专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明授权

US08355241B2 Laminated electronic component 有权
标题翻译：层压电子部件
公开(公告)号：US08355241B2
公开(公告)日：2013-01-15
申请号：US12943072
申请日：2010-11-10
申请人： Makoto Ogawa , Akihiro Motoki , Syunsuke Takeuchi , Kenichi Kawasaki
发明人： Makoto Ogawa , Akihiro Motoki , Syunsuke Takeuchi , Kenichi Kawasaki
IPC分类号： H01G4/228 , H01G4/06
CPC分类号： H01G4/2325 , H01G4/30
摘要： A laminated electronic component includes a component body including a plurality of laminated functional layers, a plurality of internal conductors provided inside the component body, and an external terminal electrode that is electrically connected to an internal conductor via an exposed portion of the internal conductor and that is defined by a direct plating film. An average grain diameter of metal grains defining the plating film is about 0.1 μm or less.
摘要翻译：层叠电子部件包括：具有多个层叠功能层的多个内部导体和设置在所述部件主体内侧的多个内部导体的部件体以及经由所述内部导体的露出部与内部导体电连接的外部端子电极，由直接电镀膜定义。限定镀膜的金属颗粒的平均粒径为约0.1μm以下。

52. 发明授权

US08334748B2 Method for manufacturing ceramic electronic component and ceramic electronic component 有权
标题翻译：制造陶瓷电子部件和陶瓷电子部件的方法
公开(公告)号：US08334748B2
公开(公告)日：2012-12-18
申请号：US13357671
申请日：2012-01-25
申请人： Syunsuke Takeuchi , Teruyo Katayama , Toshiyuki Iwanaga , Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki
发明人： Syunsuke Takeuchi , Teruyo Katayama , Toshiyuki Iwanaga , Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki
IPC分类号： H01F5/00
CPC分类号： H01C1/148 , H01C7/008 , H01C7/18 , H01G4/012 , H01G4/232 , H01G4/30
摘要： A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.
摘要翻译：陶瓷电子部件的制造方法包括以下步骤：制备包括多个第一内部电极和多个第二内部电极的陶瓷体，将所述陶瓷体加工成约102％〜约153％的内部电极曝光率，并对其进行电镀，在其上形成镀层。

53. 发明申请

US20080123249A1 LAMINATED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：层压电子元件及其制造方法
公开(公告)号：US20080123249A1
公开(公告)日：2008-05-29
申请号：US12030360
申请日：2008-02-13
申请人： Tatsuo Kunishi , Makoto Ogawa , Akihiro Motoki
发明人： Tatsuo Kunishi , Makoto Ogawa , Akihiro Motoki
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/2325 , Y10T29/435
摘要： A laminated body is prepared, in which at an end surface at which internal electrodes are exposed, the internal electrodes disposed adjacently are electrically isolated from each other, and a distance between the internal electrodes disposed adjacently is about 20 μm or less when measured along the thickness direction of an insulator layer, and a withdrawn-depth of the internal electrodes is about 1 μm or less when measured from the end surface. In a step of electroless plating, plating deposits formed at the end portions of the plurality of internal electrodes are increased in size so as to be connected to each other.
摘要翻译：制备层叠体，其中在内部电极暴露的端面处，相邻设置的内部电极彼此电隔离，并且沿着沿着所述内部电极的测量沿相邻设置的内部电极之间的距离为约20mum以下绝缘体层的厚度方向，从端面测定时，内部电极的取出深度为1μm以下。在化学镀的步骤中，形成在多个内部电极的端部的电镀沉积物的尺寸增加以彼此连接。

54. 发明授权

US09704649B2 Method for producing ceramic electronic component 有权
公开(公告)号：US09704649B2
公开(公告)日：2017-07-11
申请号：US13105926
申请日：2011-05-12
申请人： Junichi Saito , Toshihiko Kobayashi , Makoto Ogawa , Akihiro Motoki , Kenichi Kawasaki , Tatsuo Kunishi
发明人： Junichi Saito , Toshihiko Kobayashi , Makoto Ogawa , Akihiro Motoki , Kenichi Kawasaki , Tatsuo Kunishi
IPC分类号： B05D5/12 , H01G2/10 , H01G4/224 , B05D7/14 , B05D1/38
CPC分类号： H01G2/103 , B05D1/38 , B05D5/12 , B05D7/14 , H01G4/224
摘要： In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.

