrogen atom, which is at least partly provided on the outermost surface of the member (a).The composite film of the present invention is, firstly, a composite film formed with a laminate having a layer (a1) comprising an organic polymer (A) and a layer (c1) comprising an inorganic compound (C) having a nitrogen atom and a hydrogen atom; secondly, a composite film formed with a laminate having the layer (a1), the layer (c1) and a layer (b1) comprising an adhesive resin (B1) disposed in this order, wherein the layer (c1) and the layer (b1) are directly laminated; and thirdly, a composite film formed with a laminate having the layer (a1), the layer (c1), and a transparent conductive layer (d1) disposed in this order, wherein one outermost surface or both outermost surfaces of the composite film are partially formed with the layer (c1).
    • 本发明的接合方法是将具有包含有机聚合物(A)的层(a1)的成分(a)和含有具有特定官能团的化合物(B)的成分(b)的粘合方法,其中, 粘合方法包括通过包含具有氮原子和氢原子的无机化合物(C)的层至少部分地设置在构件(a)的最外表面上的部件(a)和构件(b) 。 本发明的复合膜首先是由具有包含有机聚合物(A)的层(a1)和包含具有氮原子的无机化合物(C)的层(c1)的层叠体形成的复合膜, 氢原子; 其次,由具有层(a1),层(c1)和层(b1)的层叠体形成的复合膜,所述层(c1)和层(b1)依次配置有粘合树脂(B1),其中,层(c1)和层(b1 )直接层压; 第三,由具有层(a1),层(c1)和透明导电层(d1)的层叠体形成的复合膜,其中复合膜的一个最外表面或两个最外表面部分地部分地 与层(c1)形成。
    • 58. 发明申请
    • Cationic polymerizable resin composition
    • 阳离子可聚合树脂组合物
    • US20070144400A1
    • 2007-06-28
    • US10584461
    • 2004-11-25
    • Yuichi ItoYasushi Mizuta
    • Yuichi ItoYasushi Mizuta
    • C09D11/00
    • C08G65/18Y10T428/31504
    • It has been discovered that an initiation reaction is efficiently progressed to a propagation reaction by adding a compound that potentially or directly generates a carbocation to the polymerization system of a cationic ring-opening polymerizable compound, and thus the activation of polymerization is rendered. Namely, the present invention relates to a cationic polymerizable resin composition which is characterized by comprising (A) a compound having at least one functional group capable of cationic ring-opening polymerization in one molecular chain, (B) a cationic polymerization initiator, and (C) a compound to generate a carbocation by the action of active species generated from (B) the cationic polymerization initiator by electromagnetic wave or particle beam. According to the present invention, it has been discovered that the initiation reaction is efficiently progressed to the propagation reaction by adding the compound that potentially or directly generates a carbocation to the polymerization system of the cationic ring-opening polymerizable compound, and thus the activation of polymerization is rendered.
    • 已经发现,通过向阳离子开环聚合性化合物的聚合体系中添加潜在地或直接生成碳阳离子的化合物,引发反应有效地进行到扩散反应中,从而进行聚合的活化。 即,本发明涉及一种阳离子性聚合性树脂组合物,其特征在于:(A)具有至少一个能够在一个分子链中具有阳离子开环聚合的官能团的化合物,(B)阳离子聚合引发剂和( C)通过电磁波或粒子束由(B)阳离子聚合引发剂产生的活性物质的作用产生碳阳离子的化合物。 根据本发明,已经发现,通过向阳离子开环聚合性化合物的聚合体系中添加潜在地或直接生成碳阳离子的化合物,引发反应有效地进行到扩散反应,因此活化 进行聚合。
    • 59. 发明申请
    • Semiconductor processing method for processing substrate to be processed and its apparatus
    • 用于处理待处理衬底的半导体加工方法及其装置
    • US20050272271A1
    • 2005-12-08
    • US10523974
    • 2004-02-04
    • Haruhiko FuruyaYuihiro MorozumiHiroaki IkegawaMakoto HirayamaYuichi Ito
    • Haruhiko FuruyaYuihiro MorozumiHiroaki IkegawaMakoto HirayamaYuichi Ito
    • C23C16/44H01L21/30H01L21/31H01L21/46H01L21/469
    • C23C16/44
    • A method for processing a target substrate (10) in a semiconductor processing apparatus (1) controls temperature of a first substrate (10) at a process temperature inside a process container (2), while supplying a process gas into the process container, thereby subjecting the first substrate to a semiconductor process, during which a by-product film is formed inside the process container. After the semiconductor process and unload of the first substrate (10) out of the process container (2), a reforming gas is supplied into the process container, thereby subjecting the by-product film to a reformation process, which is set to reduce thermal reflectivity of the by-product film. After the reformation process, temperature of a second substrate (10) is controlled at the process temperature inside the process container (2), while supplying the process gas into the process container, thereby subjecting the second substrate to the semiconductor process.
    • 在半导体处理装置(1)中处理目标衬底(10)的方法在处理容器(2)内的处理温度下控制第一衬底(10)的温度,同时将处理气体供应到处理容器中,从而 使第一基板经受半导体工艺,在该过程中,在处理容器内部形成副产物膜。 在半导体处理和将第一基板(10)从工艺容器(2)中卸载之后,将重整气体供给到处理容器中,从而使副产物膜进行重整过程,该过程设定为减少热 副产品薄膜的反射率。 在改造过程之后,在处理容器(2)内的处理温度下控制第二基板(10)的温度,同时将处理气体供应到处理容器中,从而使第二基板进行半导体处理。