55. 发明授权

US09123469B2 Laminated ceramic electronic component and manufacturing method therefor 有权
标题翻译：层压陶瓷电子元件及其制造方法
公开(公告)号：US09123469B2
公开(公告)日：2015-09-01
申请号：US13050977
申请日：2011-03-18
申请人： Akihiro Motoki , Syunsuke Takeuchi , Makoto Ogawa , Seiichi Nishihara , Kenichi Kawasaki , Shuji Matsumoto
发明人： Akihiro Motoki , Syunsuke Takeuchi , Makoto Ogawa , Seiichi Nishihara , Kenichi Kawasaki , Shuji Matsumoto
IPC分类号： H01G4/005 , H01G4/228 , H01G4/12 , H01G4/30
CPC分类号： H01G4/248 , B32B18/00 , B32B37/18 , B32B2307/202 , B32B2315/02 , B32B2457/00 , C23C18/40 , H01G4/005 , H01G4/012 , H01G4/12 , H01G4/228 , H01G4/30
摘要： In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.
摘要翻译：在形成外部端子电极用镀层的方法中，例如通过对内部电极的两端露出的部件主体的端面进行镀铜，然后在约1000℃的温度下进行热处理 ℃以上，为了提高外部端子电极的粘合强度和耐湿性，可以使镀层部分熔融，降低镀层的接合强度。在其上形成有镀层的组件主体上，在约1000℃以上的温度下进行热处理的步骤中，平均温度从室温升高至约1000℃以上的温度设定为约100℃/分钟以上。该平均升温速率在镀层中保持中等的共晶状态，并确保镀层的充分的接合强度。

56. 发明授权

US09111690B2 Multilayer electronic component 有权
标题翻译：多层电子元件
公开(公告)号：US09111690B2
公开(公告)日：2015-08-18
申请号：US12543549
申请日：2009-08-19
申请人： Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga , Akihiro Yoshida , Takayuki Kayatani
发明人： Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga , Akihiro Yoshida , Takayuki Kayatani
IPC分类号： H01G4/30 , H01G4/232 , H01C1/148 , H01C7/18
CPC分类号： H01G4/2325 , H01C1/148 , H01C7/18 , H01G4/30 , Y10T29/435
摘要： A method is used to manufacture a multilayer electronic component including a multilayer composite including internal electrodes having ends that are exposed at a predetermined surface of the multilayer composite. In the method, the exposed ends of the internal electrodes are coated with a metal film primarily composed of at least one metal selected from the group consisting of Pd, Au, Pt and Ag and having a thickness of at least about 0.1 μm by immersing the multilayer composite in a liquid containing a metal ion or a metal complex. Then, a continuous plating layer is formed by depositing a plating metal on the ends of the internal electrodes exposed at the predetermined surface of the multilayer composite, and subsequently growing the deposits of the plating metal so as to be connected to each other. Thus, exposed ends of the internal electrodes are electrically connected to each other.
摘要翻译：一种方法用于制造包括多层复合材料的多层电子部件，所述多层复合材料包括具有在所述多层复合材料的预定表面露出的端部的内部电极。在该方法中，内部电极的露出端涂覆有主要由选自Pd，Au，Pt和Ag的至少一种金属的金属膜，并且具有至少约0.1μm的厚度，通过将在含有金属离子或金属络合物的液体中的多层复合材料。然后，通过在暴露于多层复合材料的预定表面的内部电极的端部上沉积电镀金属，随后使电镀金属的沉积物彼此连接而形成连续镀层。因此，内部电极的露出端彼此电连接。

57. 发明授权

US08587919B2 Laminate type ceramic electronic component and manufacturing method therefor 有权
标题翻译：层压陶瓷电子元件及其制造方法
公开(公告)号：US08587919B2
公开(公告)日：2013-11-19
申请号：US13208393
申请日：2011-08-12
申请人： Makoto Ogawa , Akihiro Motoki , Takehisa Sasabayashi , Takayuki Kayatani
发明人： Makoto Ogawa , Akihiro Motoki , Takehisa Sasabayashi , Takayuki Kayatani
IPC分类号： H01G4/30
CPC分类号： H01G4/005 , H01G4/30
摘要： In a laminate type ceramic electronic component, when an external electrode for a laminated ceramic capacitor is formed directly by plating onto a surface of a component main body, the film that is directly plated may have a low fixing strength with respect to the component main body. As the external electrode, a first plating layer composed of a Ni—P plating film with a P content rate of about 9 weight % or more is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no P is formed on the first plating layer. Preferably, the first plating layer is formed by electroless plating, whereas the second plating layer is formed by electrolytic plating.
摘要翻译：在层叠型陶瓷电子部件中，当通过电镀直接形成在组件主体的表面上的层叠陶瓷电容器的外部电极时，直接镀膜的膜相对于部件主体可具有低的固定强度。作为外部电极，首先形成由P含量为约9重量％以上的Ni-P镀膜构成的第一镀层，以使各个内部电极的露出端作为起点沉积的电镀沉积为在组件主体的至少一个端面上生长。然后，在第一镀层上形成由基本上不含P的Ni镀膜构成的第二镀层。优选地，通过无电镀形成第一镀层，而通过电解电镀形成第二镀层。

58. 发明授权

US07589951B2 Laminated electronic component and method for manufacturing the same 有权
标题翻译：层压电子部件及其制造方法
公开(公告)号：US07589951B2
公开(公告)日：2009-09-15
申请号：US12030360
申请日：2008-02-13
申请人： Tatsuo Kunishi , Makoto Ogawa , Akihiro Motoki
发明人： Tatsuo Kunishi , Makoto Ogawa , Akihiro Motoki
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/2325 , Y10T29/435
摘要： A laminated body is prepared, in which at an end surface at which internal electrodes are exposed, the internal electrodes disposed adjacently are electrically isolated from each other, and a distance between the internal electrodes disposed adjacently is about 20 μm or less when measured along the thickness direction of an insulator layer, and a withdrawn-depth of the internal electrodes is about 1 μm or less when measured from the end surface. In a step of electroless plating, plating deposits formed at the end portions of the plurality of internal electrodes are increased in size so as to be connected to each other.
摘要翻译：制备层叠体，其中在内部电极暴露的端面处，相邻设置的内部电极彼此电隔离，并且沿着沿着所述内部电极的测量沿相邻设置的内部电极之间的距离为约20mum以下绝缘体层的厚度方向，从端面测定时，内部电极的取出深度为1μm以下。在化学镀的步骤中，形成在多个内部电极的端部的电镀沉积物的尺寸增加以彼此连接。

59. 发明授权

US08410886B2 Multilayer coil component 有权
标题翻译：多层线圈组件
公开(公告)号：US08410886B2
公开(公告)日：2013-04-02
申请号：US13357582
申请日：2012-01-24
申请人： Mitsuru Odahara , Akihiro Motoki , Akihiro Ono
发明人： Mitsuru Odahara , Akihiro Motoki , Akihiro Ono
IPC分类号： H01F5/00
CPC分类号： H01F41/04 , H01F17/0013 , H01F17/04 , H01F27/2804 , H01F41/046 , H01F2027/2809
摘要： A multilayer coil component is provided to have high reliability and in which internal stress arising from the difference in firing shrinkage behavior and/or thermal expansion coefficient between ferrite layers and internal conductor layers is alleviated without forming conventional voids between the ferrite layers and the internal conductor layers. A method of manufacturing a multilayer coil includes a step of isolating interfaces between internal conductors and surrounding ferrite by allowing a complexing agent solution to reach interfaces between the internal conductors and the surrounding ferrite through side gap portions from side surfaces of a ferrite element including a helical coil. The complexing agent solution contains at least one selected from the group consisting of an aminocarboxylic acid, a salt of the aminocarboxylic acid, an oxycarboxylic acid, a salt of the oxycarboxylic acid, an amine, phosphoric acid, a salt of phosphoric acid, and a lactone compound.
摘要翻译：提供多层线圈部件以具有高可靠性，并且在铁氧体层和内部导体之间不形成常规的空隙而减轻铁氧体层和内部导体层之间的烧制收缩性能和/或热膨胀系数差异产生的内部应力层。制造多层线圈的方法包括通过使络合剂溶液通过包括螺旋形的铁氧体元件的侧表面的侧面间隙部分的内部导体和周围的铁氧体之间的界面来分离内部导体和周围的铁氧体之间的界面的步骤线圈络合剂溶液含有至少一种选自氨基羧酸，氨基羧酸的盐，羟基羧酸，羟基羧酸的盐，胺，磷酸，磷酸的盐和内酯化合物。

60. 发明授权

US07774591B2 Data processing device and data processing method 有权
标题翻译：数据处理装置和数据处理方法
公开(公告)号：US07774591B2
公开(公告)日：2010-08-10
申请号：US11620419
申请日：2007-01-05
申请人： Satoshi Kamiya , Hiroshi Ueno , Akihiro Motoki , Takeo Hayashi
发明人： Satoshi Kamiya , Hiroshi Ueno , Akihiro Motoki , Takeo Hayashi
IPC分类号： G06F1/24
CPC分类号： G06F15/7867
摘要： A data processing device includes a memory, a processing unit, a logic element, a first database and a management unit. The memory stores a plurality of software modules which processes input data. The processing unit enables to execute the plurality of software module. The logic element enables to configure a plurality of hardware modules, which can perform processings equivalent to those performed by the plurality of software module, using a dynamic reconfiguration. The first database stores configuration information indicating a configuration of the plurality of hardware modules when the plurality of hardware modules is set to the logic element. The management unit determines a first software module to be set to the logic element as a hardware module in the plurality of software modules on the basis of a predetermined condition with respect to a processing of the input data, and sets a first hardware module corresponding to the first software module to the logic element with reference to the first database.
摘要翻译：数据处理装置包括存储器，处理单元，逻辑元件，第一数据库和管理单元。存储器存储处理输入数据的多个软件模块。处理单元能够执行多个软件模块。逻辑元件使得能够配置多个硬件模块，其可以使用动态重新配置来执行与由多个软件模块执行的处理相当的处理。第一数据库存储当多个硬件模块被设置为逻辑元件时指示多个硬件模块的配置的配置信息。所述管理单元根据关于所述输入数据的处理的预定条件，将要设置为所述逻辑元件的第一软件模块确定为所述多个软件模块中的硬件模块，并且设置与所述逻辑单元对应的第一硬件模块参考第一个数据库的逻辑元件的第一个软件模块。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式